Patents by Inventor Zhi Yong Zhou

Zhi Yong Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7674011
    Abstract: An LED lamp includes a heat dissipation device and a plurality of LED modules. The heat dissipation device includes a heat conductive member and a fin unit. The LED modules are attached to a top surface of a first plate of the heat conductive member. The heat conductive member comprises a plurality of posts embedded in the top surface of the first plate. Peripheries of the first and second plates are in a hermetical conjunction with each other to form a chamber containing phase-changeable working fluid therein. The first plate has a plurality of receiving recessions which are depressed downwardly from the top surface thereof and respectively receive the posts. Screws are used to extend through the LED modules to threadedly engage in the posts thereby to intimately mount the LED modules on the top surface of the first plate of the heat conductive member.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: March 9, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Zhi-Yong Zhou, Qiao-Li Ding
  • Patent number: 7655079
    Abstract: A gas-liquid separation apparatus includes an inlet pipe for transferring liquid with gas dissolved therein and a separating pipe for separating the gas from the liquid. The separating pipe has a spiral-shaped guiding member therein. The separating pipe extends from the inlet pipe and is in alignment and communicating with the inlet pipe. An outlet pipe extends from a joint of the inlet pipe and the separating pipe and communicates with the separating pipe, for transferring therein the liquid after the liquid has been degassed by the spiral-shaped guiding member in the separating pipe. A gas storage device communicates with the separating pipe and outside for collecting the gas from the separating pipe and discharging the gas to the outside.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: February 2, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20100014966
    Abstract: A fastening device is used for connecting a first and a second fan together. The two fans each have an upper flange and a lower flange and a cylindrical body interconnecting the upper flange and the lower flange. The fastening device includes a plate-shaped pad and two resilient portions respectively extending perpendicularly from two opposite sides of the pad. The two resilient portions respectively extend through the lower flange of the first fan and the upper flange of the second fan, pressing against the first fan and the second fan toward each other. The pad is sandwiched between the lower flange of the first fan and the upper flange of the second fan.
    Type: Application
    Filed: September 30, 2008
    Publication date: January 21, 2010
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Zhi-Yong Zhou, Qiao-Li Ding, Hai-Bing Cao
  • Patent number: 7645330
    Abstract: A gas-liquid separation apparatus includes a container and a separating pipe located in the container. The container includes an annular wall and two lids covering two ends of the wall. The container has a cavity surrounded by the wall and the two lids. An inlet extends through one lid and an outlet extends through the other lid. The separating pipe is disposed in the cavity of the container and in communication with the inlet and the outlet of the container. A plurality of apertures is defined in a body of the separating pipe and in communication with a space inside the separating pipe and the cavity of the container. The liquid with gas dissolved therein enters into the separating pipe via the inlet of the container. The liquid is degassed by the separating pipe. The de-gassed liquid exits the separating pipe via the outlet of the container.
    Type: Grant
    Filed: October 27, 2006
    Date of Patent: January 12, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Qiao-Li Ding
  • Publication number: 20090321054
    Abstract: A heat dissipation device includes a first heat sink thermally contacting an electronic component, a second heat sink connecting to the first heat sink, and a heat pipe thermally connecting the first heat sink with the second heat sink. The first heat sink has a first base which defines a cutout at a lateral side thereof. The second heat sink has a second base. The heat pipe includes an evaporating portion disposed on the base, a condensing portion disposed on the second base and a connecting portion interconnecting the evaporating portion with the condensing portion. An insert portion protrudes from the second base and is engagingly inserted into the cutout. The connecting portion of the heat pipe extends through the insert portion.
    Type: Application
    Filed: March 6, 2009
    Publication date: December 31, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Ji-Yun Qin, Zhi-Yong Zhou
  • Publication number: 20090310372
    Abstract: An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.
    Type: Application
    Filed: September 25, 2008
    Publication date: December 17, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20090266513
    Abstract: A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader.
    Type: Application
    Filed: September 29, 2008
    Publication date: October 29, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: HAI-GANG XIONG, ZHI-YONG ZHOU
  • Publication number: 20090268409
    Abstract: A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein.
    Type: Application
    Filed: October 10, 2008
    Publication date: October 29, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: ZHI-YONG ZHOU, JI-YUN QIN, XIAO-JIAN HE
  • Publication number: 20090268476
    Abstract: A heat dissipation device includes a heat conductive member, a fin unit coupled to a bottom surface of the heat conductive member and a plurality of LED modules attached to a top surface of the heat conductive member. The heat conductive member consists of a first plate, a second plate parallel to the first plate and a plurality of posts sandwiched between the first and second plates. Peripheries of the first and second plate are in a hermetical conjunction with each other to form a chamber containing a phase-changeable working fluid therein. The first and second plates therein define a plurality of through orifices. The posts each define therein a screwed orifice which is in alignment with corresponding through orifices of the first and second plates respectively and threadedly receives a screw extending through the LED module.
