Patents by Inventor Yu-Wen Liu

Yu-Wen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081730
    Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.
    Type: Application
    Filed: June 26, 2024
    Publication date: March 6, 2025
    Inventors: Andrew Lin, Alper Ozgurluk, Chao Liang Chien, Cheuk Chi Lo, Chia-Yu Chen, Chien-Chung Wang, Chih Pang Chang, Chih-Hung Yu, Chih-Wei Chang, Chin Wei Hsu, ChinWei Hu, Chun-Kai Tzeng, Chun-Ming Tang, Chun-Yao Huang, Hung-Che Ting, Jung Yen Huang, Lungpao Hsin, Shih Chang Chang, Tien-Pei Chou, Wen Sheng Lo, Yu-Wen Liu, Yung Da Lai
  • Patent number: 12096657
    Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: September 17, 2024
    Assignee: Apple Inc.
    Inventors: Jung Yen Huang, Shinya Ono, Chin-Wei Lin, Akira Matsudaira, Cheng Min Hu, Chih Pang Chang, Ching-Sang Chuang, Gihoon Choo, Jiun-Jye Chang, Po-Chun Yeh, Shih Chang Chang, Yu-Wen Liu, Zino Lee
  • Patent number: 11818912
    Abstract: A display may have organic light-emitting diode pixels formed from thin-film circuitry. The thin-film circuitry may be formed in thin-film transistor (TFT) layers and the organic light-emitting diodes may include anodes and cathodes and an organic emissive layer formed over the TFT layers between the anodes and cathodes. The organic emissive layer may be formed via chemical evaporation techniques. The display may include moisture blocking structures such as organic emissive layer disconnecting structures that introduce one or more gaps in the organic emissive layer during evaporation so that any potential moisture permeating path from the display panel edge to the active area of the display is completely terminated.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: November 14, 2023
    Assignee: Apple Inc.
    Inventors: Tsung-Ting Tsai, Abbas Jamshidi Roudbari, Chuan-Sheng Wei, HanChi Ting, Jae Won Choi, Jianhong Lin, Nai-Chih Kao, Shih Chang Chang, Shin-Hung Yeh, Takahide Ishii, Ting-Kuo Chang, Yu Hung Chen, Yu-Wen Liu, Yu-Chuan Pai, Andrew Lin
  • Publication number: 20230092986
    Abstract: An electronic device may include a display and an optical sensor formed underneath the display. A pixel removal region on the display may at least partially overlap with the sensor. The pixel removal region may include a plurality of non-pixel regions each of which is devoid of thin-film transistors. The plurality of non-pixel regions is configured to increase the transmittance of light through the display to the sensor. In addition to removing thin-film transistors in the pixel removal region, additional layers in the display stack-up may be removed. In particular, a cathode layer, polyimide layer, and/or substrate in the display stack-up may be patterned to have an opening in the pixel removal region. A polarizer may be bleached in the pixel removal region for additional transmittance gains. The cathode layer may be removed using laser ablation with a spot laser or blanket illumination.
    Type: Application
    Filed: February 2, 2021
    Publication date: March 23, 2023
    Inventors: Warren S. Rieutort-Louis, Meng-Huan Ho, Abbas Jamshidi Roudbari, Chih Jen Yang, Chin Wei Hsu, Jae Won Choi, Jean-Pierre S. Guillou, Ming Xu, Rui Liu, Yi Qiao, Yu-Wen Liu, Yuchi Che, Yue Cui
  • Patent number: 11564908
    Abstract: Provided is a long-acting method for preventing or treating glucose metabolism disorders that includes administering a beta-lactam compound or a pharmaceutically acceptable salt thereof to a subject in need thereof. The method for preventing or treating glucose metabolism disorders has a long-acting effect that lasts more than two days even after medication has been stopped.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: January 31, 2023
    Assignee: GLYCOLYSIS BIOMED CO., LTD.
    Inventors: Feng-Ling Lee, Lung-Jr Lin, Jyh-Shing Hsu, Cheng-Hsien Hsu, Yen-Chun Huang, Ya-Chien Huang, Chun-Tsung Lo, Hui-Fang Liao, Yu-Wen Liu, Yu-Chi Kao
  • Patent number: 11523532
    Abstract: An electronic device casing includes a body, a movable apparatus, and a handle structure. The body comprises a first stopping surface and a second stopping surface disposed opposite to each other. The movable apparatus is adapted to be detachably assembled in the body. The handle structure is pivotally disposed to the movable apparatus. The handle structure comprises a first arm corresponding to the first stopping surface and a second arm corresponding to the second stopping surface. The movable apparatus is adapted to move between a removed position and an assembled position by rotating the handle structure between an upper pulled position and a lower pressed position.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: December 6, 2022
    Assignee: PEGATRON CORPORATION
    Inventor: Yu-Wen Liu
  • Patent number: 11419852
    Abstract: Provided is a long-acting method for preventing or treating glucose metabolism disorders that includes administering a beta-lactam compound or a pharmaceutically acceptable salt thereof to a subject in need thereof. The method for preventing or treating glucose metabolism disorders has a long-acting effect that lasts more than two days even after medication has been stopped.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: August 23, 2022
    Assignee: GLYCOLYSIS BIOMED CO., LTD.
