Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Abstract: A method (and system) for non-destructive measurement of a depth of a feature in a structure, includes using a scanning electron microscope (SEM) image to navigate to find the feature in an X-ray image, using an electron beam to produce a fluorescent emission in the feature, and using an X-ray count made at a position of the feature in the X-ray image, to determine a depth of the feature.

Abstract: The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

Abstract: The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first surface and an opposing second surface. A mesh plug is disposed in the channel for turbulently mixing the coolant within the channel. The first surface of the channel is disposed proximate a semiconductor heat source. In one embodiment the first surface comprises plastic. In one embodiment, the second surface comprises metal, for example, copper. In one embodiment the mesh plug comprises a nickel-coated copper mesh.

Abstract: An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.

Abstract: A method (and resultant structure) of forming a plurality of masks, includes creating a reference template, using imprint lithography to print at least one reference template alignment mark on all of a plurality of mask blanks for a given chip set, and printing sub-patterns on each of the plurality of mask blanks, and aligning the sub-patterns to the at least one reference template alignment mark.

Abstract: An apparatus (and method) for referencing a surface of a workpiece during imprint lithography, includes an air bearing for mechanically referencing a surface of the workpiece, and a lithographic template coupled to the air bearing.

Abstract: An apparatus (and method) for forming a pattern on a workpiece, includes an optical phase contrast image sensor, and an imprint lithography system coupled to the optical phase contrast image sensor for laterally aligning an imprint template feature relative to the workpiece.

Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling using a liquid metal thermal interface. One embodiment of an inventive thermal interface for facilitating thermal contact between opposing surfaces of an integrated circuit chip and a heat sink the thermal interface includes a liquid metal layer comprising a thermally conductive liquid metal material. A first barrier layer bonds the liquid metal layer to the surface of the integrated circuit chip, and a second barrier layer bonds the liquid metal layer to the surface of the heat sink.

Abstract: A method (and apparatus) of replicating a pattern on a structure, includes using imprint lithography to replicate a pattern formed on a first structure onto a portion of a second structure.

Abstract: A method (and apparatus) for nano lithography, includes applying a pneumatic pressure to at least one of a surface of a semi-rigid mask or template and a portion of a surface of a resist-coated workpiece, and, by the applying of the pneumatic pressure, transferring a pattern from the mask to the workpiece.

Abstract: A heating device for a magnetic recording head includes first and second separating layers, the first separating layer having preferably a higher or equal thermal resistance than the first separating layer, and a heater formed between the first and second separating layers. A magnetic recording head for recording on magnetic medium includes a heating device which generates a heat spot on the magnetic medium which is larger than a magnetic track width, and/or heats a portion of the magnetic recording head which is on a leading edge side of a write gap in the magnetic recording head.

Abstract: The invention discloses an assembly capable of writing/erasing high-density data, preferably on a phase-change recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the assembly, preferably for writing in a substantially thermal near-field mode. The invention provides advantages of writing densities greater than that of diffraction limited systems, for example, writing densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.

Abstract: The present invention is a thermal interface for IC chip cooling. One embodiment of the invention comprises a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.

Abstract: The invention comprises a system and a method for discriminating a roll placed in a paper roll dispenser, as well as a paper roll with a core comprising at least one passive element having an electrical conductivity different from that of the core, to be used in conjunction with the dispenser. The system comprises at least two conducting plates located within the paper roll dispenser such that when the roll is positioned within the dispenser, the plates are in proximity of the roll, the plates being electrically insulated from each other, means for detecting capacitance between the plates and generating a signal indicative of said capacitance and means for discriminatng said paper roll based on a value of the signal.

Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

Abstract: An assembly for writing/reading high-density data on a recording media as a series of tags comprising a magnetic information bit pattern. The assembly includes an antenna positionable near the media; a source of electromagnetic radiation for producing an incident wave at least a portion of which can be coupled to the antenna; and, a means for coordinating a mutual positioning of the source of the electromagnetic radiation and the antenna, so that the antenna can generate a highly localized electromagnetic field in the vicinity of the media for inducing localized heating of the media. The assembly is capable of writing/erasing said high-density data by using an information signal for modulating the localized field generated in the vicinity of the media; the assembly is capable of reading by coordinating the mutual positioning of the antenna and the media.

Abstract: Natural gas liquefaction method wherein the natural gas is cooled, condensed and subcooled by indirect heat exchange with two cooling mixtures to a temperature such that the natural gas does not remain entirely liquid under pressure after expansion to the atmospheric pressure. The liquid natural gas under pressure is expanded to form a gas phase and a liquid phase. The gas phase can be either compressed and recycled to the process inlet, or used as a fuel. The liquid phase is expanded to form a gas phase and a liquid phase. The gas phase is compressed and recycled to the process inlet. The liquid phase constitutes the liquefied natural gas produced.