Abstract: The gas turbine engine shroud comprises a plurality of circumferentially-disposed and concentric shroud segments. Each shroud segment has an arc-shaped platform with opposite ends, each end comprising an inter-segment seal slot, at least one slot extending substantially across each corresponding end and having a lengthwise-variable depth.

Abstract: Assay supports, such as microarrays and similar devices, and methods of use and manufacture thereof, are described. The assay support is capable of assaying binding and/or activity of a bioactive entity, such as a bioactive molecule or a cell. Analytical and diagnostic uses of the supports are also described.

Abstract: The support (1) includes a working deck (2) and floatation members (3) supporting this deck (2). According to the invention, the spacing between the vertical axes (Z) passing through the centre of the floatation members (3) is such that the sum of the moments, taken in relation to the horizontal axis passing through the centre of the support (1) is perpendicular to the swell direction, of the vertical excitation forces of the swell on the floatation members (3) situated on one side of the vertical plane (P) passing through this horizontal axis is equal to the corresponding sum associated with the floatation members (3) situated on the other side of this plane, when the swell period is equal to the period of a swell having this direction and of which the yearly probability of being encountered on the site or the support where it is installed is 1/100.

Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

Abstract: Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.

Abstract: A device for generating an x-ray point source includes a target, and an electron source for producing electrons which intersect with the target to generate an x-ray point source having a size which is confined by a dimension of the target.

Abstract: A therapeutic endocavity probe for treating tissues in particular of the prostate by emission of focused ultrasonic waves, including a support forming a guide tube extended by a mounting head for at least one therapy transducer component with an active surface emitting focused ultrasonic waves and having a spherical front of a total surface area in which a surface window is laid out for mounting an imaging transducer. According to the invention, the therapy transducer component has a front face having a total surface area equal to the sum of the active surface area equal to 1,500 mm2 ±200 mm2, and of the surface area of the window for letting through the imaging transducer, the ratio of the surface area of the window over the active surface area of the therapy transducer component being less than or equal to 0.45.

Abstract: A process for manufacturing an embossed paperboard comprising the steps of: forming a wet mat including more than 60 wt % of cellulose fibers; pressure molding, with at least one embossing roll, the wet mat having 20 to 70 wt % solid to create a nested surface texture thereon; and drying the embossed wet mat to obtain the embossed paperboard with a grammage ranging between 125 and 1500 grams per square meter.

Abstract: The support (1) includes a working deck (2) and floatation members (3) supporting this deck (2). According to the invention, the spacing between the vertical axes (Z) passing through the centre of the floatation members (3) is such that the sum of the moments, taken in relation to the horizontal axis passing through the centre of the support (1) is perpendicular to the swell direction, of the vertical excitation forces of the swell on the floatation members (3) situated on one side of the vertical plane (P) passing through this horizontal axis is equal to the corresponding sum associated with the floatation members (3) situated on the other side of this plane, when the swell period is equal to the period of a swell having this direction and of which the yearly probability of being encountered on the site or the support where it is installed is 1/100.

Abstract: An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.

Abstract: A system and a method discriminates a roll placed in a paper roll dispenser, as well as a paper roll with a core having at least one passive electrically conductive element, to be used in conjunction with the dispenser. The system includes a probe sensitive to a presence of an electrically conductive element in proximity thereof, the probe being located within the paper roll dispenser such that when the roll is positioned within the dispenser, the probe is in proximity of the roll. The system also includes an application for applying an input signal to the probe, a detector for detecting an output signal from the probe, the output signal being indicative of a presence of the electrically conductive element proximate the probe, and a discriminator for discriminating the paper roll based on a value of the output signal detected by the detector.

Abstract: An assembly and method for recording and/or reading high-density data includes a phase change media, an antenna placed adjacent the phase change media, and a source of electromagnetic radiation.

Abstract: The present invention is a method and apparatus for cooling a heat source. In one embodiment a heat exchanger is provided and includes a channel for receiving a coolant, the channel having a first surface and an opposing second surface. A mesh plug is disposed in the channel for turbulently mixing the coolant within the channel. The first surface of the channel is disposed proximate a semiconductor heat source. In one embodiment the first surface comprises plastic. In one embodiment, the second surface comprises metal, for example, copper. In one embodiment the mesh plug comprises a nickel-coated copper mesh.

Abstract: An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface.

Abstract: In one embodiment, the present invention is a method and apparatus for chip cooling. One embodiment of an inventive method for bonding a liquid metal to an interface surface (e.g., a surface of an integrated circuit chip or an opposing surface of a heat sink) includes applying an adhesive to the interface surface. A metal film is then bonded to the adhesive, thereby easily adapting the interface surface for bonding to the liquid metal.

Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Abstract: The present invention is a method and apparatus for cooling a semiconductor heat source. In one embodiment a thermal spreader is provided and includes a substrate for supporting the semiconductor heat source and a heat sink coupled to the substrate. A channel is disposed between the heat sink and substrate. The channel has at least one wall defined by the heat sink. The surface area of the channel wall defined by the heat sink is about 10 to about 100 times the surface area of a bottom surface of the semiconductor heat source. A coolant, for example liquid metal, circulates within the channel.

Abstract: An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.

Abstract: The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

Abstract: The invention concerns a fluid manipulating system, comprising a reservoir of fluid (7), a bubble trap (9) connected to the reservoir, a heat-exchanger (11) and an appliance (21) forming with the bubble trap a closed circuit of fluid, and a pump (21) circulating the fluid in the closed circuit, thereby enabling to control easily the volume of fluid in the apparatus and the temperature of said fluid. The invention is useful for manipulating coupling and cooling fluid of rectal tubes in ultrasound therapy.