Abstract: In a power converter, each of a positive busbar and a negative busbar includes a first current path that has a first thermal resistance and is a current flow path between a power-source connection terminal and at least one terminal connection portion, and a second current path that has a second thermal resistance and is a current flow path between the power-source connection terminal and an element connection portion. The first thermal resistance of the first current path of at least one of the positive busbar and the negative busbar is lower than the second thermal resistance of the second current path of the at least one of the positive busbar and the negative busbar.

Abstract: A power converter includes an inverter, a converter, an electrical-machine busbar, an electrical-machine sensor, an electrical-machine-sensor housing, a converter, a converter busbar, a converter-sensor housing. The inverter supplies a three-phase alternating current to a rotating electrical machine. The converter converts a voltage between a direct current power supply and the inverter. The electrical-machine busbar passes a current between the inverter and the rotating electrical machine. The electrical-machine sensor detects the current flowing through the electrical-machine busbar based on a magnetic field. The electrical-machine-sensor housing accommodates the electrical-machine sensor and the electrical-machine busbar together. The converter sensor detects the current flowing through the converter based on a magnetic field. The converter-sensor housing is disposed apart from the electrical-machine-sensor housing, and accommodates the converter sensor and the converter busbar together.

Abstract: First switches include first electrodes, which are mutually connected with each other via a first internal bus bar, and second electrodes, which are mutually connected with each other via a second internal bus bar. A first resin member encapsulates the first switches and the first and second internal bus bars. Second switches include third electrodes, which are mutually connected with each other via a third internal bus bar, and fourth electrodes, which are mutually connected with each other via a fourth internal bus bar. A second resin member that encapsulates the second switches and the third and fourth internal bus bars. The second module is arranged alongside with the first module. The second internal bus bar and the third internal bus bar are partially exposed from the first resin member and the second resin member, respectively, and are directly joined with each other.

Abstract: A first module includes a first switch having a first electrode and a second electrode; a second switch having a third electrode and a fourth electrode; a second internal bus bar connecting the second electrode with the third electrode; and a first resin member encapsulating those components. A second module with includes a third switch having a fifth electrode and a sixth electrode; a fourth switch having a seventh electrode and an eighth electrode; a fifth internal bus bar connecting the sixth electrode with the seventh electrode; and a second resin member encapsulating those components. At least one of a first terminal of the second internal bus bar exposed from the first resin member and a second terminal of the fifth internal bus bar exposed from the second resin member extends toward the other and are directly joined with each other.

Abstract: A first semiconductor component having a first semiconductor chip and a first heat sink and a second semiconductor component having a second semiconductor chip and a second heat sink are disposed in a cooler. The first semiconductor chip is smaller in size than the second semiconductor chip. A first heat conduction surface between the first semiconductor chip and the first heat sink is smaller in an area than a second heat conduction surface between the second semiconductor chip and the second heat sink. A first region of the cooler where the first semiconductor component is disposed has higher cooling performance than a second region of the cooler where the second semiconductor component is disposed.

Abstract: A power converter includes a control circuit executing feedback control of a first inverter based on a detected value of a first sensor adapted to a first rotating electrical machine. The first sensor detects a current of a first busbar adapted to the first rotating electrical machine. The first busbar connects the first inverter and the first rotating electrical machine. A second busbar adapted to a second rotating electrical machine connects a second inverter and the second rotating electrical machine. The second busbar is arranged to be apart from the first sensor interposed with a converter busbar between the second busbar and the first sensor. A current of the converter flows through the converter busbar.

Abstract: A power converter includes an inverter, a converter, an electrical-machine busbar, an electrical-machine sensor, an electrical-machine-sensor housing, a converter, a converter busbar, a converter-sensor housing. The inverter supplies a three-phase alternating current to a rotating electrical machine. The converter converts a voltage between a direct current power supply and the inverter. The electrical-machine busbar passes a current between the inverter and the rotating electrical machine. The electrical-machine sensor detects the current flowing through the electrical-machine busbar based on a magnetic field. The electrical-machine-sensor housing accommodates the electrical-machine sensor and the electrical-machine busbar together. The converter sensor detects the current flowing through the converter based on a magnetic field. The converter-sensor housing is disposed apart from the electrical-machine-sensor housing, and accommodates the converter sensor and the converter busbar together.

