Abstract: A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at least two different layers. At least one force release and stress relief structure is incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.

Abstract: A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.

Abstract: A method for optical layer management of an optical channel in an optical network includes inserting specific data patterns into a frame of an optical signal in the optical channel such that when a framing header is extracted from the optical signal, the specific data patterns are readily identifiable, the specific data patterns being indicative of respective line statuses of the optical channel. Additionally, a method for optical layer management of an optical channel in an optical network includes extracting a frame header from an optical signal in the optical channel and analyzing the optical signal for the presence of previously inserted specific data patterns, the specific data patterns being indicative of respective line statuses of the optical channel.

Abstract: A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.

Abstract: A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at least two different layers. At least one force release and stress relief structure is incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.

Abstract: A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.

Abstract: A new design is provided for the design of a leadframe of a semiconductor package. A ground plane is added to the design of the leadframe, the ground frame is located between the leadframe and the die attach paddle over which the semiconductor device is mounted.

Abstract: An automated method for identifying the precise location of each sub-array and dot of a micro-array is provided. The sub-arrays of the micro-array are located using a template sub-array. The estimated location of each sub-array is estimated according to the expected physical dimension of the sub-array. A search of each sub-array is conducted for the dots of each sub-array. A constraining shape mask is constructed, and a segmentation method is applied to detect the location of each dot within the collection of pixels. The constraining shape mask is applied to each detected dot, limiting the boundary of and precisely identifying the location of each dot.

Abstract: A new design is provided for the die-paddle that is used as part of a package for packaging semiconductor devices. The new design of the invention creates a space between the ground ring of the die-paddle and the surface over which the ground paddle is mounted. The new design further comprises an S-shaped segment between the ground ring and the center of the die-paddle, the S-shaped segment provides stress relieve between the ground ring and the center of the die-paddle.

Abstract: An electrical card connector (1) includes a top lid (10) and a contact module (12). The top lid comprises a metal cover (100) and a pair of elongated grip arms (101) at opposite sides of the metal cover. Each grip arm is separately formed by insert molding at opposite sides of the cover and includes a rail (106) and a rib (107) projecting from a side of the rail. A pivot (108) is provided at a distal end of the rail and a wedge (109) extends from a forward end of the rail opposite the pivot. The contact module includes an insulative housing (120) and plurality of contacts (121). A pair of shaft lids (114) and a pair of lock portions (129) extend rearwardly and forwardly from rear and front corners of the insulative housing. Each shaft lid has a pivot hole (125) for pivotably engaging with a pivot of the grip arms. In use, an electrical card (2) is inserted into the top lid and the top lid is rotated to a closed position.

Abstract: A method for migrating seismic data is disclosed in which seismic traces recorded by a plurality of receivers are separated into offset bands according to the offsets of the traces. The data in each offset band is then migrated according to a downward continuation method. The downward continuation method includes the calculation of a constant that is not dependent on the value of the wave field. The constant is used to calculated the wave field for all offset bands for a given z level, thereby reducing time and computation resources consumed by the migration of the offset bands. Following the downward continuation, an imaging condition may be applied to produce a seismic image.