Patents by Inventor Yvon Imbs
Yvon Imbs has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10879583Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: GrantFiled: December 10, 2019Date of Patent: December 29, 2020Assignees: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: David Auchere, Laurent Marechal, Yvon Imbs, Laurent Schwarz
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Publication number: 20200119430Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: ApplicationFiled: December 10, 2019Publication date: April 16, 2020Applicants: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: David AUCHERE, Laurent MARECHAL, Yvon IMBS, Laurent SCHWARZ
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Patent number: 10522899Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: GrantFiled: June 25, 2018Date of Patent: December 31, 2019Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: David Auchere, Laurent Marechal, Yvon Imbs, Laurent Schwarz
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Patent number: 10116037Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: GrantFiled: August 4, 2017Date of Patent: October 30, 2018Assignees: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: David Auchere, Laurent Marechal, Yvon Imbs, Laurent Schwarz
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Publication number: 20180309187Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: ApplicationFiled: June 25, 2018Publication date: October 25, 2018Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: David Auchere, Laurent Marechal, Yvon Imbs, Laurent Schwarz
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Patent number: 10103079Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.Type: GrantFiled: July 25, 2017Date of Patent: October 16, 2018Assignees: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: Yvon Imbs, Laurent Schwarz, David Auchere, Laurent Marechal
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Patent number: 10062961Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.Type: GrantFiled: August 2, 2017Date of Patent: August 28, 2018Assignees: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: David Auchere, Laurent Marechal, Laurent Schwarz, Yvon Imbs
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Publication number: 20170338543Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: ApplicationFiled: August 4, 2017Publication date: November 23, 2017Applicants: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: David Auchere, Laurent Marechal, Yvon Imbs, Laurent Schwarz
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Publication number: 20170331182Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.Type: ApplicationFiled: August 2, 2017Publication date: November 16, 2017Applicants: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: David Auchere, Laurent Marechal, Laurent Schwarz, Yvon Imbs
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Publication number: 20170323841Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.Type: ApplicationFiled: July 25, 2017Publication date: November 9, 2017Applicants: STMicroelectronics (Alps) SAS, STMicroelectronics (Grenoble 2) SASInventors: Yvon Imbs, Laurent Schwarz, David Auchere, Laurent Marechal
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Patent number: 9754851Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: GrantFiled: February 22, 2016Date of Patent: September 5, 2017Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: David Auchere, Laurent Marechal, Yvon Imbs, Laurent Schwarz
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Patent number: 9754853Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.Type: GrantFiled: February 22, 2016Date of Patent: September 5, 2017Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: David Auchere, Laurent Marechal, Laurent Schwarz, Yvon Imbs
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Patent number: 9748159Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.Type: GrantFiled: February 22, 2016Date of Patent: August 29, 2017Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: Yvon Imbs, Laurent Schwarz, David Auchere, Laurent Marechal
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Publication number: 20170092557Abstract: An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.Type: ApplicationFiled: February 22, 2016Publication date: March 30, 2017Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: Yvon Imbs, Laurent Schwarz, David Auchere, Laurent Marechal
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Publication number: 20170062298Abstract: An electronic device includes a support board having a mounting face and an integrated circuit chip mounted on the mounting face. An encapsulation block embeds the integrated circuit chip, the encapsulation block extending above the integrated circuit chip and around the integrated circuit chip on the mounting face of the support board. The encapsulation block includes a front face with a hole passing through the encapsulation block to uncovering at least part of an electrical contact. A layer made of an electrically conducting material fills the hole to make electrical connection to the electrical contact and further extends over the front face of the encapsulation block.Type: ApplicationFiled: February 22, 2016Publication date: March 2, 2017Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: David Auchere, Laurent Marechal, Laurent Schwarz, Yvon Imbs
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Publication number: 20170062299Abstract: An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.Type: ApplicationFiled: February 22, 2016Publication date: March 2, 2017Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Alps) SASInventors: David Auchere, Laurent Marechal, Yvon Imbs, Laurent Schwarz
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Patent number: 9402331Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.Type: GrantFiled: October 10, 2014Date of Patent: July 26, 2016Assignee: STMICROELECTRONICS (GRENOBLE 2) SASInventors: David Auchere, Yvon Imbs
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Patent number: 9029928Abstract: A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. A passive component including at least one conductive plate and a dielectric plate is positioned adjacent the integrated circuit chip. An encapsulation block embeds the integrated circuit chip and the passive component, the block having a frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. An electrical connection is made between the electrical connection frontside and the passive component. That electrical connection includes connection lines placed on the wafer frontside and wafer backside. The electrical connection further includes at least one via passing through the encapsulation block.Type: GrantFiled: July 11, 2011Date of Patent: May 12, 2015Assignee: STMicroelectronics (Grenoble 2) SASInventors: Laurent Marechal, Yvon Imbs, Romain Coffy
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Publication number: 20150103489Abstract: An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.Type: ApplicationFiled: October 10, 2014Publication date: April 16, 2015Applicant: STMICROELECTRONICS (GRENOBLE 2) SASInventors: David AUCHERE, Yvon IMBS
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Publication number: 20140206154Abstract: A semiconductor device includes a wafer having a frontside and a backside. The wafer is formed from at least one integrated circuit chip having an electrical connection frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. A passive component including at least one conductive plate and a dielectric plate is positioned adjacent the integrated circuit chip. An encapsulation block embeds the integrated circuit chip and the passive component, the block having a frontside co-planar with the wafer frontside and a backside co-planar with the wafer backside. An electrical connection is made between the electrical connection frontside and the passive component. That electrical connection includes connection lines placed on the wafer frontside and wafer backside. The electrical connection further includes at least one via passing through the encapsulation block.Type: ApplicationFiled: March 21, 2014Publication date: July 24, 2014Applicant: STMICROELECTRONICS (GRENOBLE 2) SASInventors: Romain Coffy, Yvon Imbs, Laurent Marechal