Patents by Inventor Zhengping Wang
Zhengping Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240148855Abstract: The present disclosure generally relates to a personalized cancer vaccine having attenuated cancer cells transfected with at least one expression construct. The expression construct is capable of secretory expression of an antigenic polypeptide that could be derived from a protein from a virus. The personalized tumor vaccine, when administered to a subject in need thereof, is effective to activate an immune response.Type: ApplicationFiled: March 14, 2022Publication date: May 9, 2024Inventors: Zhengping ZHUANG, Herui WANG, Juan YE, Bin LU
-
Publication number: 20240122917Abstract: Disclosed is the use of a composition containing cilostazol or a pharmaceutically acceptable salt thereof and edaravone in the preparation of a drug for treating cerebrovascular diseases, especially ischemic cerebrovascular diseases. The experiment result shows that the tail vein administration of 1-15 mg/kg of cilostazol or 1.67-8.33 mg/kg of edaravone on rats with a focal cerebral ischemia-reperfusion injury can significantly ameliorate neurological defects in rats with an MCAO and reduce a cerebral infarction area; and performing compound combination within the dosage range (the mass ratio of cilostazol:edaravone is 1:5 to 5:1) can be synergistic. The tail vein administration of 3.33-16.67 mg/kg of cilostazol or 3.33-16.67 mg/kg of edaravone on mice with a focal cerebral ischemia-reperfusion injury can significantly ameliorate neurological defects in mice with an MCAO and reduce a cerebral infarction area.Type: ApplicationFiled: January 26, 2022Publication date: April 18, 2024Applicant: NEURODAWN PHARMACEUTICAL CO., LTD.Inventors: Yao HUA, Lei WANG, Zhengping ZHANG, Rong CHEN, Shibao YANG
-
Publication number: 20240100056Abstract: The present disclosure relates to methods for the treatment of diseases or disorders (e.g., cancer) with mTOR inhibitors. Specifically, the disclosure relates to methods of treating a subject having a cancer by administering a particular dosage of an mTOR inhibitor. In some embodiments this disclosure includes methods for delaying, preventing, or treating acquired resistance to RAS inhibitors using a dosage of an mTOR inhibitor. In some embodiments, this disclosure relates to methods of treating or preventing adverse events associated with administration of an mTOR inhibitor using tacrolimus.Type: ApplicationFiled: November 9, 2023Publication date: March 28, 2024Inventors: Bojena BITMAN, W. Clay GUSTAFSON, Ed LORENZANA, Justin G. MEYEROWITZ, Yu Chi YANG, Mallika SINGH, Zhengping WANG, Zhican WANG
-
Patent number: 11942963Abstract: A follow-hold switch circuit comprising: a follower; a sampling sub-circuit for voltage sampling; a bootstrap-control sub-circuit, which provides a bootstrap voltage to the sampling sub-circuit when the circuit is in a following state; a sampling-switch-control sub-circuit, which provides a common-mode voltage to a bootstrap capacitor in the bootstrap-control sub-circuit when the circuit is in a holding state; the follower is connected to an output of the sampling sub-circuit; the sampling sub-circuit is connected to the bootstrap-control sub-circuit and the sampling-switch-control sub-circuit respectively through a sampling switch; the present disclosure can effectively improve the linearity of sampling switches.Type: GrantFiled: January 19, 2021Date of Patent: March 26, 2024Assignees: NO. 24 RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION, Chongqing GigaChip Technology Co., Ltd.Inventors: Daiguo Xu, Dongbing Fu, Zhengping Zhang, Zhou Yu, Jian'an Wang, Can Zhu, Ruzhang Li, Guangbing Chen, Yuxin Wang, Xueliang Xu
-
Publication number: 20240092899Abstract: Provided is a bispecific antibody, comprising a first antigen-binding moiety and a second antigen-binding moiety, wherein a paired domain of the first antigen-binding moiety comprises an amino acid sequence of engineered HLA-I ?3 and an amino acid sequence of engineered ?2M. Also provided are an expression method for the bispecific antibody, a polynucleotide encoding the bispecific antibody, a vector and host cell containing the polynucleotide, a pharmaceutical composition containing the bispecific antibody, a fusion protein, and a conjugate.Type: ApplicationFiled: January 27, 2022Publication date: March 21, 2024Inventors: Liangliang WANG, Zhengping ZHANG, Congcong SUN, Rongjuan ZHAO, Yimeng LI
-
Publication number: 20240082234Abstract: The present invention belongs to the pharmaceutical field, and relates to an application of a cilostazol and d-borneol composition in preparing a drug for treating cerebrovascular disease, in particular ischemic cerebrovascular disease. The present invention specifically relates to a composition containing cilostazol or a pharmaceutically acceptable salt thereof and d-borneol, and an application of the composition in preparing a drug for treating cerebrovascular disease, in particular ischemic cerebrovascular disease.Type: ApplicationFiled: January 12, 2022Publication date: March 14, 2024Applicant: NEURODAWN PHARMACEUTICAL CO., LTD.Inventors: Yao HUA, Lei WANG, Zhengping ZHANG, Rong CHEN, Shibao YANG
