Patents by Inventor Zhan PING

Zhan PING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9264859
    Abstract: Disclosed is a communication device having an automatic reply function and a method for performing automatic reply thereof. The communication device includes a communication module for receiving a communication request signal; a positioning module for generating positioning information according to a current position of the communication device; a vibration detection module configured to detect a vibration of the communication device to generate a vibration signal; and a processing module. In an interval upon the communication module receiving the communication request signal, the processing module is configured to calculate a velocity of the communication device according to the positioning information and calculate an incidence of vibration of the communication device according to the vibration signal.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: February 16, 2016
    Assignees: INVENTEC APPLIANCES (PUDONG) CORPORATION, INVENTEC APPLIANCES (SHANGHAI) CO., LTD., INVENTEC APPLIANCES (NANCHANG) CORPORATION
    Inventors: Jianpeng Ding, Zhan-Ping Liu
  • Patent number: 9237670
    Abstract: Exemplary embodiments include a socket interposer having a first plurality of connectors, at least one of on-board memory socket and a memory. The first plurality of connectors is configured to fit with a first form factor of a memory socket on a server board. The at least one on-board memory socket includes at least a second plurality of connectors and has a second form factor configured for a memory module having a first memory type. The memory has a second memory type different from the first memory type of the memory module.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: January 12, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Zhan Ping
  • Publication number: 20150245525
    Abstract: Exemplary embodiments include a socket interposer having a first plurality of connectors, at least one of on-board memory socket and a memory. The first plurality of connectors is configured to fit with a first form factor of a memory socket on a server board. The at least one on-board memory socket includes at least a second plurality of connectors and has a second form factor configured for a memory module having a first memory type. The memory has a second memory type different from the first memory type of the memory module.
    Type: Application
    Filed: February 26, 2014
    Publication date: August 27, 2015
    Applicant: Samsung Electronics, Ltd.
    Inventor: Zhan Ping
  • Publication number: 20150185814
    Abstract: Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each processor from a total processor thermal budget based on the workload of each processor. In this manner, the processor(s) having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. The individual and overall processor performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.
    Type: Application
    Filed: May 30, 2014
    Publication date: July 2, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Zhan PING, Robert BRENNAN, Jason MARTINEAU
  • Publication number: 20150185813
    Abstract: Embodiments of the present inventive concept relate to systems and methods for dynamically allocating and/or redistributing thermal budget to each memory group in a memory array from a total memory thermal budget based on the workload of each memory group. In this manner, the memory groups having a higher workload can receive a higher thermal budget. The allocation can be dynamically adjusted over time. Thus, the individual and overall memory group performance increases while efficiently allocating the total thermal budget. By dynamically sharing the total thermal budget of the system, the performance of the system as a whole is increased, thereby lowering, for example, the total cost of ownership (TCO) of datacenters.
    Type: Application
    Filed: May 30, 2014
    Publication date: July 2, 2015
    Inventors: Zhan PING, Robert BRENNAN, Jason MARTINEAU
  • Publication number: 20150134868
    Abstract: Exemplary embodiments include a socket interposer having a plurality of connectors configured to attach to a server board, the server board including: a first processor socket having a processor form factor, and a first memory associated with the first processor socket, a processor inserted into the at least first processor socket, the processor having access to the first memory, and a second processor socket having the processor form factor, and a second memory associated with the second processor socket, wherein the plurality of connectors are configured to fit the processor form factor; and a multi-modal I/O interface having a first mode and a second mode, wherein in the first mode provides processor-to-processor communication, and the second mode provides the first processor with accessibility to the second memory associated with the second processor socket.
    Type: Application
    Filed: August 7, 2014
    Publication date: May 14, 2015
    Inventors: Ian P. Shaeffer, Zhan Ping
  • Publication number: 20150115868
    Abstract: An embodiment includes a system, comprising: a circuit; an energy harvesting device configured to convert energy from the circuit to electrical energy; an energy storage device configured to store the electrical energy; and a power supply configured to supply power from the energy storage device, and multi-sensor module including such a system.
    Type: Application
    Filed: February 28, 2014
    Publication date: April 30, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Zhan PING
  • Publication number: 20150018004
    Abstract: Disclosed is a communication device having an automatic reply function and a method for performing automatic reply thereof The communication device includes a communication module for receiving a communication request signal; a positioning module for generating positioning information according to a current position of the communication device; a vibration detection module configured to detect a vibration of the communication device to generate a vibration signal; and a processing module. In an interval upon the communication module receiving the communication request signal, the processing module is configured to calculate a velocity of the communication device according to the positioning information and calculate an incidence of vibration of the communication device according to the vibration signal.
    Type: Application
    Filed: June 16, 2014
    Publication date: January 15, 2015
    Inventors: Jianpeng DING, Zhan-Ping LIU