Abstract: A sensor housing apparatus includes a housing having an enclosure and outer assembly, at least one flow path extending through the housing, a gas sensor disposed in the enclosure and a thermal mass. The thermal mass is mounted within the enclosure in thermal communication with the gas sensor, and is configured to transfer thermal energy from the gas sensor to an ambient environment surrounding the housing and minimize temperature gradients adjacent the gas sensor.

Abstract: Solder-pinning metal pads for electronic components and techniques for use thereof to mitigate de-wetting are provided. In one aspect, a structure includes: a substrate; and a solder pad on the substrate, wherein the solder pad has sidewalls extending up from a surface thereof. For instance, the sidewalls can be present at edges of the solder pad, or inset from the edges of the solder pad. The sidewalls can be vertical or extend up from the solder pad at an angle. The sidewalls can be formed from the same material or a different material as the solder pad. A method is also provided that includes forming a solder pad on a substrate, the solder pad comprising sidewalls extending up from a surface thereof.

Abstract: There is provided a method for applying thermosetting tape on contoured resilient surfaces off an object which comprises biasing selected section(s) of the resilient member to minimize tape and object distortion. There is also provided a tape laying apparatus configured to enable the optimization of automatic tape application on resilient contoured surfaces and minimize tape and object distortion.

Abstract: An injection mold for encapsulating a substrate comprises a lower mold component and an upper mold component adapted to form an encapsulation mold at an edge of the substrate when the upper mold component engages the lower mold component. The lower mold component comprises a substrate support and wherein the upper mold component comprises a recess. The injection mold includes a tiltable insert sized and shaped to slide within the recess to form a seal for the encapsulation mold, the insert having a substrate-contacting surface defining an area of the substrate contacted by the insert. The injection mold includes a plurality of pressure-exerting actuators connected to the tiltable insert and each being configured to independently apply pressure on the substrate via the insert, wherein the plurality of pressure-exerting actuators are adapted to equilibrate a total predetermined pressure exerted by the insert substantially evenly across the area of the substrate-contacting surface.

Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Abstract: The present invention relates to a process for producing high-purity para-xylene, comprising a single step of separation by adsorption in an SMB, with a subsequent step of separation by distillation in a first three-fraction distillation column producing at least two raffinates and optionally of two isomerization steps, making it possible to improve the overall para-xylene yield of the aromatic loop and to minimize the economic impact.

Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Abstract: A cooler operating according to the Stirling cycle, including a housing including a compression cylinder and a regeneration cylinder, a movable compression piston and a movable regeneration piston, that can move in translational motion in the compression cylinder and in the regeneration cylinder, a driving crankshaft, including a rotating crank pin, and two connecting rods coupled to the compression piston and the regeneration piston, the connecting rods being coupled to the rotating crank pin, a fluid flow duct for circulating fluid, connecting the compression cylinder and the regeneration cylinder, one end of the fluid flow duct being disposed on the regeneration piston, and the fluid flow duct including a deformable pipe that is deformed in accordance with the movement of the compression piston and/or of the regeneration piston.

Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Abstract: A method for assembling a semiconductor device includes: receiving a first chip including a plurality of first bonding pads, a first standoff and a second standoff, wherein a first solder is deposited on each of the first bonding pads; depositing a second solder on each of the first and second standoffs; arranging a second chip over the first chip, wherein the second chip includes a plurality of second bonding pads, and at least one of the second bonding pads has a corresponding first bonding pad; heating the second chip over a melting point of the second solder to melt the second solder, and placing the second chip on the first chip to touch and solidify the second solder on each of the first and second standoffs; performing a reflow process to melt the first solder on each of the first bonding pads so that at least one of the first solders touches a corresponding second bonding pad; and waiting a predetermined period of time to allow the second chip to move until a side edge of the second chip touches a wav

Abstract: A gas sensor enclosure is provided. The gas sensor enclosure includes at least two coaxial shells, a gas sensor, a gas permeable membrane that exposes a portion of the gas sensor to gas exchange through one of the at least two coaxial shells and a screen. The screen encloses the at least two coaxial shells, the gas sensor and the gas permeable membrane.

Abstract: A method for assembling a semiconductor device includes: receiving a first chip including a plurality of first bonding pads, a first standoff and a second standoff, wherein a first solder is deposited on each of the first bonding pads; depositing a second solder on each of the first and second standoffs; arranging a second chip over the first chip, wherein the second chip includes a plurality of second bonding pads, and at least one of the second bonding pads has a corresponding first bonding pad; heating the second chip over a melting point of the second solder to melt the second solder, and placing the second chip on the first chip to touch and solidify the second solder on each of the first and second standoffs; performing a reflow process to melt the first solder on each of the first bonding pads so that at least one of the first solders touches a corresponding second bonding pad; and waiting a predetermined period of time to allow the second chip to move until a side edge of the second chip touches a wav

Abstract: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

Abstract: A method for providing product information to at least one media displaying device located in at least one store and having an output and a data reception unit, each store having at least one data emitting device, comprising the steps of: generating, at a central back-office server connected to the store data emitting unit, an individual glyph corresponding to each different character or symbol of the product information; generating at least a display script comprising reference and position data of the glyphs in the product information; transmitting the display script and the individual glyphs to the store data emitting device; transmitting the display script to the media displaying device; broadcasting the individual glyphs; selecting and loading in the media displaying device individual glyphs corresponding to the reference data comprised in the display script; and displaying the selected and loaded individual glyphs at the output means of the media displaying device according to the position data comprise

Abstract: The present invention describes a process for the isomerization of a light naphtha with a view to forming high octane number gasolines, said process using a deisopentanizer and a deisohexanizer which are thermally integrated in a manner such as to reduce the consumption of the high temperature utilities employed in the process.

Abstract: The present invention describes a process for the production of high octane number gasoline by isomerization of a light naphtha cut, comprising two separation steps located downstream of the reaction step which can be used to improve the energy efficiency of said process.

Abstract: There is provided a method for applying thermosetting tape on contoured resilient surfaces off an object which comprises biasing selected section(s) of the resilient member to minimize tape and object distortion. There is also provided a tape laying apparatus configured to enable the optimization of automatic tape application on resilient contoured surfaces and minimize tape and object distortion.

Abstract: A method for displaying product information on at least one electronic label having a graphic display and a data reception unit is disclosed. The method includes: generating, at a server connected to the label, an individual glyph corresponding to each different character or symbol of the product information; generating at least a display script comprising reference and position data of said glyphs in the product information; transmitting the display script to the label; broadcasting the individual glyphs; selecting and loading in the label individual glyphs corresponding to the reference data comprised in the display script and displaying the selected and loaded individual glyphs according to the position data comprised in the display script. A server, an electronic label and a sever thereof are also provided.