Patents by Inventor Yves C. Martin
Yves C. Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11239631Abstract: A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.Type: GrantFiled: September 26, 2019Date of Patent: February 1, 2022Assignee: International Business Machines CorporationInventors: Tymon Barwicz, Yves C. Martin, Jason S. Orcutt
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Patent number: 11075310Abstract: A light concentrating optic for use with a photovoltaic device includes a light pipe having a first end portion for receiving light and a second end portion for outputting concentrated light. An optical element is coupled to the light pipe on the first end portion and configured to form an optical interface between the light pipe and the optical element. The optical element includes at least one light transmitting surface configured to redirect incident light entering the optical element to disperse the light to fall incident on side walls of the light pipe to increase homogeneity and intensity of light through the second end portion.Type: GrantFiled: April 15, 2016Date of Patent: July 27, 2021Assignees: International Business Machines Corporation, King Abdulaziz City for Science and TechnologyInventors: Alhassan Badahdah, Hussam Khonkar, Yves C. Martin, Theodore G. Van Kessel
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Publication number: 20200028318Abstract: A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.Type: ApplicationFiled: September 26, 2019Publication date: January 23, 2020Inventors: Tymon Barwicz, Yves C. Martin, Jason S. Orcutt
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Patent number: 10490971Abstract: A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.Type: GrantFiled: June 9, 2017Date of Patent: November 26, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Yves C. Martin, Jason S. Orcutt
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Patent number: 10431705Abstract: Techniques for cooling concentrating solar collector systems are provided. In one aspect, an apparatus for cooling a photovoltaic cell includes a heat exchanger having a metal plate with a bend therein that positions a first surface of the metal plate at an angle of from about 100 degrees to about 150 degrees relative to a second surface of the metal plate, and a plurality of fins attached to a side of the metal plate opposite the first surface and the second surface; a vapor chamber extending along the first surface and the second surface of the metal plate, crossing the bend; and a cladding material between the vapor chamber and the heat exchanger, wherein the cladding material is configured to thermally couple the vapor chamber to the heat exchanger. A photovoltaic system and method for operating a photovoltaic system are also provided.Type: GrantFiled: March 14, 2016Date of Patent: October 1, 2019Assignee: International Business Machines CorporationInventors: Ayman Alabduljabbar, Abdullah I. Alboiez, Yaseen G. Alharbi, Alhassan Badahdah, Hussam Khonkar, Yves C. Martin, Naim Moumen, Robert L. Sandstrom, Theodore Gerard van Kessel
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Publication number: 20190187020Abstract: Techniques for facilitating event driven gas sensing and source attribution are provided. In one example, a computer-implemented method comprises generating, by a device operatively coupled to a processor, a gas sensor signal indicative of sensing a gas based on the sensing the gas by one or more sensors. Additionally, the computer-implemented method can comprise converting, by the device, the gas sensor signal from an analog signal to a digital signal to identify one or more peak events based on the digital signal being determined to have satisfied a condition.Type: ApplicationFiled: December 15, 2017Publication date: June 20, 2019Inventors: William Green, Levente Klein, Yves C. Martin, Ramachandran Muralidhar, Michael Alan Schappert, Theodore van Kessel
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Publication number: 20180358778Abstract: A method of forming a laser including device is provided that in one embodiment includes providing a laser chip including at least one ridge structure that provides an alignment features. The method further includes bonding a type IV photonics chip to the laser chip, wherein a vertical alignment feature from the type IV photonics chip is inserted in a recess relative to the at least one ridge structure that provides the alignment features of the laser structure.Type: ApplicationFiled: June 9, 2017Publication date: December 13, 2018Inventors: Tymon Barwicz, Yves C. Martin, Jason S. Orcutt
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Patent number: 9897537Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.Type: GrantFiled: November 23, 2015Date of Patent: February 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, William M. Green, Yves C. Martin, Jason S. Orcutt, Lionel Tombez
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Patent number: 9887146Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.Type: GrantFiled: February 2, 2015Date of Patent: February 6, 2018Assignee: International Business Machines CorporationInventors: Matteo Flotta, Yves C. Martin, Lubomyr T. Romankiw, Theodore G. van Kessel
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Patent number: 9847751Abstract: Techniques for optimizing power production from photo-voltaic systems using, e.g., inductive coupling, are provided. In one aspect, a method of optimizing photo-voltaic generated power from a string of photo-voltaic devices is provided. The method includes the step of: providing corrective power to at least one photovoltaic device in the string of photo-voltaic devices to boost performance of the at least one photovoltaic device and thereby increase overall the photo-voltaic generated power from the string of photo-voltaic devices, wherein the corrective power is from about 1% to about 5%, and ranges therebetween, of the photo-voltaic generated power from the string of photo-voltaic devices. A system for optimizing photo-voltaic generated power from a string of photo-voltaic devices and a method for use thereof are also provided.Type: GrantFiled: July 30, 2014Date of Patent: December 19, 2017Assignee: International Business Machines CorporationInventors: Peter D. Kirchner, Yves C. Martin, Theodore G. van Kessel
