Abstract: An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink defines a receiving portion at a lateral side thereof. The heat pipe includes an evaporating section attached to the first heat sink, a condensing section attached to the second heat sink and a connecting section interconnecting the evaporating section with the condensing section. An engaging portion protrudes from a lateral side of the second heat sink and is firmly embedded in and lockable with the receiving portion of the first heat sink. The heat pipe extends through the engaging portion.

Abstract: A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber.

Abstract: A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber.

Abstract: A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.

Abstract: An exemplary flat heat pipe includes a flat housing, a wick, a working fluid, and a supporting element. The wick is attached to an inner surface of the housing. The working fluid is contained in the housing. The supporting element is a woven screen made of metal wires and a plurality of through holes is defined therein. The supporting element is enclosed by the wick and opposite sides thereof bias the wick against opposite portions of the housing.

Abstract: A fastening device is used for connecting a first and a second fan together. The two fans each have an upper flange and a lower flange and a cylindrical body interconnecting the upper flange and the lower flange. The fastening device includes a plate-shaped pad and two resilient portions respectively extending perpendicularly from two opposite sides of the pad. The two resilient portions respectively extend through the lower flange of the first fan and the upper flange of the second fan, pressing against the first fan and the second fan toward each other. The pad is sandwiched between the lower flange of the first fan and the upper flange of the second fan.

Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.

Abstract: An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

Abstract: A light source device includes a first heat dissipation structure, an LED module, a heat energy convertor and a fan. The first heat dissipation structure includes a heat dissipation base, a first fin group attached on a top surface of the heat dissipation base. The LED module is attached on a bottom surface of the heat dissipation base of the first heat dissipation structure. The heat energy convertor is thermally connected to the heat dissipation base of the first heat dissipation structure through heat pipes, and configured for changing heat energy generated by the LED module into kinetic energy. The fan is disposed over the first fin group and driven by the heat energy convertor.

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract: An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.

Abstract: An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.

Abstract: A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the lower plate and the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomboid apertures communicating with each other for containing the working liquid therein.

Abstract: An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.

Abstract: A vapor chamber includes a container, a wick structure attached to an inner surface of the container, and a supporting structure received in the container and abutting against opposite sidewalls of the container. The supporting structure is generally in the form of a metallic sheet and comprises a plurality of supporting members extending upwardly from thereof. A through hole is defined in the supporting member from top to bottom. An opening is defined between the adjoining supporting members. Opposite ends of the supporting members abut against the wick structure located at the opposite sidewalls of the container.

Abstract: A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a plurality of supporting posts received in the casing and at least a metallic wire connecting the supporting posts. Each supporting post defines at least a channel therein. The at least a metallic wire engagingly extends through the channels of the supporting posts. Top and bottom ends of the supporting posts engage the wick structure to reinforce a structure of the vapor chamber.

Abstract: An LED assembly for an LED lamp includes a replaceable bracket and a plurality of LED units mounted on the bracket. The bracket includes a frame and a plurality of mutually crossed beams interconnected in the frame to define a plurality of square openings. Each LED unit includes a printed circuit board, a heat sink secured below the printed circuit board and fixed on the bracket, and a plurality of LEDs mounted on the printed circuit board to be exposed in the openings in the bracket. The bracket can have different configuration so that light beams generated by the LEDs are parallel to each other, in a convergent manner or in a divergent manner.

Abstract: A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber.