Abstract: The present application provides a 4-dimensional trajectory regulatory decision-making method for air traffic. The method includes: acquiring a node vector set of a target flight to obtain a target node vector set; acquiring the node vector set of all historical flights simultaneously to obtain a historical node vector set; acquiring a similarity between the target node vector set and the node vector set of each historical flight in the historical node vector set to obtain a plurality of similarity data; acquiring a similarity data which is greater than a preset similarity data from plurality of similarity data to obtain a target similarity data; acquiring a historical flight to which the target similarity data belongs to obtain a target historical flight; acquiring a historical decision-making instruction of the target historical flight to obtain a target decision-making instruction.

Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

Abstract: In certain aspects, a device for wireless transmission includes a transmission path, a feedback path, and a DPD control module. The transmission path includes a digital pre-distortion (DPD) conversion module configured to perform pre-distortion processing on an amplitude and a phase of a transmission signal based on a pre-distortion processing strategy. The transmission path further includes a power amplifier coupled to a downstream of the DPD conversion module and configured to amplify a power of the transmission signal. The feedback path is coupled to the transmission path at the downstream of the power amplifier and configured to generate a feedback signal. The feedback path includes a static gain compensation module configured to be activated during an initial time period of each frame to track and update a static gain for the feedback signal and configured to hold the static gain after the initial time period of each frame.

Abstract: In one embodiment, a system includes an automatic speech recognition (ASR) module, a natural-language understanding (NLU) module, a dialog manager, one or more agents, an arbitrator, a delivery system, one or more processors, and a non-transitory memory coupled to the processors comprising instructions executable by the processors, the processors operable when executing the instructions to receive a user input, process the user input using the ASR module, the NLU module, the dialog manager, one or more of the agents, the arbitrator, and the delivery system, and provide a response to the user input.

Abstract: In certain aspects, a device for wireless transmission includes a transmission path, a feedback path, and a DPD control module. The transmission path includes a digital pre-distortion (DPD) conversion module configured to perform pre-distortion processing on an amplitude and a phase of a transmission signal based on a pre-distortion processing strategy. The transmission path further includes a power amplifier coupled to a downstream of the DPD conversion module and configured to amplify a power of the transmission signal. The feedback path is coupled to the transmission path at the downstream of the power amplifier and configured to generate a feedback signal. The feedback path includes a static gain compensation module configured to be activated during an initial time period of each frame to track and update a static gain for the feedback signal and configured to hold the static gain after the initial time period of each frame.

Abstract: In certain aspects, a device for wireless transmission includes a transmission path, a feedback path, and a DPD control module. The transmission path includes a digital pre-distortion (DPD) conversion module configured to perform pre-distortion processing on an amplitude and a phase of a transmission signal based on a pre-distortion processing strategy. The transmission path further includes a power amplifier coupled to a downstream of the DPD conversion module and configured to amplify a power of the transmission signal. The feedback path is coupled to the transmission path at the downstream of the power amplifier and configured to generate a feedback signal. The DPD control module is coupled to the feedback path and the DPD conversion module and configured to adjust the pre-distortion processing strategy based on an amplitude difference and a phase difference between the transmission signal and the feedback signal.

Abstract: The present invention discloses a wavelength-modulable spectrum generator as well as a system and method for measuring concentration of a gas component based thereon. The wavelength-modulable spectrum generator includes a filter plate, a to-be-measured gas box and a light intensity receiving plate. A plate surface of the filter plate is encircled with N filter holes, and a filter lens with a specific refractive index is correspondingly fixedly arranged in each filter hole. A light source mounting position is fixed to a side of an in-light surface of the filter plate. After any light source is mounted at the light source mounting position, lights of the light source irradiate the filter lens. A rotation and deflection driving mechanism is connected with an out-light surface of the filter plate and drives the filter plate to rotate or deflect along the axis according to a preset angle.

Abstract: A structure and a method for packaging an image sensor chip. The structure includes: an image sensor chip and a substrate. The image sensor chip includes a first surface and a second surface that are opposite to each other, and the first surface is provided with multiple pixels configured to collect image information and multiple first bonding pads connected with the multiple pixels. The substrate covers the first surface of the image sensor chip, and is provided with wiring and a contact terminal connected with the wiring. A periphery of the image sensor chip is bonded to the substrate via an anisotropic conductive adhesive, the multiple first bonding pads are electrically connected with the contact terminal via the anisotropic conductive adhesive, and the anisotropic conductive adhesive surrounds all the multiple pixels and is not overlapped with the multiple pixels in a direction perpendicular to the substrate.

Abstract: A packaging method and a packaging structure for a semiconductor chip. The packaging method comprises: providing a wafer, the water being provided with a functional area and solder pads arranged on a first surface; forming vias on a second surface of the wafer, the bottom of the vias exposing the solder pads; forming metal wiring layers at the bottom and on the sidewalls of the vias, the metal wiring layers extending to the second surface of the wafer, the metal wiring layers being electrically connected to the corresponding solder pads; forming a solder mask layer on the second surface of the wafer and in the vias; forming grooves on the solder mask layer at positions corresponding to the vias, the difference between the depth of the grooves and the depth of the vias being 0-20 micrometers.

Abstract: The present invention discloses a wavelength-modulable spectrum generator as well as a system and method for measuring concentration of a gas component based thereon. The wavelength-modulable spectrum generator includes a filter plate, a to-be-measured gas box and a light intensity receiving plate. A plate surface of the filter plate is encircled with N filter holes, and a filter lens with a specific refractive index is correspondingly fixedly arranged in each filter hole. A light source mounting position is fixed to a side of an in-light surface of the filter plate. After any light source is mounted at the light source mounting position, lights of the light source irradiate the filter lens. A rotation and deflection driving mechanism is connected with an out-light surface of the filter plate and drives the filter plate to rotate or deflect along the axis according to a preset angle.