-
Publication number: 20240082249Abstract: The present disclosure relates to methods for the treatment of diseases or disorders (e.g., cancer) with mTOR inhibitors. Specifically, the disclosure relates to methods of treating a subject having a cancer by administering a particular dosage of an mTOR inhibitor. In some embodiments this disclosure includes methods for delaying, preventing, or treating acquired resistance to RAS inhibitors using a dosage of an mTOR inhibitor. In some embodiments, this disclosure relates to methods of treating or preventing adverse events associated with administration of an mTOR inhibitor using tacrolimus.Type: ApplicationFiled: May 25, 2023Publication date: March 14, 2024Inventors: Bojena BITMAN, W. Clay GUSTAFSON, Ed LORENZANA, Justin G. MEYEROWITZ, Yu Chi YANG, Mallika SINGH, Zhengping WANG, Zhican WANG
-
Publication number: 20240073303Abstract: This application provides a folding assembly and a foldable electronic device. The folding assembly is applied to a foldable electronic device, and is configured to carry a flexible display screen. The folding assembly includes a shaft base, a first housing, and a second housing. The first housing and the second housing are respectively disposed on both sides of the shaft base. A door plate swing arm is located above the shaft base and is disposed on each of both sides of a center line of the shaft base, one end of each door plate swing arm is rotatably connected to the shaft base, and the other end of each door plate swing arm is rotatably connected to the first housing or the second housing.Type: ApplicationFiled: January 11, 2022Publication date: February 29, 2024Inventors: Yaolei ZHANG, Zhengping TAN, Mingqian GAO, Yuan WANG, Haifei LI, Guotong ZHOU, Leibo YUAN, Bin YAN, Kuibing ZHAO
-
Patent number: 11762261Abstract: The invention is related to a parametric light generation method and its application and belongs to the technical field of laser and nonlinear optics. The generation method comprises steps as follows: a nonlinear optical material that meets the sum-frequency phase-matched conditions, namely it shall satisfy the energy conservation condition ?p+?i=?s and the momentum conservation condition np?p+ni?i=ns?s simultaneously, is provided; laser light with a wavelength of ?p is injected into the said nonlinear optical material as pump light; then, the material will output signal light with a wavelength of ?S, namely the tunable sum-frequency parametric light. With sum-frequency as the basic principle, the invention can realize frequency up-conversion and obtain visible and UV light sources through simple infrared light sources easily.Type: GrantFiled: August 24, 2021Date of Patent: September 19, 2023Assignee: SHAN DONG UNIVERSITYInventors: Zhengping Wang, Xuezhi Zhao, Fapeng Yu, Xun Sun, Xinguang Xu
-
Publication number: 20230070338Abstract: Disclosed are SHP2 inhibitor compositions and methods of treating diseases or disorders using an intermittent dosing schedule.Type: ApplicationFiled: June 30, 2022Publication date: March 9, 2023Applicant: Revolution Medicines, Inc.Inventors: Steve Kelsey, Mallika Singh, Xiaolin Wang, Zhengping Wang
-
Publication number: 20220127428Abstract: The invention discloses an anti-fouling polyurethane thin film with high elasticity and high transparency, a preparation method and use thereof. The raw materials of the polyurethane thin film include the following active ingredients by mass fractions: 30% to 40% of a hard segment monomer, 40% to 50% of a soft segment monomer, 3% to 6% of a hydrophilic monomer, 0% to 3% of a crosslinking monomer, 0% to 5% of a small molecular chain extender, and 10% to 15% of a compound with low surface energy. A chemically and physically double-crosslinked anti-fouling polyurethane is synthesized through a polycondensation reaction. This thin film exhibits superior low adhesion and anti-fouling properties, and can achieve the coexistence of both low adhesion and stretchability at the same time.Type: ApplicationFiled: January 10, 2022Publication date: April 28, 2022Inventors: Xu Wu, Minhuan Liu, Zhengping Wang, Xiubin Xu, Danfeng Yu, Taoyan Mao
-
Patent number: 11211357Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.Type: GrantFiled: September 30, 2020Date of Patent: December 28, 2021Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGYInventors: Yun Chen, Shuquan Ding, Yunbo He, Maoxiang Hou, Xin Chen, Jian Gao, Ni Zhao, Lanyu Zhang, Zhengping Wang
-
Publication number: 20210389644Abstract: The invention is related to a parametric light generation method and its application and belongs to the technical field of laser and nonlinear optics. The generation method comprises steps as follows: a nonlinear optical material that meets the sum-frequency phase-matched conditions, namely it shall satisfy the energy conservation condition ?p+?i=?s and the momentum conservation condition np?p+ni?i=ns?s simultaneously, is provided; laser light with a wavelength of ?p is injected into the said nonlinear optical material as pump light; then, the material will output signal light with a wavelength of ?s, namely the tunable sum-frequency parametric light. With sum-frequency as the basic principle, the invention can realize frequency up-conversion and obtain visible and UV light sources through simple infrared light sources easily.Type: ApplicationFiled: August 24, 2021Publication date: December 16, 2021Inventors: Zhengping WANG, Xuezhi ZHAO, Fapeng YU, Xun SUN, Xinguang XU
