Abstract: Disclosed is an information providing method of an electronic apparatus. The information providing method includes identifying identification information of at least one item included in a set of items, and, based on the identification information of the at least one item, providing at least one of information associated with the packing material and information associated with the coolant, each information associated with the at least one item.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising a memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching a data store to determine a tag, volume, and weight associated with each item; sorting the items into groups based on the tags of the items; performing an optimization process for each group of items having the same tag by: creating a data structure representing a first package of the group; iteratively simulating packing a largest remaining item of the group into the first package, wherein if the simulating determines that a threshold is exceeded: creating an additional data structure representing an additional package, and iteratively simulating packing a largest remaining item until all items of the group are packed into a package; and generating at least one list of items for the data structures representing packages.

Abstract: The automatic packaging acquisition system includes at least one processor executing the instructions for performing operations. The operations may include receiving forecast data indicating a first expected number of packages over a first period of time required to ship an expected number of orders handled by a first fulfillment center, determining the historical scan events from a plurality of mobile devices associated with the first fulfillment center over a second period of time, determining a second number of packages based on the determined historical scan events, calculating a target quantity of packages based on the first expected number of packages and a value indicating cover days, instantiating a first electronic order for packages, based on the calculated target quantity, a current quantity of packages, an ordered number of packages, and the second number of packages; and send the first order to a remote computer system.

Abstract: The automatic packaging acquisition system includes at least one processor executing the instructions for performing operations. The operations may include receiving forecast data indicating a first expected number of packages over a first period of time required to ship an expected number of orders handled by a first fulfillment center, determining the historical scan events from a plurality of mobile devices associated with the first fulfillment center over a second period of time, determining a second number of packages based on the determined historical scan events, calculating a target quantity of packages based on the first expected number of packages and a value indicating cover days, instantiating a first electronic order for packages, based on the calculated target quantity, a current quantity of packages, an ordered number of packages, and the second number of packages; and send the first order to a remote computer system.

Abstract: A display device and a manufacturing method of the display device are provided. The display device includes a base substrate and a plurality of spacers on the base substrate; each of the plurality of spacers has an end facing away from the base substrate, and the end is provided with a sloping surface; and included angels between the sloping surfaces of the plurality of spacers and the base substrate are all acute angles or are all obtuse angles.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising a memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching a data store to determine a tag, volume, and weight associated with each item; sorting the items into groups based on the tags of the items; performing an optimization process for each group of items having the same tag by: creating a data structure representing a first package of the group; iteratively simulating packing a largest remaining item of the group into the first package, wherein if the simulating determines that a threshold is exceeded: creating an additional data structure representing an additional package, and iteratively simulating packing a largest remaining item until all items of the group are packed into a package; and generating at least one list of items for the data structures representing packages.

Abstract: The present disclosure provides systems and methods for automated bag packaging, comprising at least one processor; and memory storing comprising: receiving an order comprising at least one item; searching at least one data store to determine one or more properties associated with each item; for each group: performing an optimization process for packaging the at least one item into one or more bags, by: selecting a data structure representing a first bag, the data structure comprising a size of the first bag; iteratively simulating packaging of a largest item of the group into the first bag until all items are packaged in the selected bag; generating at least one set of instructions for packaging the items into the selected bag; and sending the generated instructions to a computer system for display, the instructions including at least one item identifier and one bag identifier.

Abstract: The automatic packaging acquisition system includes at least one processor executing the instructions for performing operations. The operations may include receiving forecast data indicating a first expected number of packages over a first period of time required to ship an expected number of orders handled by a first fulfillment center, determining the historical scan events from a plurality of mobile devices associated with the first fulfillment center over a second period of time, determining a second number of packages based on the determined historical scan events, calculating a target quantity of packages based on the first expected number of packages and a value indicating cover days, instantiating a first electronic order for packages, based on the calculated target quantity, a current quantity of packages, an ordered number of packages, and the second number of packages; and send the first order to a remote computer system.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching at least one data store to determine tags and properties associated with each item; sorting the items into at least one group; for each group: performing an optimization process for packaging the items in the group, by: selecting a data structure representing a first package; iteratively simulating packaging of a largest item of the group into the first package until all items are packaged, wherein if the simulating determines that the items in the group do not fit into the selected package: choosing a larger package, iteratively packing until all items are packed in the larger package; and generating set of instructions for packaging the items into the box; and sending the generated instructions for display.

Abstract: The package configuration optimization system includes at least one non-transitory storage medium comprising instructions and at least one processor executing the instructions for performing operations. The operations may include receiving historical order data associated with a fulfillment center, the order data including at least one of items ordered, package information, shipping costs, or fill rate, generating a forecast for order data based on the historical order data and performance data associated with the fulfillment center, the forecast comprising a plurality of dummy orders, receiving preferences for packaging cost reduction, determining a current packaging configuration associated with the fulfillment center, optimizing the current packaging configuration to generate at least one new packaging configuration using the received preferences and the generated forecast, and sending the at least one new packaging configuration to a remote system.