Abstract: An optical fingerprint recognition chip package and a packaging method are provided. In the optical fingerprint recognition chip package, a cover plate is arranged on a front surface of an optical fingerprint recognition chip, the cover plate includes a substrate and a light shielding layer. The light shielding layer is arranged on a surface of the substrate facing away from the optical fingerprint recognition chip. The substrate is provided with multiple first through holes for exposing photosensitive pixels of the optical fingerprint recognition chip. The light shielding layer is provided with multiple second through holes in one-to-one correspondence with the first through holes. During fingerprint recognition, light reflected by a finger is split through the first through holes and the second through holes, such that crosstalk among different photosensitive pixels is reduced, and the accuracy of fingerprint recognition is improved.

Abstract: A structure and a method for packaging an image sensor chip. The structure includes: an image sensor chip and a substrate. The image sensor chip includes a first surface and a second surface that are opposite to each other, and the first surface is provided with multiple pixels configured to collect image information and multiple first bonding pads connected with the multiple pixels. The substrate covers the first surface of the image sensor chip, and is provided with wiring and a contact terminal connected with the wiring. A periphery of the image sensor chip is bonded to the substrate via an anisotropic conductive adhesive, the multiple first bonding pads are electrically connected with the contact terminal via the anisotropic conductive adhesive, and the anisotropic conductive adhesive surrounds all the multiple pixels and is not overlapped with the multiple pixels in a direction perpendicular to the substrate.

Abstract: An image sensing chip package and an image sensing chip packaging method are provided. In the image sensing chip package, an image sensing chip is located in a through hole of a substrate, and a front surface of the image sensing chip is flush with a first surface of the substrate. In this way, in the image sensing chip package, a height of the image sensing chip is controlled with the first surface of the substrate as a reference. Since the first surface of the substrate does not change in the packaging process, almost no uncontrollable factor affects the height of the image sensing chip.

Abstract: A package and a packaging method are provided. The package includes a chip unit, a protective cover plate, and an adhesive unit. The chip unit has a first surface, where the first surface includes a device region. The protective cover plate has a second surface opposite to the first surface of the chip unit. The adhesive unit is located between the first surface of the chip unit and the second surface of the protective cover plate and is configured to bond the chip unit with the protective cover plate. The adhesive unit includes a first region and a second region having different viscosities.

Abstract: An optical fingerprint recognition chip package and a packaging method are provided. In the optical fingerprint recognition chip package, a cover plate is arranged on a front surface of an optical fingerprint recognition chip, the cover plate includes a substrate and a light shielding layer. The light shielding layer is arranged on a surface of the substrate facing away from the optical fingerprint recognition chip. The substrate is provided with multiple first through holes for exposing photosensitive pixels of the optical fingerprint recognition chip. The light shielding layer is provided with multiple second through holes in one-to-one correspondence with the first through holes. During fingerprint recognition, light reflected by a finger is split through the first through holes and the second through holes, such that crosstalk among different photosensitive pixels is reduced, and the accuracy of fingerprint recognition is improved.

Abstract: A semiconductor device and a manufacture method of the semiconductor device are provided. In the semiconductor device, a back surface of a substrate is covered with a first insulating layer, where the first insulating layer covers the bottom and the sidewall of a through hole and the back surface of the substrate outside the through hole. The first insulating layer outside the through hole is covered with a second insulating layer. When etching the first insulating layer at the bottom of the through hole, although an etching speed for a region outside the through hole is greater than an etching speed for the bottom of the through hole, the first insulating layer outside the through hole is protected from being over-etched by the second insulating layer, which improves reliability of the device.

Abstract: A chip packaging method and a chip package are provided. According to the chip packaging method and the chip package, to-be-packaged chips are located in a plastic packaging layer, and front surfaces of the to-be-packaged chips are flush with a first surface of the plastic packaging layer, and the plastic packaging material for manufacturing the plastic packaging layer has good plasticity before a curing process, so that the formed first surface and the second surface have good smoothness, thereby ensuring the reliability of the package.

Abstract: A negotiation mode processing method and an intelligent network device relate to the field of communications technologies, and used to improve application flexibility of the intelligent network device. The method includes determining, by an intelligent network device, that a physical layer (PHY) receives an auto-negotiation configuration stream from a network device connected to the PHY, and changing a negotiation mode of another PHY in the intelligent network device from a non-auto-negotiation mode to an auto-negotiation mode. The auto-negotiation configuration stream indicates that the device sending the auto-negotiation configuration stream is in the auto-negotiation mode. In this way, the application flexibility of the intelligent network device can be improved, and further improves communication quality of the network device.

Abstract: A fingerprint chip packaging method and a fingerprint chip package are provided. During a process of packaging a fingerprint chip, the fingerprint chip is directly packaged and protected by a mold compound layer to form a thin package. With the fingerprint chip packaging method and the fingerprint chip package, the thickness of the package is greatly reduced, which facilitates miniaturization of the electronic device. Further, since the mold compound layer formed after curing of a mold compound material has a great mechanical strength, the mold compound layer can serve as a carrier substrate for mounting other electronic components of the electronic device, such that the integration of the electronic device is greatly improved, the space of the circuit board is saved, thereby facilitating the miniaturization of the electronic device.