    Type: Application
    Filed: June 1, 2008
    Publication date: October 29, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20090267474
    Abstract: An LED lamp includes a heat dissipation device and a plurality of LED modules. The heat dissipation device includes a heat conductive member and a fin unit. The LED modules are attached to a top surface of a first plate of the heat conductive member. The heat conductive member comprises a plurality of posts embedded in the top surface of the first plate. Peripheries of the first and second plates are in a hermetical conjunction with each other to form a chamber containing phase-changeable working fluid therein. The first plate has a plurality of receiving recessions which are depressed downwardly from the top surface thereof and respectively receive the posts. Screws are used to extend through the LED modules to threadedly engage in the posts thereby to intimately mount the LED modules on the top surface of the first plate of the heat conductive member.
    Type: Application
    Filed: June 5, 2008
    Publication date: October 29, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Zhi-Yong Zhou, Qiao-Li Ding
  • Patent number: 7597133
    Abstract: A heat dissipation device includes a fin set, first and second base plates and first and second heat pipes. The first base plate has a face for contacting a heat generating electronic device. The first heat pipe includes first and second sections sandwiching the fin set between the first and second sections and engaging with the fin set. The first and second base plates sandwich the first heat pipe and the fin set between the first and second base plates and engage with the first heat pipe and the fin set. The second heat pipe includes first and second sections sandwiching the first heat pipe, the fin set, the first and second base plates between the first and second sections of the second heat pipe and engaging with the first and second base plates.
    Type: Grant
    Filed: December 25, 2005
    Date of Patent: October 6, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Cheng-Tien Lai, Zhi-Bin Tan, Zhi-Yong Zhou, Jiang-Jian Wen
  • Publication number: 20090244894
    Abstract: An LED assembly for an LED lamp includes a replaceable bracket and a plurality of LED units mounted on the bracket. The bracket includes a frame and a plurality of mutually crossed beams interconnected in the frame to define a plurality of square openings. Each LED unit includes a printed circuit board, a heat sink secured below the printed circuit board and fixed on the bracket, and a plurality of LEDs mounted on the printed circuit board to be exposed in the openings in the bracket. The bracket can have different configuration so that light beams generated by the LEDs are parallel to each other, in a convergent manner or in a divergent manner.
    Type: Application
    Filed: September 1, 2008
    Publication date: October 1, 2009
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20090225518
    Abstract: A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.
    Type: Application
    Filed: September 1, 2008
    Publication date: September 10, 2009
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: CHI-YUAN LAI, ZHI-YONG ZHOU, CHENG-TIEN LAI
  • Patent number: 7584781
    Abstract: A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.
    Type: Grant
    Filed: August 11, 2006
    Date of Patent: September 8, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou
  • Patent number: 7576987
    Abstract: A clip includes a body with a first end and a second end, an actuating member pivotally coupled to the second end of the body via a pivot, and a movable fastener pivotally coupled to the actuating member at a location apart from and above the pivot. The body has a leg formed at the first end of the body for mounting and the movable fastener has an engaging structure for mounting. The actuating member and the movable fastener are assembled to apply leverage such that when the actuating member is brought to pivot about the pivot, the movable fastener is driven to move between a relaxed position and a locked position where the actuating member is substantially covered by the movable fastener and the engaging structure of the movable fastener securely engages a protrusion of a retention module.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: August 18, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng-Tien Lai, Zhi-Yong Zhou, Jian Hu
  • Publication number: 20090194254
    Abstract: A heat dissipation device adapted for removing heat from LED modules of an LED lamp includes a plurality of heat sinks, a plurality of fin sets and a plurality of heat pipes extending through the fin sets and thermally connecting the heat sinks and the fin sets together. The heat sinks each have a base plate with a bottom surface which is kept in contact with corresponding LED modules and a plurality of fins arranged on a top surface of the base plate. Each of the fin sets consists of a plurality of flakes and defines a plurality of air passages between the flakes. Air can flow through the heat dissipation device from a place thereunder to a place thereabove via the air passages between the flakes of the fin sets.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 6, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: ZHI-YONG ZHOU, GUANG YU, QIAO-LI DING
  • Publication number: 20090166004
    Abstract: A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure.
    Type: Application
    Filed: December 29, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20090166000
    Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHI-YUAN LAI, ZHI-YONG ZHOU, CHENG-TIEN LAI
  • Publication number: 20090166008
    Abstract: A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING
  • Publication number: 20090166003
    Abstract: A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein.
    Type: Application
    Filed: December 27, 2007
    Publication date: July 2, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG-TIEN LAI, ZHI-YONG ZHOU, QIAO-LI DING