Abstract: Enclosure covers for mobile computing devices are often formed from planar sections of sheet metal that form opposing outer-most layers thereof. The enclosure covers generally enclose and protect internal components. Enclosure covers for mobile computing devices are typically made from planar extrusions of aluminum with subsequent computer numerical control (CNC) machining and other processing steps to achieve complex shapes. Machining can be particularly wasteful of material and numerous processing steps are time-consuming and costly. The presently disclosed variable thickness enclosure covers sourced from extruded sheets of variable thickness reduce or eliminate machining and other processing steps typically required to achieve a desired complex shape. This is accomplished by extruding a shape closer to the desired shape of the variable thickness enclosure cover than presently known.

Abstract: Enclosure covers for mobile computing devices are often formed from planar sections of sheet metal that form opposing outer-most layers thereof. The enclosure covers generally enclose and protect internal components. Enclosure covers for mobile computing devices are typically made from planar extrusions of aluminum with subsequent computer numerical control (CNC) machining and other processing steps to achieve complex shapes. Machining can be particularly wasteful of material and numerous processing steps are time-consuming and costly. The presently disclosed variable thickness enclosure covers sourced from extruded sheets of variable thickness reduce or eliminate machining and other processing steps typically required to achieve a desired complex shape. This is accomplished by extruding a shape closer to the desired shape of the variable thickness enclosure cover than presently known.

Abstract: A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

Abstract: A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

Abstract: Housings for electronic devices may include a steel body, such as a stainless steel body, that has an outer portion and an inner portion. The outer portion may exhibit an average Vickers hardness of 200 HV or higher. The inner portion may exhibit an average Vickers hardness of 180 HV or lower. The lower hardness of the inner portion may facilitate working the material of the inner portion, such as to form attachment points, protrusions, holes, or other features. Various additional devices, methods, and systems are also disclosed.

Abstract: An electronic device includes a display with a glass planar portion and a second material position at an outer edge of the glass planar portion. The glass planar portion defines a majority of a display surface of the display, and the second material is molded to the outer edge of the glass planar portion and defines at least part of a border portion. The second material is curved in a direction perpendicular to the display surface. The second material is composed of a first plurality of segments and a second plurality of segments. Each segment of the second plurality of segments is interposed between adjacent segments of the first plurality of segments, and the first plurality of segments interlock with the second plurality of segments.

Abstract: Enclosure covers for mobile computing devices are often formed from planar sections of sheet metal that form opposing outer-most layers thereof. The enclosure covers generally enclose and protect internal components. Enclosure covers for mobile computing devices are typically made from planar extrusions of aluminum with subsequent computer numerical control (CNC) machining and other processing steps to achieve complex shapes. Machining can be particularly wasteful of material and numerous processing steps are time-consuming and costly. The presently disclosed variable thickness enclosure covers sourced from extruded sheets of variable thickness reduce or eliminate machining and other processing steps typically required to achieve a desired complex shape. This is accomplished by extruding a shape closer to the desired shape of the variable thickness enclosure cover than presently known.

Abstract: A method of manufacturing an electronic device housing includes obtaining a monolithic body of RF transparent material and plating a surface of the monolithic body with a nanograin coating to increase the structural rigidity of the monolithic body. A portion of the nanograin coating is thereafter removed to create an RF window.

Abstract: The description relates to devices, such as computing devices that can include structural assemblies. One example can include a structural component defining a periphery of the structural assembly and an internal region of the structural assembly. The example can also include a sacrificial component positioned in the internal region and secured to the structural component by a breakaway connector that defines a first void and an opposing second void that is at least partially offset from the first void.

Abstract: The description relates to devices, such as computing devices that can include structural assemblies. One example can include a structural component defining a periphery of the structural assembly and an internal region of the structural assembly. The example can also include a sacrificial component positioned in the internal region and secured to the structural component by a breakaway connector that defines a first void and an opposing second void that is at least partially offset from the first void.

Abstract: An article comprises a bulk layer of an aluminum-alloy composite and a surface layer. The bulk layer comprises an aggregate dispersed in an aluminum-alloy matrix, the aggregate being solid and unreactive in a melt of the aluminum-alloy matrix, and having an average particle size of 100 microns or less. The surface layer comprises an anodized form of the bulk layer.

Abstract: A method for use in manufacturing a metal part is provided. The method may include casting liquid metal in a ceramic mold. The ceramic mold may be formed via an investment casting process in which a wax mold is used to as a form for the ceramic mold, and the wax is melted away from the ceramic mold prior to its use. The method may further include cooling the liquid metal in the ceramic mold to form a solid metal part, and then divesting the ceramic mold to release the metal part. The metal part may include an imperfection in a shape of the metal part. To correct the imperfection, the method may include shaping the metal part by near-net shape forging.

Abstract: A system and process for reducing cosmetic defects such as black lines, and otherwise improving the final cosmetic appearance of anodized parts is disclosed. The process can include degreasing an aluminum or other metal part in a neutral to low alkaline solution having a mild detergent, chemically polishing the metal part with a specialized solution having one or more additives at an increased temperature for a reduced amount of time, and anodizing the metal part at a reduced voltage and for a reduced amount of time. An activating step can also be performed as part of the overall process. Tap water rinse, deionized water rinse, desmut, seal and bake procedures can also be performed on the metal part.

Abstract: An improved stamping die assembly is provided for controlling the flow of sheet metal during the draw forming process. The die assembly includes a textured die surface on the one or both sides of the binder mating surfaces that replaces conventional draw and lock beads. The textured die surface can be formed using direct metal deposition of a hard material, harder than the existing die surfaces, on the existing die base material to achieve an engineered textured surface. The textured die surface optimizes the performance of the die by enabling longer die life, higher coefficients of friction between the mating binder surfaces and reduction of wrinkles and stringers typically caused by draw and lock beads in the draw forming process.

Abstract: An improved stamping die assembly is provided for controlling the flow of sheet metal during the draw forming process. The die assembly includes a textured die surface on the one or both sides of the binder mating surfaces that replaces conventional draw and lock beads. The textured die surface can be formed using direct metal deposition of a hard material, harder than the existing die surfaces, on the existing die base material to achieve an engineered textured surface. The textured die surface optimizes the performance of the die by enabling longer die life, higher coefficients of friction between the mating binder surfaces and reduction of wrinkles and stringers typically caused by draw and lock beads in the draw forming process.