Patents by Inventor Zhi-Ping Wu

Zhi-Ping Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100128442
    Abstract: A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of the socket. The legs contact the top surface of the board to support the socket on the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base.
    Type: Application
    Filed: May 12, 2009
    Publication date: May 27, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTDRY CO., LTD
    Inventors: ZHI-PING WU, XIAO-FENG WANG, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO
  • Publication number: 20090166164
    Abstract: A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.
    Type: Application
    Filed: April 14, 2008
    Publication date: July 2, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: ZHI-PING WU, CHIH-HANG CHAO, YU-HSU LIN, JENG-DA WU
  • Publication number: 20090166062
    Abstract: A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier.
    Type: Application
    Filed: May 10, 2008
    Publication date: July 2, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: ZHI-PING WU, JENG-DA WU, YU-HSU LIN, CHIH-HANG CHAO, LIANG-LIANG CAO
  • Patent number: 7447014
    Abstract: A bracket assembly for receiving at least one disk drive (40) includes an enclosure (10), a retaining bracket (30), and a connecting structure (312). The retaining bracket includes a pair of sidewalls (31, 32). The retaining bracket is attached to the enclosure at an edge of each sidewall. The connecting structure is defined in a first sidewall (31) of the sidewalls for attaching the first sidewall to the enclosure for altering a fixing relationship between the retaining bracket and the enclosure. The connecting structure is positioned near the disk drive, and away from the edge of the first sidewall. The method of assembling the bracket (30) to the enclosure (10) is also provided.
    Type: Grant
    Filed: September 23, 2006
    Date of Patent: November 4, 2008
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Hang Chao, Yu-Hsu Lin, Jeng-Da Wu, Zhi-Ping Wu
  • Publication number: 20080074836
    Abstract: A bracket assembly for receiving at least one disk drive (40) includes an enclosure (10), a retaining bracket (30), and a connecting structure (312). The retaining bracket includes a pair of sidewalls (31, 32). The retaining bracket is attached to the enclosure at an edge of each sidewall. The connecting structure is defined in a first sidewall (31) of the sidewalls for attaching the first sidewall to the enclosure for altering a fixing relationship between the retaining bracket and the enclosure. The connecting structure is positioned near the disk drive, and away from the edge of the first sidewall. The method of assembling the bracket (30) to the enclosure (10) is also provided.
    Type: Application
    Filed: September 23, 2006
    Publication date: March 27, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-HANG CHAO, YU-HSU LIN, JENG-DA WU, Zhi-Ping Wu