Abstract: A power converter includes: at least one pair of first and second semiconductor devices including multiple first and second semiconductor chips, having first and second switching elements providing upper and lower arms, and multiple first and second main terminals having at least one of multiple first and second high potential terminals and multiple first and second low potential terminals; and a bridging member providing an upper and lower coupling portion, together with the first low and second high potential terminals. The first and second semiconductor chips are arranged in line symmetry with respect to first and second axes and in line symmetry with the second axis as a symmetry axis to differentiate the arrangement of the second low potential terminal with respect to the second high potential terminal from the arrangement of the first low potential terminal with respect to the first high potential terminal.

Abstract: A power conversion apparatus has a positive electrode bus bar and a negative electrode bus bar. The power conversion apparatus has a first semiconductor module incorporating an upper-arm switching element and including a positive electrode terminal and a second semiconductor module incorporating a lower-arm switching element and including a negative electrode terminal. The first semiconductor module and the second semiconductor module are placed such that the positive electrode terminal and the negative electrode terminal face each other in a direction orthogonal to a protruding direction. The positive electrode bus bar and the negative electrode bus bar respectively have coexisting parts placed together between the positive electrode terminal and the negative electrode terminal as seen in the protruding direction of power terminals. The coexisting parts are at least partially placed in a space between the positive electrode terminal and the negative electrode terminal.

Abstract: First switches include first electrodes, which are mutually connected with each other via a first internal bus bar, and second electrodes, which are mutually connected with each other via a second internal bus bar. A first resin member encapsulates the first switches and the first and second internal bus bars. Second switches include third electrodes, which are mutually connected with each other via a third internal bus bar, and fourth electrodes, which are mutually connected with each other via a fourth internal bus bar. A second resin member that encapsulates the second switches and the third and fourth internal bus bars. The second module is arranged alongside with the first module. The second internal bus bar and the third internal bus bar are partially exposed from the first resin member and the second resin member, respectively, and are directly joined with each other.

Abstract: A first module includes a first switch having a first electrode and a second electrode; a second switch having a third electrode and a fourth electrode; a second internal bus bar connecting the second electrode with the third electrode; and a first resin member encapsulating those components. A second module with includes a third switch having a fifth electrode and a sixth electrode; a fourth switch having a seventh electrode and an eighth electrode; a fifth internal bus bar connecting the sixth electrode with the seventh electrode; and a second resin member encapsulating those components. At least one of a first terminal of the second internal bus bar exposed from the first resin member and a second terminal of the fifth internal bus bar exposed from the second resin member extends toward the other and are directly joined with each other.

Abstract: In a power converter, each of a positive busbar and a negative busbar includes a first current path that has a first thermal resistance and is a current flow path between a power-source connection terminal and at least one terminal connection portion, and a second current path that has a second thermal resistance and is a current flow path between the power-source connection terminal and an element connection portion. The first thermal resistance of the first current path of at least one of the positive busbar and the negative busbar is lower than the second thermal resistance of the second current path of the at least one of the positive busbar and the negative busbar.

Abstract: A power conversion device provided with a switching circuit unit including a plurality of upper-arm switching elements connected to positive electrode wiring and a plurality of lower-arm switching elements connected to negative electrode wiring. The power conversion device includes a first semiconductor module incorporating a plurality of the upper-arm switching elements connected together in parallel, a second semiconductor module incorporating a plurality of the lower-arm switching elements connected together in parallel, and a third semiconductor module incorporating the upper-arm switching elements connected together in series and the lower-arm switching elements connected together in series.

Abstract: A power conversion device, mounted on a motor vehicle, has a battery, a power converter, a reactor and a control unit. The power conversion device boosts a battery voltage of the battery, and supplies a boosted voltage to a motor generator mounted on a motor vehicle. The power conversion device transmits electric power generated by the motor generator and supplies the generated electric power to the battery through the power converter. The power converter has an upper arm and a lower arm. The upper arm has upper arm side switching elements. The lower arm has lower arm side switching elements which are directly connected to the respective upper arm side switching elements. At least one of the upper arm side switching elements is composed of a MOS FET and at least one of the lower arm side switching elements is composed of an IGBT.

