Abstract: Embodiments of the inventive concept include Open Cloud Server (OCS)-compliant and other enterprise servers having high-density modular non-volatile flash memory blades and associated multi-card modules. A modular non-volatile flash memory blade can be seated within a 1U tray. The flash memory blade can include a server motherboard and multiple non-volatile flash memory blade multi-card modules. Each of the multi-card modules can include a printed circuit board, a switch coupled to the printed circuit board, a module power port, an input/output port, and riser card slots to receive solid state drive riser cards. The solid state drive riser cards can be seated within a corresponding riser card slot of the multi-card modules, and can each include multiple solid state drive chips. The server motherboard can communicate with the solid state drive chips via the cable connector riser cards and associated cables.

Abstract: Embodiments of the inventive concept include a plurality of memory ranks, a buffer chip including a rank remap control section configured to remap a rank from among the plurality of memory ranks of the volatile memory module responsive to a failure of the rank, and a dynamic serial presence detect section configured to dynamically update a stated total capacity of the volatile memory module based at least on the remapped rank. In some embodiments, a memory module includes a plurality of memory ranks, an extra rank in addition to the plurality of memory ranks, the extra rank being a spare rank configured to store a new page corresponding to a failed page from among the plurality of ranks, and a buffer chip including a page remap control section configured to remap the failed page from among the plurality of ranks to the new page in the extra rank.

Abstract: Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each memory group in a memory array from a total memory thermal budget based on the workload of each memory group. In this manner, the memory groups having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. Thus, the individual and overall memory group performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.

Abstract: Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each processor from a total processor thermal budget based on the workload of each processor. In this manner, the processor(s) having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. The individual and overall processor performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.

Abstract: An embodiment includes a memory module, comprising: a module error interface; and a plurality of memory devices, each memory device coupled to the module error interface, including a data interface and an device error interface, and configured to communicate error information through the device error interface and the module error interface.

Abstract: Disclosed is a communication device having an automatic reply function and a method for performing automatic reply thereof. The communication device includes a communication module for receiving a communication request signal; a positioning module for generating positioning information according to a current position of the communication device; a vibration detection module configured to detect a vibration of the communication device to generate a vibration signal; and a processing module. In an interval upon the communication module receiving the communication request signal, the processing module is configured to calculate a velocity of the communication device according to the positioning information and calculate an incidence of vibration of the communication device according to the vibration signal.

Abstract: Exemplary embodiments include a socket interposer having a first plurality of connectors, at least one of on-board memory socket and a memory. The first plurality of connectors is configured to fit with a first form factor of a memory socket on a server board. The at least one on-board memory socket includes at least a second plurality of connectors and has a second form factor configured for a memory module having a first memory type. The memory has a second memory type different from the first memory type of the memory module.

Abstract: Exemplary embodiments include a socket interposer having a first plurality of connectors, at least one of on-board memory socket and a memory. The first plurality of connectors is configured to fit with a first form factor of a memory socket on a server board. The at least one on-board memory socket includes at least a second plurality of connectors and has a second form factor configured for a memory module having a first memory type. The memory has a second memory type different from the first memory type of the memory module.

Abstract: Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each memory group in a memory array from a total memory thermal budget based on the workload of each memory group. In this manner, the memory groups having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. Thus, the individual and overall memory group performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.

Abstract: Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each processor from a total processor thermal budget based on the workload of each processor. In this manner, the processor(s) having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. The individual and overall processor performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.

Abstract: Exemplary embodiments include a socket interposer having a plurality of connectors configured to attach to a server board, the server board including: a first processor socket having a processor form factor, and a first memory associated with the first processor socket, a processor inserted into the at least first processor socket, the processor having access to the first memory, and a second processor socket having the processor form factor, and a second memory associated with the second processor socket, wherein the plurality of connectors are configured to fit the processor form factor; and a multi-modal I/O interface having a first mode and a second mode, wherein in the first mode provides processor-to-processor communication, and the second mode provides the first processor with accessibility to the second memory associated with the second processor socket.

Abstract: An embodiment includes a system, comprising: a circuit; an energy harvesting device configured to convert energy from the circuit to electrical energy; an energy storage device configured to store the electrical energy; and a power supply configured to supply power from the energy storage device, and multi-sensor module including such a system.

Abstract: Disclosed is a communication device having an automatic reply function and a method for performing automatic reply thereof The communication device includes a communication module for receiving a communication request signal; a positioning module for generating positioning information according to a current position of the communication device; a vibration detection module configured to detect a vibration of the communication device to generate a vibration signal; and a processing module. In an interval upon the communication module receiving the communication request signal, the processing module is configured to calculate a velocity of the communication device according to the positioning information and calculate an incidence of vibration of the communication device according to the vibration signal.