Patents by Inventor Yves Martin

Yves Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289638
    Abstract: A method for improving lifetime and coherence time of a qubit in a quantum mechanical device is provided. The method includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit having capacitor pads. The method further includes at least one of removing an amount of substrate material from the backside of the substrate at an area opposite the at least one qubit or depositing a superconducting metal layer at the backside of the substrate at the area opposite the at least one qubit to reduce radiofrequency electrical current loss due to at least one of silicon-air (SA) interface, metal-air (MA) interface or silicon-metal (SM) interface so as to enhance a lifetime (T1) and a coherence time (T2) in the at least one qubit.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: March 29, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Douglas Max Gill, Martin O. Sandberg, Vivekananda P. Adiga, Yves Martin, Hanhee Paik
  • Publication number: 20210399192
    Abstract: A method for improving lifetime and coherence time of a qubit in a quantum mechanical device is provided. The method includes providing a substrate having a frontside and a backside, the frontside having at least one qubit formed thereon, the at least one qubit having capacitor pads. The method further includes at least one of removing an amount of substrate material from the backside of the substrate at an area opposite the at least one qubit or depositing a superconducting metal layer at the backside of the substrate at the area opposite the at least one qubit to reduce radiofrequency electrical current loss due to at least one of silicon-air (SA) interface, metal-air (MA) interface or silicon-metal (SM) interface so as to enhance a lifetime (T1) and a coherence time (T2) in the at least one qubit.
    Type: Application
    Filed: June 22, 2020
    Publication date: December 23, 2021
    Inventors: Douglas Max Gill, Martin O. Sandberg, Vivekananda P. Adiga, Yves Martin, Hanhee Paik
  • Patent number: 11162890
    Abstract: A sensor housing apparatus includes a housing having an enclosure and outer assembly, at least one flow path extending through the housing, a gas sensor disposed in the enclosure and a thermal mass. The thermal mass is mounted within the enclosure in thermal communication with the gas sensor, and is configured to transfer thermal energy from the gas sensor to an ambient environment surrounding the housing and minimize temperature gradients adjacent the gas sensor.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: November 2, 2021
    Assignee: International Business Machines Corporation
    Inventors: Yves Martin, William Green, Theodore G. van Kessel
  • Patent number: 11166381
    Abstract: Solder-pinning metal pads for electronic components and techniques for use thereof to mitigate de-wetting are provided. In one aspect, a structure includes: a substrate; and a solder pad on the substrate, wherein the solder pad has sidewalls extending up from a surface thereof. For instance, the sidewalls can be present at edges of the solder pad, or inset from the edges of the solder pad. The sidewalls can be vertical or extend up from the solder pad at an angle. The sidewalls can be formed from the same material or a different material as the solder pad. A method is also provided that includes forming a solder pad on a substrate, the solder pad comprising sidewalls extending up from a surface thereof.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: November 2, 2021
    Assignee: International Business Machines Corporation
    Inventors: Yves Martin, Tymon Barwicz
  • Patent number: 11130265
    Abstract: An injection mold for encapsulating a substrate comprises a lower mold component and an upper mold component adapted to form an encapsulation mold at an edge of the substrate when the upper mold component engages the lower mold component. The lower mold component comprises a substrate support and wherein the upper mold component comprises a recess. The injection mold includes a tiltable insert sized and shaped to slide within the recess to form a seal for the encapsulation mold, the insert having a substrate-contacting surface defining an area of the substrate contacted by the insert. The injection mold includes a plurality of pressure-exerting actuators connected to the tiltable insert and each being configured to independently apply pressure on the substrate via the insert, wherein the plurality of pressure-exerting actuators are adapted to equilibrate a total predetermined pressure exerted by the insert substantially evenly across the area of the substrate-contacting surface.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: September 28, 2021
    Assignee: M.I. INTEGRATION S.E.N.C.
    Inventors: Nicolas Nadeau, Jean Therrien, Yves Martin
  • Patent number: 10954176
    Abstract: The present invention relates to a process for producing high-purity para-xylene, comprising a single step of separation by adsorption in an SMB, with a subsequent step of separation by distillation in a first three-fraction distillation column producing at least two raffinates and optionally of two isomerization steps, making it possible to improve the overall para-xylene yield of the aromatic loop and to minimize the economic impact.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: March 23, 2021
    Assignee: AXENS
    Inventors: Isabelle Prevost, Jerome Pigourier, Pierre-Yves Martin, Arnaud Cotte
  • Patent number: 10935533
    Abstract: A gas sensor enclosure is provided. The gas sensor enclosure includes at least two coaxial shells, a gas sensor, a gas permeable membrane that exposes a portion of the gas sensor to gas exchange through one of the at least two coaxial shells and a screen. The screen encloses the at least two coaxial shells, the gas sensor and the gas permeable membrane.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 2, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Josephine B Chang, Yves Martin, Theodore G. Van Kessel
  • Patent number: 10901147
    Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: January 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: Yves Martin, Jason S. Orcutt, Tymon Barwicz, William Green
  • Patent number: 10901146
    Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: January 26, 2021
    Assignee: International Business Machines Corporation
    Inventors: Yves Martin, Jason S. Orcutt, Tymon Barwicz, William Green
  • Publication number: 20200253429
    Abstract: The invention relates to a system and method for improving the quality of hand hygiene. It comprises a portable bottle of disinfectant equipped with electronics and an electronic wristband. It gives different real-time feedback to its user regarding the quantity of disinfectant used, the duration of hand rubbing and the compliance of his/her rubbing gestures with a reference sequence. According to variations, the bottle can be used on its own.