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Patent number: 9806206Abstract: Grid patterns for concentrator solar cells that increase power output are provided. In one aspect, a top contact for a solar cell is provided that includes: bus connectors and metallic fingers attached to the bus connectors, wherein each of the metallic fingers has a base which is connected to one of the bus connectors or to another one of the metallic fingers such that each of the metallic fingers is attached to one of the bus connectors either directly or indirectly via another one of the metallic fingers, and wherein at least one of the metallic fingers has a width that is tapered quadratically along a length of the metallic finger. A solar cell and a method of forming a solar cell top contact are also provided.Type: GrantFiled: April 28, 2015Date of Patent: October 31, 2017Assignee: International Business Machines CorporationInventors: Yves C. Martin, Abdelmajid Salhi, Theodore G. van Kessel
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Patent number: 9625379Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.Type: GrantFiled: July 15, 2015Date of Patent: April 18, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, William M. Green, Yves C. Martin, Jason S. Orcutt, Lionel Tombez
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Patent number: 9606308Abstract: Techniques are provided for flip-chip assembly and packaging of microelectronic, photonics and optoelectronic devices in which three-dimensional alignment of package components is achieved using solder surface tension during a solder reflow process to move one or more package components and align such components in X, Y and Z directions using mechanical stops and chip butting techniques.Type: GrantFiled: February 27, 2015Date of Patent: March 28, 2017Assignee: International Business Machines CorporationInventors: Tymon Barwicz, Yves C. Martin, Jae-Woong Nah
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Patent number: 9562852Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.Type: GrantFiled: March 7, 2016Date of Patent: February 7, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, William M. Green, Yves C. Martin, Jason S. Orcutt, Lionel Tombez
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Publication number: 20170016819Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.Type: ApplicationFiled: March 7, 2016Publication date: January 19, 2017Inventors: Tymon Barwicz, William M. Green, Yves C. Martin, Jason S. Orcutt, Lionel Tombez
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Publication number: 20170016818Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.Type: ApplicationFiled: November 23, 2015Publication date: January 19, 2017Inventors: Tymon Barwicz, William M. Green, Yves C. Martin, Jason S. Orcutt, Lionel Tombez
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Publication number: 20170016817Abstract: A method of fabricating a gas sensor on a substrate and a gas sensor fabricated on a substrate that includes optical and electronic components are described. The method includes fabricating a laser to output light over a range of wavelengths within a waveguide, fabricating a splitter to split the light output by the laser to a reference waveguide and to a detection waveguide, fabricating a reference cell to house the reference waveguide and a reference gas. An output of the reference waveguide is coupled to a first optical detector and an output of the detection waveguide is coupled to a second optical detector to identify or quantify an ambient gas.Type: ApplicationFiled: July 15, 2015Publication date: January 19, 2017Inventors: Tymon Barwicz, William M. Green, Yves C. Martin, Jason S. Orcutt, Lionel Tombez
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Patent number: 9496422Abstract: A photovoltaic structure includes, from bottom to top, a conductive substrate, at least one electrical isolation layer, and a patterned conductive material layer. The patterned conductive material layer includes at least one solar concentrator receiver plate configured to mount a photovoltaic concentrator cells and at least one metallic wiring structure. The at least one electrical isolation layer can include a stack of an electrically insulating metal-containing compound layer and an organic or inorganic dielectric material that provides thermal conduction and electrical isolation. The at least one solar concentrator receiver plate can be thicker than the at least one metallic wiring structure so as to provide enhanced thermal spreading and conduction through the at least one electrical isolation layer and into the conductive substrate.Type: GrantFiled: July 30, 2012Date of Patent: November 15, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Yves C. Martin, Theodore G. van Kessel, Brent A. Wacaser
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Publication number: 20160322513Abstract: Grid patterns for concentrator solar cells that increase power output are provided. In one aspect, a top contact for a solar cell is provided that includes: bus connectors and metallic fingers attached to the bus connectors, wherein each of the metallic fingers has a base which is connected to one of the bus connectors or to another one of the metallic fingers such that each of the metallic fingers is attached to one of the bus connectors either directly or indirectly via another one of the metallic fingers, and wherein at least one of the metallic fingers has a width that is tapered quadratically along a length of the metallic finger. A solar cell and a method of forming a solar cell top contact are also provided.Type: ApplicationFiled: April 28, 2015Publication date: November 3, 2016Inventors: Yves C. Martin, Abdelmajid Salhi, Theodore G. van Kessel
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Patent number: 9466590Abstract: A multi-chip system includes a top chip stack element comprising a top chip having two major surfaces and top solder pads arrayed along a plane of one of the major surfaces; a bottom chip stack element comprising a bottom substrate having two major surfaces and bottom solder pads arrayed along a plane of one of the major surfaces; one or more solder reservoir pads connected to one or more of the top solder pads or of the bottom solder pads; and solder material; and wherein at least one of the top solder pads is connected to one of the bottom solder pads by one of the solder material.Type: GrantFiled: November 13, 2015Date of Patent: October 11, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Yves C. Martin, Jae-Woong Nah