    Inventors: Feng-Ling Lee, Lung-Jr Lin, Jyh-Shing Hsu, Cheng-Hsien Hsu, Yen-Chun Huang, Ya-Chien Huang, Chun-Tsung Lo, Hui-Fang Liao, Yu-Wen Liu, Yu-Chi Kao
  • Publication number: 20220181418
    Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated semiconducting oxide transistors. The semiconducting oxide transistors may exhibit different device characteristics. Some of the semiconducting oxide transistors may be formed using a first oxide layer formed from a first semiconducting oxide material using first processing steps, whereas other semiconducting oxide transistors are formed using a second oxide layer formed from a second semiconducting oxide material using second processing steps different than the first processing steps. The display may include three or more different semiconducting oxide layers formed during different processing steps.
    Type: Application
    Filed: October 18, 2021
    Publication date: June 9, 2022
    Inventors: Jung Yen Huang, Shinya Ono, Chin-Wei Lin, Akira Matsudaira, Cheng Min Hu, Chih Pang Chang, Ching-Sang Chuang, Gihoon Choo, Jiun-Jye Chang, Po-Chun Yeh, Shih Chang Chang, Yu-Wen Liu, Zino Lee
  • Patent number: 11330728
    Abstract: A handle extension structure includes a connection assembly and an operation assembly. The connection assembly has a first end and a second end opposite to each other. The operation assembly is slidably disposed at the connection assembly. The operation assembly includes an extension element and a grip element. The extension element has a first end portion and a second end portion opposite to each other. The first end portion is slidably disposed between the first end and the second end. The grip element is pivoted to the second end portion. An electronic device casing includes a body, a movable apparatus, and the handle extension structure. The handle extension structure is pivoted to the movable apparatus through the connection assembly.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: May 10, 2022
    Assignee: PEGATRON CORPORATION
    Inventors: Long-Sing Ye, Yao-Hsien Huang, Yu-Wen Liu
  • Publication number: 20210153371
    Abstract: An electronic device casing includes a body, a movable apparatus, and a handle structure. The body comprises a first stopping surface and a second stopping surface disposed opposite to each other. The movable apparatus is adapted to be detachably assembled in the body. The handle structure is pivotally disposed to the movable apparatus. The handle structure comprises a first arm corresponding to the first stopping surface and a second arm corresponding to the second stopping surface. The movable apparatus is adapted to move between a removed position and an assembled position by rotating the handle structure between an upper pulled position and a lower pressed position.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 20, 2021
    Applicant: PEGATRON CORPORATION
    Inventor: Yu-Wen Liu
  • Publication number: 20210153368
    Abstract: A handle extension structure includes a connection assembly and an operation assembly. The connection assembly has a first end and a second end opposite to each other. The operation assembly is slidably disposed at the connection assembly. The operation assembly includes an extension element and a grip element. The extension element has a first end portion and a second end portion opposite to each other. The first end portion is slidably disposed between the first end and the second end. The grip element is pivoted to the second end portion. An electronic device casing includes a body, a movable apparatus, and the handle extension structure. The handle extension structure is pivoted to the movable apparatus through the connection assembly.
    Type: Application
    Filed: November 3, 2020
    Publication date: May 20, 2021
    Applicant: PEGATRON CORPORATION
    Inventors: Long-Sing Ye, Yao-Hsien Huang, Yu-Wen Liu
  • Publication number: 20200230105
    Abstract: Provided is a long-acting method for preventing or treating glucose metabolism disorders that includes administering a beta-lactam compound or a pharmaceutically acceptable salt thereof to a subject in need thereof. The method for preventing or treating glucose metabolism disorders has a long-acting effect that lasts more than two days even after medication has been stopped.
    Type: Application
    Filed: January 21, 2020
    Publication date: July 23, 2020
    Inventors: Feng-Ling Lee, Lung-Jr Lin, Jyh-Shing Hsu, Cheng-Hsien Hsu, Yen-Chun Huang, Ya-Chien Huang, Chun-Tsung Lo, Hui-Fang Liao, Yu-Wen Liu, Yu-Chi Kao
  • Publication number: 20200230149
    Abstract: Provided is a long-acting method for preventing or treating glucose metabolism disorders that includes administering a beta-lactam compound or a pharmaceutically acceptable salt thereof to a subject in need thereof. The method for preventing or treating glucose metabolism disorders has a long-acting effect that lasts more than two days even after medication has been stopped.
