Patents by Inventor Yuya Matsuoka

Yuya Matsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190212262
    Abstract: This automatic analysis apparatus is provided with: an analysis port comprising a reaction container holding part that holds a reaction container storing the liquid mixture of a sample and a reagent, a light source that emits light to the liquid mixture stored in the reaction container held by the reaction container holding part, and a detector that detects light generated when the light from the light source is emitted to the liquid mixture; and a control unit that controls the analysis port, and analyzes the sample on the basis of information about the detected light.
    Type: Application
    Filed: August 4, 2017
    Publication date: July 11, 2019
    Inventors: Yuya MATSUOKA, Sakuichiro ADACHI, Akihisa MAKINO
  • Publication number: 20190176257
    Abstract: A method of controlling arc welding with a consumable electrode includes repeating the following periods in sequence: a short-circuit welding period to perform short-circuit arc welding; a pulse welding period to perform pulse welding; and a cooling period in which the welding current output is zero.
    Type: Application
    Filed: August 31, 2017
    Publication date: June 13, 2019
    Inventors: YUYA FURUYAMA, SHIGEKI YONEMORI, ATSUHIRO KAWAMOTO, JUNJI FUJIWARA, NORIYUKI MATSUOKA
  • Publication number: 20180350641
    Abstract: Disclosed herein is a protective tape attaching method for attaching a protective tape to a wafer, the protective tape having a size corresponding to the size of the wafer. The protective tape attaching method includes: a bending step of bending a release paper to which an adhesive layer of the protective tape is previously attached, stretching the release paper to peel a front end portion of the protective tape from the release paper, and attaching the front end portion of the protective tape to the wafer; and an attaching step of pressing the other side of the protective tape opposite to the adhesive layer by using a pressure roller to thereby bring the adhesive layer of the protective tape into close contact with the wafer after performing the bending step.
    Type: Application
    Filed: May 24, 2018
    Publication date: December 6, 2018
    Inventors: Masaru Nakamura, Yuya Matsuoka
  • Publication number: 20180275155
    Abstract: An automated analyzer has a reaction disk on which a plurality of reaction vessels capable of holding sample and reagent mixtures can be placed, a first cover for covering at least a portion of the area above the reaction disk, a second cover that can be opened and closed independently from the first cover, at least one sensor for monitoring the opening and closing of the first cover, and a control unit for monitoring a signal from the sensor and carrying out control such that if the first cover has not been opened and closed during the period until a new analysis operation is started, a pre-analysis cleaning operation, blank measurement operation, or both, are skipped.
    Type: Application
    Filed: December 2, 2016
    Publication date: September 27, 2018
    Inventors: Yuya MATSUOKA, Akihisa MAKINO, Hajime YAMAZAKI
  • Patent number: 9685377
    Abstract: A wafer is divided into individual device chips along a plurality of scheduled division lines. A protective film is formed by coating liquid-state resin, which is hardened by irradiation of ultraviolet rays thereon, on the front face of the wafer. The protective film is hardened by irradiating ultraviolet rays upon the protective film. A protective tape is adhered on a front face of the hardened protective film. A modified layer is formed by irradiating a laser beam of a wavelength having a transparency to the wafer along the scheduled division lines with a focal point thereof positioned in the inside of the wafer. A back face of the wafer is ground while grinding water is supplied to thin the wafer to a given thickness and divide the wafer into the individual device chips along the scheduled division lines using the modified layer as a start point of the break.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: June 20, 2017
    Assignee: DISCO CORPORATION
    Inventors: Masaru Nakamura, Yuya Matsuoka
  • Publication number: 20160172312
    Abstract: A wafer is divided into individual device chips along a plurality of scheduled division lines. A protective film is formed by coating liquid-state resin, which is hardened by irradiation of ultraviolet rays thereon, on the front face of the wafer. The protective film is hardened by irradiating ultraviolet rays upon the protective film. A protective tape is adhered on a front face of the hardened protective film. A modified layer is formed by irradiating a laser beam of a wavelength having a transparency to the wafer along the scheduled division lines with a focal point thereof positioned in the inside of the wafer. A back face of the wafer is ground while grinding water is supplied to thin the wafer to a given thickness and divide the wafer into the individual device chips along the scheduled division lines using the modified layer as a start point of the break.
    Type: Application
    Filed: December 3, 2015
    Publication date: June 16, 2016
    Inventors: Masaru Nakamura, Yuya Matsuoka