Abstract: In a power conversion device, each of semiconductor modules of a layered body includes a body portion incorporating a plurality of switching elements and a plurality of power terminals protruding therefrom. The semiconductor modules include upper-arm switching elements and lower-arm switching element that are alternately layered in a layering direction of the layered body. A capacitor is disposed on one side of the layered body and a current sensor is disposed on an opposite side of the layered body, in an orthogonal direction orthogonal to both a protruding direction of the power terminals and the layering direction. Each of the semiconductor modules includes, as the power terminals, two collector terminals connected to a collector electrode of the switching element and one emitter terminal connected to an emitter electrode of the switching element, and the emitter terminal is disposed between the two collector terminals in the orthogonal direction.

Abstract: The semiconductor device is provided with a plurality of switching elements connected in parallel to each other, and a plurality of recirculation element connected in parallel to the aforementioned plurality of switching elements. An emitter electrode serves as a reference potential of the aforementioned plurality of switching elements and an anode electrode serves as a reference potential of the aforementioned plurality of recirculation elements are electrically connected by the same plate-like member consisting of a conductive material. The aforementioned switching elements and the aforementioned recirculation elements which are connected in parallel on the lowest potential side are constituted so that the distance from the emitter terminal connected to the aforementioned emitter electrode to the aforementioned recirculation element becomes no greater than the distance from the aforementioned emitter terminal.

Abstract: In a power converter, a control circuit has a speed adjustment resistor that limits a control current to adjust a switching speed of each of first and second switching elements. The speed adjustment resistor has a resistance that varies depending on a voltage at the control electrode of each of the first and second switching elements. A feedback route connects between the control electrode of the first switching element and the control electrode of the second switching element. The feedback route has a resistance that is set to be lower than a value of the resistance of the speed adjustment resistor during a predetermined Miller period of each of the first and second switching elements.

Abstract: A power converter includes: at least one pair of first and second semiconductor devices including multiple first and second semiconductor chips, having first and second switching elements providing upper and lower arms, and multiple first and second main terminals having at least one of multiple first and second high potential terminals and multiple first and second low potential terminals; and a bridging member providing an upper and lower coupling portion, together with the first low and second high potential terminals. The first and second semiconductor chips are arranged in line symmetry with respect to first and second axes and in line symmetry with the second axis as a symmetry axis to differentiate the arrangement of the second low potential terminal with respect to the second high potential terminal from the arrangement of the first low potential terminal with respect to the first high potential terminal.

Abstract: In a power conversion device, each of semiconductor modules of a layered body includes a body portion incorporating a plurality of switching elements and a plurality of power terminals protruding therefrom. The semiconductor modules include upper-arm switching elements and lower-arm switching element that are alternately layered in a layering direction of the layered body. A capacitor is disposed on one side of the layered body and a current sensor is disposed on an opposite side of the layered body, in an orthogonal direction orthogonal to both a protruding direction of the power terminals and the layering direction. Each of the semiconductor modules includes, as the power terminals, two collector terminals connected to a collector electrode of the switching element and one emitter terminal connected to an emitter electrode of the switching element, and the emitter terminal is disposed between the two collector terminals in the orthogonal direction.

Abstract: A power conversion apparatus has a positive electrode bus bar and a negative electrode bus bar. The power conversion apparatus has a first semiconductor module incorporating an upper-arm switching element and including a positive electrode terminal and a second semiconductor module incorporating a lower-arm switching element and including a negative electrode terminal. The first semiconductor module and the second semiconductor module are placed such that the positive electrode terminal and the negative electrode terminal face each other in a direction orthogonal to a protruding direction. The positive electrode bus bar and the negative electrode bus bar respectively have coexisting parts placed together between the positive electrode terminal and the negative electrode terminal as seen in the protruding direction of power terminals. The coexisting parts are at least partially placed in a space between the positive electrode terminal and the negative electrode terminal.