Abstract: Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: A solar concentrator includes an optical member having a focal point. The optical member is configured and disposed to direct incident solar radiation to the focal point. A support member is positioned adjacent to the focal point of the optical member. A solar energy collector is supported upon the support member. The solar energy collector is positioned at the focal point of the optical member. A base member is positioned in a spaced relationship from the support member. The base member and the support member define a chamber section that is in a heat exchange relationship with the solar energy collector. The chamber section is configured to absorb and dissipate heat from the solar energy collectors.

Abstract: Solar concentrator devices and techniques for the fabrication thereof are provided. In one aspect, a solar concentrator device is provided. The solar concentrator device comprises at least one solar converter cell; a heat sink; and a liquid metal between the solar converter cell and the heat sink, configured to thermally couple the solar converter cell and the heat sink during operation of the device. The solar converter cell can comprise a triple junction semiconductor solar converter cell fabricated on a germanium (Ge) substrate. The heat sink can comprise a vapor chamber heat sink. The liquid metal can comprise a gallium (Ga) alloy and have a thermal resistance of less than or equal to about five square millimeter degree Celsius per Watt (mm2° C./W).

Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.

Abstract: Techniques for analyzing performance of solar panels and/or cells are provided. In one aspect, a method for analyzing an infrared thermal image taken using an infrared camera is provided. The method includes the following steps. The infrared thermal image is converted to temperature data. Individual elements are isolated in the infrared thermal image. The temperature data for each isolated element is tabulated. A performance status of each isolated element is determined based on the tabulated temperature data. The individual elements can include solar panels and/or solar cells. In another aspect, an infrared diagnostic system is provided. The infrared diagnostic system includes an infrared camera which can be remotely positioned relative to one or more elements to be imaged; and a computer configured to receive thermal images from the infrared camera, via a communication link, and analyze the thermal images.

Abstract: The present invention is a universal patterned metal thermal interface. The thermal interface eliminates the need for surface processing of one or both contact surfaces that are to accommodate the thermal interface. In one embodiment, a thermal interface for coupling a first solid to a second solid includes a patterned metal insert, a corrosion resistant layer coating at least one exterior side of the insert, for protecting the insert from corrosion, and an organic layer coating the corrosion resistant layer, for facilitating bonding of the insert to one of the first solid or the second solid.

Abstract: An apparatus (and method) for referencing a surface of a workpiece during imprint lithography, includes an air bearing for mechanically referencing a surface of the workpiece, and a lithographic template coupled to the air bearing.

Abstract: A system and method to improve long term reliability of an integrated circuit package containing a patterned metal thermal interface (PMTI), the method including: coupling a heat sink to a heat source; providing a PMTI material between the heat source and the heat sink; providing a partial containment of a compressed malleable metal to impede the PMTI from being inched-out of its location under a bearing load.

Abstract: A system for imprint lithography, which includes a substrate, a patterned mask, an imprint applying unit that imprints, via the patterned mask, a pattern into a resist layer on the substrate, and an overlay device that overlays a cladding layer over the substrate.

Abstract: A method (and apparatus) of imprint lithography, includes imprinting, via a patterned mask, a pattern into a resist layer on a substrate, and overlaying a cladding layer over the imprinted resist layer. A portion of the cladding layer is used as a hard mask for a subsequent processing.

Abstract: A solar concentration system includes an optically clear shell member having an outer surface and an inner surface, with the inner surface defining a hollow interior portion, a liquid contained within the hollow interior portion of the optically clear shell, and a solar collection system contained within the hollow interior portion of the optically clear shell. The solar collection system includes a tracking system configured and disposed to selectively shift within the hollow interior portion, a reflector member mounted to the tracking system, and a solar receiver mounted to the tracking system. The tracking system being configured and disposed orient the reflector member and the solar receiver to follow a path of the sun enhancing the collection of solar energy.

Abstract: A solar energy alignment and collection system includes at least two solar energy receivers having a central focal point, with each of the at least two solar energy receivers generating an energy output. An actuation system is operatively coupled to the at least two solar energy receivers and is configured and disposed to shift the solar energy receivers along at least one axis. A control system, operatively linked to the solar receivers and the actuation system, senses the energy output of each solar energy receiver and shifts the actuation system along the at least one axis causing solar energy to be directed at the central focal point. When solar energy is directed at the central focal point, the energy output of each solar energy receiver is substantially identical.

Abstract: A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.

Abstract: A method (and apparatus) of imprint lithography, includes imprinting, via a patterned mask, a pattern into a resist layer on a substrate, and overlaying a cladding layer over the imprinted resist layer. A portion of the cladding layer is used as a hard mask for a subsequent processing.

Abstract: The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.

Abstract: An assembly and method for recording and/or reading high-density data includes a phase change media, an antenna placed adjacent the phase change media, and a source of electromagnetic radiation.

Abstract: The present invention is a patterned metal thermal interface. In one embodiment a system for dissipating heat from a heat-generating device includes a heat sink having a first surface adapted for thermal coupling to a first surface of the heat generating device and a thermal interface having at least one patterned surface, the thermal interface being adapted to thermally couple the first surface of the heat sink to the first surface of the heat generating device. The patterned surface of the thermal interface allows the thermal interface to deform under compression between the heat sink and the heat generating device, leading to better conformity of the thermal interface to the surfaces of the heat sink and the heat generating device.

Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.

Abstract: Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer.

Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.