Abstract: The invention provides a compound represented by the following structural formula: (I) or a pharmaceutically acceptable salt, or a stereoisomer thereof useful for treating cancer.

Abstract: The present disclosure provides a compound of Formula (I) a pharmaceutically acceptable salt or a stereoisomer and their use in, e.g. treating a condition, disease or disorder in which the inhibition of the interaction of SOS 1 and a RAS-family protein or RAC1 is of therapeutic benefit, specifically in treating oncological diseases. This disclosure also features compositions containing the same as well as methods of using and making the same.

Abstract: The invention provides a compound represented by the following structural formula: (I) or a pharmaceutically acceptable salt, or a stereoisomer thereof useful for treating cancer.

Abstract: A phenylvinylsilane-divinylbenzene-styrene terpolymer is prepared by copolymerizing 50 parts by weight to 70 parts by weight of phenylvinylsilane, 10 parts by weight to 20 parts by weight of divinylbenzene and 20 parts by weight to 30 parts by weight of styrene, the total amount of phenylvinylsilane, divinylbenzene and styrene being 100 parts by weight, wherein the phenylvinylsilane has a structure of Formula (I) or Formula (II). Moreover, a resin composition includes a phenylvinylsilane-divinylbenzene-styrene terpolymer and a vinyl group-containing polyphenylene ether resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol.

Abstract: A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved.

Abstract: A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 ?m; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof.

Abstract: The invention provides a compound represented by the following structural formula: (I) or a pharmaceutically acceptable salt, or a stereoisomer thereof useful for treating cancer.

Abstract: A phosphorus-containing silane compound has a structure of SiR1(R2)n(R3)3-n, wherein R1 is a phenyl group, R2 is a vinyl group, R3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.

Abstract: A phosphorus-containing silane compound has a structure of SiR1(R2)n(R3)3-n, wherein R1 is a phenyl group, R2 is a vinyl group, R3 each independently is a structure of Formula (I) or Formula (II), and n is 1 or 2. Moreover, a method of making the phosphorus-containing silane compound, a resin composition including the phosphorus-containing silane compound and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including Z-axis ratio of thermal expansion, copper foil peeling strength, inner resin flow, branch-like pattern, dielectric constant, dissipation factor and flame retardancy may be improved.

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 100 parts by weight to 250 parts by weight of a spherical silica prepared by vaporized metal combustion, wherein: the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction; the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol.

Abstract: A resin composition includes the following components or a prepolymerized product thereof. (A) 100 parts by weight of a prepolymer and (B) 5 parts by weight to 30 parts by weight of a diallyl bisphenol resin, wherein the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol.

Abstract: Provided is a compound represented by structural formula (I), or a pharmaceutically acceptable salt, or a stereoisomer thereof useful for treating cancer.

Abstract: A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 ?m; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof.

Abstract: The present disclosure relates a compound as an IRAK inhibitor. Specifically, the present disclosure provides a compound of formula I, or a cis-trans isomer, an optical isomer, a racemate, a pharmaceutically acceptable salt, a prodrug, a deuterated derivative thereof, a hydrate or a solvate thereof. The compounds disclosed herein have potent inhibitory effects on IRAK and thus have therapeutic effect on IRAK-related diseases.

Abstract: A quaternary lactam compound of formula (I). The compound is used in the manufacture of a medicament for the treatment and/or prevention of thrombotic or thromboembolic disorders.

Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

Abstract: A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved.

Abstract: The present disclosure pertains to the technical field of resin composite materials and more particularly relates to resin compositions and articles made therefrom, including a resin film, a prepreg, a laminate or a printed circuit board, wherein the resin composition comprises a phosphorus-containing flame retardant of Formula (I) and a prepolymerized resin prepared at least from a divinylbenzene compound, an allyl resin and an acrylate resin. The resin compositions may be further used to make a resin film, a prepreg, a laminate or a printed circuit board, which has the properties of absence of branch-like pattern on laminate surface, high glass transition temperature, low ratio of thermal expansion, and high copper foil peeling strength.

Abstract: A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.