Abstract: Embodiments described herein provide techniques of forming an interconnect structure using lithographic and deposition processes. The interconnect structure can be used to couple components of a semiconductor package. For one example, a semiconductor package includes a die stack and an interconnect structure formed on the die stack. The die stack comprises a plurality of dies. Each die in the die stack comprises: a first surface; a second surface opposite the first surface; sidewall surfaces coupling the first surface to the second surface; and a pad on the first surface. A one sidewall surface of one of the dies has a sloped profile. The semiconductor package also includes an interconnect structure positioned on the first surfaces and the sidewall with the sloped profile. In this semiconductor package, the interconnect structure electrically couples the pad on each of the dies to each other.

Abstract: A display substrate, a display panel, a display device and a bonding method are provided. The display panel substrate includes: a transparent substrate comprising a display area and a bonding area located at the periphery of the display area. The bonding area is provided with a first bonding pad connected with a touch electrode, and a second bonding pad connected with a display electrode. One of the touch electrode and the display electrode is located in the display area, and the other electrode is located on another transparent substrate facing to the transparent substrate.

Abstract: An apparatus comprising: a die stack comprising at least one die pair, the at least one die pair having a first die over a second die, the first die and the second die both having a first surface and a second surface, the second surface of the first die over the first surface of the second die; and an adhesive film between the first die and the second die of the at least one die pair; wherein the adhesive film comprises an insulating layer and a conductive layer, the insulating layer adhering to the second surface of the first die and the conductive layer adhering to the first surface of the second die.

Abstract: A display substrate, a display panel, a display device and a bonding method are provided. The display panel substrate includes: a transparent substrate comprising a display area and a bonding area located at the periphery of the display area. The bonding area is provided with a first bonding pad connected with a touch electrode, and a second bonding pad connected with a display electrode. One of the touch electrode and the display electrode is located in the display area, and the other electrode is located on another transparent substrate facing to the transparent substrate.

Abstract: The present disclosure provides systems and methods for automatic packaging determination comprising memory storing instructions and at least one processor performing steps comprising: receiving an order comprising at least one item; searching at least one data store to determine tags and properties associated with each item; sorting the items into at least one group; for each group: performing an optimization process for packaging the items in the group, by: selecting a data structure representing a first package; iteratively simulating packaging of a largest item of the group into the first package until all items are packaged, wherein if the simulating determines that the items in the group do not fit into the selected package: choosing a larger package, iteratively packing until all items are packed in the larger package; and generating set of instructions for packaging the items into the box; and sending the generated instructions for display.

Abstract: The present disclosure provides systems and methods for automated bag packaging, comprising at least one processor; and memory storing comprising: receiving an order comprising at least one item; searching at least one data store to determine one or more properties associated with each item; for each group: performing an optimization process for packaging the at least one item into one or more bags, by: selecting a data structure representing a first bag, the data structure comprising a size of the first bag; iteratively simulating packaging of a largest item of the group into the first bag until all items are packaged in the selected bag; generating at least one set of instructions for packaging the items into the selected bag; and sending the generated instructions to a computer system for display, the instructions including at least one item identifier and one bag identifier.

Abstract: A display substrate including a base substrate and an optical functional layer provided on the base substrate. The optical functional layer includes a black matrix providing a plurality of first shading strips and a plurality of second shading strips. The plurality of first shading strips intersect with the plurality of second shading strips so as to divide the display substrate into a plurality of pixel units. A thickness of the first shading strips is different from that of the second shading strips.

Abstract: The present disclosure provides a display substrate, a display panel and a method for repairing bright spots in a display panel. The display substrate includes a base substrate and an optical functional layer provided on the base substrate, the optical functional layer includes a black matrix, the black matrix includes a plurality of first shading strips and a plurality of second shading strips, and the plurality of first shading strips intersect with the plurality of second shading strips so as to divide the display substrate into a plurality of pixel units, wherein a thickness of the first shading strips is different from that of the second shading strips.

Abstract: A method for implementing a packet I/O engine on a programmable computing platform is provided, where the engine performs I/O functions for plural threads generated by a plurality of user applications. In the method, the platform is configured such that only one thread is permitted to initialize and configure the resources. Furthermore, I/O-device queues each for buffering packets either transmitted to or received from an individual external I/O device are set up. For a plurality of unsafe I/O-device queues determined, among the I/O-device queues, to be multi-thread unsafe, a plurality of multi-producer, multi-consumer software queues for buffering packets delivered between the plurality of the unsafe I/O-device queues and the plurality of user applications is set up.

Abstract: Compute-intensive packet processing (CIPP) in a computer system comprising a programmable computing platform is accelerated by using a packet I/O engine, implemented on the platform, to perform packet I/O functions, where the packet I/O engine is configured to achieve direct access to a network interface card (NIC) from a user application. For a Linux-based computer system, standard I/O mechanisms of Linux are bypassed and only the packet I/O engine is used in performing the I/O functions. Furthermore, the computer system is configured to: process a batch of packets, instead of packet by packet, in every function call; and when moving a packet between a buffer of an individual user application and a queue of the packet I/O engine, copy a packet descriptor of the packet instead the entire packet. In addition, workflows across different working threads are balanced and parallelism is exploited to fully utilize resources of the platform.