Abstract: A broadband light source device in a biochemical analyzing device, and facilitates maintenance thereof, including an LED substrate that is provided with an LED chip generating a light beam having a first wavelength band and including a fluorescent substance in the light beam having a first wavelength band and that is provided with an LED chip generating a light beam having a second wavelength band, in which the fluorescent substance includes at least alumina and at least one of Fe, Cr, Bi, Tl, Ce, Tb, Eu, and Mn and is produced by calcining a raw material that contains sodium at 6.1 to 15.9 wt. % in the whole raw material. The broadband light source device further includes an optical system including a light pipe that color-mixes the light beam passing through the fluorescent substance of the LED chip and the light beam emitted from the LED chip, and a flat dichroic prism.

Abstract: An endoscope treatment tool includes: a cap defining a longitudinal axis and a proximal-end opening for insertion of a distal end section of an endoscope to detachably attach the cap to the endoscope; a treatment tool extending longitudinally along an outside of the cap and having a distal end configured for tissue manipulation; and a coupling member extending between the cap and the treatment tool to movably couple the treatment tool to the cap, the coupling member having high flexibility.

Abstract: An automated analyzer has a reaction disk on which a plurality of reaction vessels capable of holding sample and reagent mixtures can be placed, a first cover for covering at least a portion of the area above the reaction disk, a second cover that can be opened and closed independently from the first cover, at least one sensor for monitoring the opening and closing of the first cover, and a control unit for monitoring a signal from the sensor and carrying out control such that if the first cover has not been opened and closed during the period until a new analysis operation is started, a pre-analysis cleaning operation, blank measurement operation, or both, are skipped.

Abstract: Provided is an endoscope treatment tool including: a tubular distal-end member that is attached to the distal end of an endoscope; an outer sheath having a channel extending in a direction along a longitudinal axis of the endoscope; a treatment-tool body; a linear connector that connects the distal-end member and the treatment-tool body. The treatment-tool body includes a bendable long insertion portion that is inserted through the channel, a treatment portion with which treatment is performed, and a rotating member. The rotating member includes a through-hole that extends along a plane intersecting the longitudinal axis and through which the connector is inserted. When the treatment-tool body is pushed in the longitudinal direction, the connector guides the treatment portion along a locus centered on an axis intersecting a plane including the axis of the distal-end member and the axis of the channel.

Abstract: This automatic analysis apparatus is provided with: an analysis port comprising a reaction container holding part that holds a reaction container storing the liquid mixture of a sample and a reagent, a light source that emits light to the liquid mixture stored in the reaction container held by the reaction container holding part, and a detector that detects light generated when the light from the light source is emitted to the liquid mixture; and a control unit that controls the analysis port, and analyzes the sample on the basis of information about the detected light.

Abstract: A method of processing a plate-shaped workpiece is provided. The method includes the steps of sticking a protective member to a face side of the workpiece, holding the face side of the workpiece on a holding surface of a chuck table with the protective member interposed therebetween, grinding a reverse side of the workpiece held on the chuck table to thin the workpiece by rotating a grinding wheel including grinding stones that contain abrasive grains, while a grinding fluid is being supplied from a grinding fluid supply nozzle to the reverse side of the workpiece, and after the step of grinding the reverse side of the workpiece, treating the workpiece or the grinding stones by rotating the grinding wheel and bringing the grinding stones into contact with the reverse side of the workpiece, while stopping supplying the grinding fluid from the grinding fluid supply nozzle.

Abstract: The surface of an analysis port of an automatic analyzer, in which a reaction vessel is placed, is configured so as to reflect at least some of the light emitted from a light source. In a first state before the transfer of the reaction vessel to the analysis port by a reaction vessel transfer mechanism, the control unit causes the light source to irradiate light and causes a detector to detect light. In a second state after the transfer of the reaction vessel to the analysis port by the reaction vessel transfer mechanism, the control unit causes the light source to irradiate light and causes the detector to detect light. If the difference between the amount of light detected in the first state and the amount of light detected in the second state is less than or equal to a standard value, the control unit produces a warning.

Abstract: Disclosed herein is a protective tape attaching method for attaching a protective tape to a wafer, the protective tape having a size corresponding to the size of the wafer. The protective tape attaching method includes: a bending step of bending a release paper to which an adhesive layer of the protective tape is previously attached, stretching the release paper to peel a front end portion of the protective tape from the release paper, and attaching the front end portion of the protective tape to the wafer; and an attaching step of pressing the other side of the protective tape opposite to the adhesive layer by using a pressure roller to thereby bring the adhesive layer of the protective tape into close contact with the wafer after performing the bending step.

Abstract: This automatic analysis apparatus is provided with: an analysis port comprising a reaction container holding part that holds a reaction container storing the liquid mixture of a sample and a reagent, a light source that emits light to the liquid mixture stored in the reaction container held by the reaction container holding part, and a detector that detects light generated when the light from the light source is emitted to the liquid mixture; and a control unit that controls the analysis port, and analyzes the sample on the basis of information about the detected light.

Abstract: Disclosed herein is a protective tape attaching method for attaching a protective tape to a wafer, the protective tape having a size corresponding to the size of the wafer. The protective tape attaching method includes: a bending step of bending a release paper to which an adhesive layer of the protective tape is previously attached, stretching the release paper to peel a front end portion of the protective tape from the release paper, and attaching the front end portion of the protective tape to the wafer; and an attaching step of pressing the other side of the protective tape opposite to the adhesive layer by using a pressure roller to thereby bring the adhesive layer of the protective tape into close contact with the wafer after performing the bending step.

Abstract: An automated analyzer has a reaction disk on which a plurality of reaction vessels capable of holding sample and reagent mixtures can be placed, a first cover for covering at least a portion of the area above the reaction disk, a second cover that can be opened and closed independently from the first cover, at least one sensor for monitoring the opening and closing of the first cover, and a control unit for monitoring a signal from the sensor and carrying out control such that if the first cover has not been opened and closed during the period until a new analysis operation is started, a pre-analysis cleaning operation, blank measurement operation, or both, are skipped.

Abstract: A wafer is divided into individual device chips along a plurality of scheduled division lines. A protective film is formed by coating liquid-state resin, which is hardened by irradiation of ultraviolet rays thereon, on the front face of the wafer. The protective film is hardened by irradiating ultraviolet rays upon the protective film. A protective tape is adhered on a front face of the hardened protective film. A modified layer is formed by irradiating a laser beam of a wavelength having a transparency to the wafer along the scheduled division lines with a focal point thereof positioned in the inside of the wafer. A back face of the wafer is ground while grinding water is supplied to thin the wafer to a given thickness and divide the wafer into the individual device chips along the scheduled division lines using the modified layer as a start point of the break.

Abstract: A wafer is divided into individual device chips along a plurality of scheduled division lines. A protective film is formed by coating liquid-state resin, which is hardened by irradiation of ultraviolet rays thereon, on the front face of the wafer. The protective film is hardened by irradiating ultraviolet rays upon the protective film. A protective tape is adhered on a front face of the hardened protective film. A modified layer is formed by irradiating a laser beam of a wavelength having a transparency to the wafer along the scheduled division lines with a focal point thereof positioned in the inside of the wafer. A back face of the wafer is ground while grinding water is supplied to thin the wafer to a given thickness and divide the wafer into the individual device chips along the scheduled division lines using the modified layer as a start point of the break.