Abstract: A method for forming an ink jetting device includes providing a silicon substrate having a first surface having formed thereon a plurality of electrical heater elements to form a first upper exposed surface; depositing a polymer over the first upper exposed surface to form a sacrificial polymer layer; patterning the sacrificial polymer layer to form a second exposed upper surface; depositing a conformal material over the second exposed upper surface to form a conformal nozzle layer; patterning the conformal nozzle layer to form a plurality of nozzle holes located over the electrical heater elements; patterning a mask layer to form an exposed region of the second surface of the silicon substrate that defines a location of a central ink via; etching the exposed region to form the central ink via; and removing a portion of a remainder of the polymer layer to form ink ejection chambers.