-
Publication number: 20210210461Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.Type: ApplicationFiled: September 30, 2020Publication date: July 8, 2021Inventors: Yun CHEN, Shuquan DING, Yunbo HE, Maoxiang HOU, Xin CHEN, Jian GAO, Ni ZHAO, Lanyu ZHANG, Zhengping WANG
-
Publication number: 20210166981Abstract: The disclosure relates to a method for repairing an internal circuit break defect in a chip, including: S1, detecting the defect position of the chip and the type and performance parameters of a filling material; S2, positioning the chip on a two-dimensional motion platform; S3, setting parameters of two beams of laser; adjusting a focal length of the two beams of laser three-dimensional incident angle and a Z axis, so that a focus point of the two beams of laser irradiate any end of the circuit break of the chip; S4, the two-dimensional motion platform drives the chip to move, so that the focus point of the two beams of laser is moved to an other end of the circuit break, and an moving trajectory of the focus point of the two beams of laser feeds through the two ends of the circuit break of the chip.Type: ApplicationFiled: September 30, 2020Publication date: June 3, 2021Inventors: Yun CHEN, Yao YAO, Shuquan DING, Junyu LONG, Maoxiang HOU, Dachuang SHI, Xin CHEN, Jian GAO, Qiang LIU, Lanyu ZHANG, Yunbo HE, Shenghui ZHANG, Zhengping WANG
-
Patent number: 10427936Abstract: A method of processing nano- and micro-pores includes washing a substrate and cleaning a surface of the substrate; spin-coating photoresist, exposing the substrate and developing to form the substrate with a pattern; 3. depositing micro-nano metal particles on the surface of the substrate; wherein the micro-nano metal particles are centered on a magnetic core; and the surface of the magnetic core is plated with a metal nano-particle coating composed of a plurality of gold, silver or aluminum nanoparticles; removing the photoresist, and maintaining dot arrays of the micro-nano metal particles; applying laser irradiation and a strong uniform magnetic field on the substrate, so that the substrate is processed to form processed structures; and after the processed structures being formed into nano-/micro-pores with targeted pore size, shape and depth, stopping the laser irradiation and removing the strong uniform magnetic field.Type: GrantFiled: December 15, 2018Date of Patent: October 1, 2019Assignee: Guangdong University of TechnologyInventors: Yun Chen, Xin Chen, Dachuang Shi, Jian Gao, Zhengping Wang, Haidong Yang
-
Publication number: 20190185319Abstract: A method of processing nano- and micro-pores includes washing a substrate and cleaning a surface of the substrate; spin-coating photoresist, exposing the substrate and developing to form the substrate with a pattern; 3. depositing micro-nano metal particles on the surface of the substrate; wherein the micro-nano metal particles are centered on a magnetic core; and the surface of the magnetic core is plated with a metal nano-particle coating composed of a plurality of gold, silver or aluminum nanoparticles; removing the photoresist, and maintaining dot arrays of the micro-nano metal particles; applying laser irradiation and a strong uniform magnetic field on the substrate, so that the substrate is processed to form processed structures; and after the processed structures being formed into nano-/micro-pores with targeted pore size, shape and depth, stopping the laser irradiation and removing the strong uniform magnetic field.Type: ApplicationFiled: December 15, 2018Publication date: June 20, 2019Inventors: Yun CHEN, Xin CHEN, Dachuang SHI, Jian GAO, Zhengping WANG, Haidong YANG
-
Publication number: 20190189459Abstract: Disclosed is a processing device for the third generation semiconductor materials. The device includes a reaction device, an operating platform and a support device. A reaction chamber is located inside the reaction device and the upper and lower ends of the reaction device are covered with an upper cover and a lower cover, respectively. An etching solution injection port and an etching solution discharge port are provided at the side wall of the reaction chamber. A stirring excitation coil, a plurality of conducting rods, a plurality of heating rods, a plurality of sealing rings and a workpiece are provided inside of the reaction chamber. The stirring excitation coil is mounted just under the upper cover; the conducting rods and the heating rods are respectively mounted in a circumferentially symmetrical manner in an inner wall of the reaction chamber.Type: ApplicationFiled: December 15, 2018Publication date: June 20, 2019Inventors: Yun CHEN, Xin CHEN, Jian GAO, Zhengping WANG, Haidong YANG
-
Patent number: D858956Type: GrantFiled: January 24, 2018Date of Patent: September 10, 2019Inventor: Zhengping Wang
-
Patent number: D974707Type: GrantFiled: July 21, 2020Date of Patent: January 10, 2023Inventor: Zhengping Wang