    Type: Application
    Filed: January 21, 2020
    Publication date: July 23, 2020
    Inventors: Feng-Ling Lee, Lung-Jr Lin, Jyh-Shing Hsu, Cheng-Hsien Hsu, Yen-Chun Huang, Ya-Chien Huang, Chun-Tsung Lo, Hui-Fang Liao, Yu-Wen Liu, Yu-Chi Kao
  • Publication number: 20200220098
    Abstract: A display may have organic light-emitting diode pixels formed from thin-film circuitry. The thin-film circuitry may be formed in thin-film transistor (TFT) layers and the organic light-emitting diodes may include anodes and cathodes and an organic emissive layer formed over the TFT layers between the anodes and cathodes. The organic emissive layer may be formed via chemical evaporation techniques. The display may include moisture blocking structures such as organic emissive layer disconnecting structures that introduce one or more gaps in the organic emissive layer during evaporation so that any potential moisture permeating path from the display panel edge to the active area of the display is completely terminated.
    Type: Application
    Filed: October 31, 2019
    Publication date: July 9, 2020
    Inventors: Tsung-Ting Tsai, Abbas Jamshidi Roudbari, Chuan-Sheng Wei, HanChi Ting, Jae Won Choi, Jianhong Lin, Nai-Chih Kao, Shih Chang Chang, Shin-Hung Yeh, Takahide Ishii, Ting-Kuo Chang, Yu Hung Chen, Yu-Wen Liu, Yu-Chuan Pai, Andrew Lin
  • Patent number: 10224238
    Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: March 5, 2019
    Assignee: Apple Inc.
    Inventors: Chang Ming Lu, Chia-Yu Chen, Chih Pang Chang, Ching-Sang Chuang, Hung-Che Ting, Jung Yen Huang, Sheng Hui Shen, Shih Chang Chang, Tsung-Hsiang Shih, Yu-Wen Liu, Yu Hung Chen, Kai-Chieh Wu, Lun Tsai, Takahide Ishii, Chung-Wang Lee, Hsing-Chuan Wang, Chin Wei Hsu, Fu-Yu Teng
  • Patent number: 9859235
    Abstract: A system and method for forming an underbump metallization (UBM) is presented. A preferred embodiment includes a raised UBM which extends through a passivation layer so as to make contact with a contact pad while retaining enough of the passivation layer between the contact pad and the UBM to adequately handle the peeling and shear stress that results from CTE mismatch and subsequent thermal processing. The UBM contact is preferably formed in either an octagonal ring shape or an array of contacts.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: January 2, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Wen Liu, Hao-Yi Tsai, Hsien-Wei Chen, Shin-Puu Jeng, Ying-Ju Chen, Shang-Yun Hou, Pei-Haw Tsao, Chen-Hua Yu
  • Publication number: 20170294499
    Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.
    Type: Application
    Filed: September 16, 2016
    Publication date: October 12, 2017
    Inventors: Chang Ming Lu, Chia-Yu Chen, Chih Pang Chang, Ching-Sang Chuang, Hung-Che Ting, Jung Yen Huang, Sheng Hui Shen, Shih Chang Chang, Tsung-Hsiang Shih, Yu-Wen Liu, Yu Hung Chen, Kai-Chieh Wu, Lun Tsai, Takahide Ishii, Chung-Wang Lee, Hsing-Chuan Wang, Chin Wei Hsu, Fu-Yu Teng
  • Patent number: 9646954
    Abstract: An integrated circuit system comprising a first integrated and at least one of a second integrated circuit, interposer or printed circuit board. The first integrated circuit further comprising a wiring stack, bond pads electrically connected to the wiring stack, and bump balls formed on the bond pads. First portions of the wiring stack and the bond pads form a functional circuit, and second portions of the wiring stack and the bond pads form a test circuit. A portion of the bump balls comprising dummy bump balls. The dummy bump balls electrically connected to the second portions of the wiring stack and the bond pads. The at least one of the second integrated circuit, interposer or printed circuit board forming a portion of the test circuit.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: May 9, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Wei Liang, Yu-Wen Liu, Hsien-Wei Chen
  • Patent number: 9601446
    Abstract: A method of forming a bond pad structure is provided. The method includes forming a first conductive layer over a substrate and depositing a first dielectric layer over the first conductive layer. The first dielectric layer is patterned to form a contiguous planar path substantially parallel to a top surface of the substrate. Patterning the first dielectric layer includes defining a dielectric region of the first dielectric layer surrounded by a portion of the contiguous planar path, and forming a first via hole in the dielectric region. The contiguous planar path and the via hole are filled with a conductive material. The conductive material in the contiguous planar path forms a second conductive layer, and the contiguous planar path extends from a first lateral side wall of the second conductive layer to a second lateral sidewall of the second conductive layer. A bond pad is formed over the second conductive layer, and the bond pad is electrically connected to the second conductive layer.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: March 21, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shin-Puu Jeng, Hsien-Wei Chen, Hao-Yi Tsai, Yu-Wen Liu
  • Patent number: 9536847
    Abstract: An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: January 3, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiu-Ping Wei, Hsien-Wei Chen, Hao-Yi Tsai, Ying-Ju Chen, Yu-Wen Liu