    Type: Application
    Filed: June 25, 2018
    Publication date: August 13, 2020
    Inventors: Yves MARTIN, Yves-Alain ROBERT
  • Patent number: 10733650
    Abstract: A method for providing product information to at least one media displaying device located in at least one store and having an output and a data reception unit, each store having at least one data emitting device, comprising the steps of: generating, at a central back-office server connected to the store data emitting unit, an individual glyph corresponding to each different character or symbol of the product information; generating at least a display script comprising reference and position data of the glyphs in the product information; transmitting the display script and the individual glyphs to the store data emitting device; transmitting the display script to the media displaying device; broadcasting the individual glyphs; selecting and loading in the media displaying device individual glyphs corresponding to the reference data comprised in the display script; and displaying the selected and loaded individual glyphs at the output means of the media displaying device according to the position data comprise
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: August 4, 2020
    Assignee: SES-imagotag
    Inventor: Yves Martin
  • Publication number: 20200209148
    Abstract: A sensor housing apparatus includes a housing having an enclosure and outer assembly, at least one flow path extending through the housing, a gas sensor disposed in the enclosure and a thermal mass. The thermal mass is mounted within the enclosure in thermal communication with the gas sensor, and is configured to transfer thermal energy from the gas sensor to an ambient environment surrounding the housing and minimize temperature gradients adjacent the gas sensor.
    Type: Application
    Filed: January 2, 2020
    Publication date: July 2, 2020
    Inventors: Yves Martin, William Green, Theodore G. van Kessel
  • Publication number: 20200208884
    Abstract: A cooling device employing a thermodynamic cycle of the reverse stirling cycle type is provided. The device includes a compressor with a reciprocating piston driven by a rotary motor about an axis by means of a crankshaft. The device further comprises a monobloc support forming a cylinder in which the piston of the compressor moves. The crankshaft is supported by a single bearing. The bearing is positioned without an intermediate component in a housing of the monobloc support.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Inventors: Julien LE BORDAYS, Jean-Yves MARTIN, Mikel SACAU
  • Publication number: 20200208883
    Abstract: A cooling device implementing a stirling-type thermodynamic cycle includes a compressor with a reciprocating piston driven by an electric motor rotating about an axis via a crankshaft. The electric motor comprises an internal stator and an external rotor and is connected to the crankshaft via a link with at least one degree of freedom in rotation about the axis of the electric motor.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 2, 2020
    Inventors: Mikel SACAU, Jean-Yves MARTIN, Julien LE BORDAYS
  • Patent number: 10618022
    Abstract: The present invention describes a type of inclined bed reactor which permits a small quantity of catalyst to be employed. Application of the reactor to a regenerative reforming process.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: April 14, 2020
    Assignee: IFP Energies nouvelles
    Inventors: Joana Fernandes, Julien Gornay, Alexandre Pagot, Fabian Lambert, Pierre-Yves Martin, Christophe Pierre, Francois Sala
  • Patent number: 10613023
    Abstract: A sensor housing apparatus includes a housing having an enclosure and outer assembly, at least one flow path extending through the housing, a gas sensor disposed in the enclosure and a thermal mass. The thermal mass is mounted within the enclosure in thermal communication with the gas sensor, and is configured to transfer thermal energy from the gas sensor to an ambient environment surrounding the housing and minimize temperature gradients adjacent the gas sensor.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: April 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: Yves Martin, William Green, Theodore G. van Kessel
  • Publication number: 20200100369
    Abstract: Solder-pinning metal pads for electronic components and techniques for use thereof to mitigate de-wetting are provided. In one aspect, a structure includes: a substrate; and a solder pad on the substrate, wherein the solder pad has sidewalls extending up from a surface thereof. For instance, the sidewalls can be present at edges of the solder pad, or inset from the edges of the solder pad. The sidewalls can be vertical or extend up from the solder pad at an angle. The sidewalls can be formed from the same material or a different material as the solder pad. A method is also provided that includes forming a solder pad on a substrate, the solder pad comprising sidewalls extending up from a surface thereof.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 26, 2020
    Inventors: Yves Martin, Tymon Barwicz
  • Patent number: 10562242
    Abstract: There is provided a method for applying thermosetting tape on contoured resilient surfaces off an object which comprises biasing selected section(s) of the resilient member to minimize tape and object distortion. There is also provided a tape laying apparatus configured to enable the optimization of automatic tape application on resilient contoured surfaces and minimize tape and object distortion.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: February 18, 2020
    Assignee: MI INTEGRATION S.E.N.C.
    Inventors: Yves Martin, Claude Houle, Yannick Longpré, Nicolas Nadeau
  • Publication number: 20200023561
    Abstract: An injection mold for encapsulating a substrate comprises a lower mold component and an upper mold component adapted to form an encapsulation mold at an edge of the substrate when the upper mold component engages the lower mold component. The lower mold component comprises a substrate support and wherein the upper mold component comprises a recess. The injection mold includes a tiltable insert sized and shaped to slide within the recess to form a seal for the encapsulation mold, the insert having a substrate-contacting surface defining an area of the substrate contacted by the insert. The injection mold includes a plurality of pressure-exerting actuators connected to the tiltable insert and each being configured to independently apply pressure on the substrate via the insert, wherein the plurality of pressure-exerting actuators are adapted to equilibrate a total predetermined pressure exerted by the insert substantially evenly across the area of the substrate-contacting surface.
    Type: Application
    Filed: December 1, 2017
    Publication date: January 23, 2020
    Inventors: Nicolas NADEAU, Jean THERRIEN, Yves MARTIN
  • Patent number: 10527787
    Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: January 7, 2020
    Assignee: International Business Machines Corporation
    Inventors: Yves Martin, Jason S. Orcutt, Tymon Barwicz, William Green