Abstract: A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.

Abstract: Disclosed are a photography control method, device, non-transitory storage medium and system of an intelligent photography system. The photography control method of the intelligent photography system includes: acquiring a target positioning image shot by the search camera and a viewfinder screen image shot by the shooting camera, and transmitting the target positioning image and the viewfinder screen image to a remote terminal for the remote terminal to generate a search camera angle adjustment instruction according to the target positioning image and the viewfinder screen image; receiving the search camera angle adjustment instruction sent by the remote terminal; and acquiring an angle adjustment parameter according to the search camera angle adjustment instruction to control the search camera to adjust an angle.

Abstract: A method of tie bar removal is provided. The method includes forming a leadframe including a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from a plane of the flag. A semiconductor die is attached to the flag of the leadframe. A molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is separated from the molding compound with an angled cavity remaining in the molding compound.

Abstract: The invention provides an intelligent device and a method for controlling a boot screen of the intelligent device, applicable to the intelligent device supporting video hardware decompression. The method for controlling the boot screen of the intelligent device specifically comprises steps of: completing hardware initialization operation by the intelligent device, and storing a preset image in the first storage area, thereby enabling the image layer to display the preset image; starting a system kernel which controls the video driver module, and starting the video layer through the video driver module; reading the corresponding preset image in the first storage area, converting the preset image into video data, and writing the video data into the second storage area, thereby enabling the video layer to display the video data; and starting an application access to the system.

Abstract: Disclosed is an intelligent photography system including an intelligent tripod head, a search camera, a shooting camera, a communication component and a control component. The search camera is mounted on the intelligent tripod head, and configured to search for a target to be shot. The shooting camera is mounted on the intelligent tripod head, and configured to take a target image. The communication component is fixed on the intelligent tripod head. The control component includes a circuit board component electrically connected with the intelligent tripod head, the search camera, the shooting camera and the communication component respectively, so that remote control of the shooting camera for shooting is realized, photographers are freed, and better effects are achieved.

Abstract: A method of tie bar removal is provided. The method includes forming a leadframe including a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from a plane of the flag. A semiconductor die is attached to the flag of the leadframe. A molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is separated from the molding compound with an angled cavity remaining in the molding compound.

Abstract: A semiconductor device package is provided that incorporates an antenna structure within the package through use of three-dimensional additive manufacturing processes. Embodiments can provide semiconductor device packages that are thinner than traditional device packages by depositing specific metal and dielectric layers within the package in desired positions with precision that cannot be provided by other manufacturing techniques. Further, embodiments can provide antenna geometries and orientations that cannot be provided by other manufacturing techniques.

Abstract: A method of tie bar removal is provided. The method includes forming a leadframe including a tie bar and a flag. The tie bar extends from a side rail of the leadframe and has a distal portion at an angle different from a plane of the flag. A semiconductor die is attached to the flag of the leadframe. A molding compound encapsulates the semiconductor die, a portion of the leadframe, and the distal portion of the tie bar. The tie bar is separated from the molding compound with an angled cavity remaining in the molding compound.

Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes attaching a semiconductor die to a package substrate. A bond pad of the semiconductor die is coupled to an antenna radiator formed on the package substrate. A waveguide is attached to the package substrate. An opening of the waveguide includes sidewalls substantially surrounding the antenna radiator. An epoxy material is deposited over at least a portion of the package substrate while leaving the opening void of epoxy material.

Abstract: Disclosed are a photography control method, device, non-transitory storage medium and system of an intelligent photography system. The photography control method of the intelligent photography system includes: acquiring a target positioning image shot by the search camera and a viewfinder screen image shot by the shooting camera, and transmitting the target positioning image and the viewfinder screen image to a remote terminal for the remote terminal to generate a search camera angle adjustment instruction according to the target positioning image and the viewfinder screen image; receiving the search camera angle adjustment instruction sent by the remote terminal; and acquiring an angle adjustment parameter according to the search camera angle adjustment instruction to control the search camera to adjust an angle.

Abstract: Disclosed is an intelligent photography system including an intelligent tripod head, a search camera, a shooting camera, a communication component and a control component. The search camera is mounted on the intelligent tripod head, and configured to search for a target to be shot. The shooting camera is mounted on the intelligent tripod head, and configured to take a target image. The communication component is fixed on the intelligent tripod head. The control component includes a circuit board component electrically connected with the intelligent tripod head, the search camera, the shooting camera and the communication component respectively, so that remote control of the shooting camera for shooting is realized, photographers are freed, and better effects are achieved.

Abstract: Embodiments are provided for package semiconductor devices, each device including: a low stress pad structure comprising: a dielectric layer, a seed layer having: a center section, and a ring section formed around the center section and over a top surface of the dielectric layer, wherein the ring section of the seed layer includes a set of elongated openings through which a portion of the top surface of the dielectric layer is exposed, and a metal layer having: an inner section formed over a top surface of the center section of the seed layer, and an outer section formed over a top surface of the ring section of the seed layer, wherein a bottom surface of the outer section of the metal layer directly contacts the portion of the top surface of the dielectric layer exposed through the set of elongated openings.

Abstract: Embodiments are provided for package semiconductor devices, each device including: a low stress pad structure comprising: a dielectric layer, a seed layer having: a center section, and a ring section formed around the center section and over a top surface of the dielectric layer, wherein the ring section of the seed layer includes a set of elongated openings through which a portion of the top surface of the dielectric layer is exposed, and a metal layer having: an inner section formed over a top surface of the center section of the seed layer, and an outer section formed over a top surface of the ring section of the seed layer, wherein a bottom surface of the outer section of the metal layer directly contacts the portion of the top surface of the dielectric layer exposed through the set of elongated openings.

Abstract: A semiconductor device package that incorporates a waveguide usable for high frequency applications, such as radar and millimeter wave is provided. Embodiments employ a rigid-flex printed circuit board structure that can be folded to form the waveguide while, at the same time, mounting one or more semiconductor device die or packages. Embodiments reduce both the area of the mounted package and the distance signals need to travel between the semiconductor device die and antennas associated with the waveguide.

Abstract: A semiconductor device package is provided that incorporates an antenna structure within the package through use of three-dimensional additive manufacturing processes. Embodiments can provide semiconductor device packages that are thinner than traditional device packages by depositing specific metal and dielectric layers within the package in desired positions with precision that cannot be provided by other manufacturing techniques. Further, embodiments can provide antenna geometries and orientations that cannot be provided by other manufacturing techniques.

Abstract: A method of manufacturing a packaged semiconductor device is provided. The method includes attaching a semiconductor die to a package substrate. A bond pad of the semiconductor die is coupled to an antenna radiator formed on the package substrate. A waveguide is attached to the package substrate. An opening of the waveguide includes sidewalls substantially surrounding the antenna radiator. An epoxy material is deposited over at least a portion of the package substrate while leaving the opening void of epoxy material.

Abstract: A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening.

Abstract: An embodiment of a device includes a package body having a first sidewall, a top surface, and a bottom surface, and multiple pads that are exposed at the first sidewall and that are electrically coupled to one or more electrical components embedded within the package body. The device also includes a package surface conductor coupled to the first sidewall. The package surface conductor extends between and electrically couples the multiple pads, and the package surface conductor is formed from a first surface layer and a second surface layer formed on the first surface layer. The first surface layer directly contacts the multiple pads and the first sidewall and is formed from one or more electrically conductive first materials, and the second surface layer is formed from one or more second materials that are significantly more resistive to materials that can be used to remove the first materials.

Abstract: A method of fabricating a 3D fan-out structure for an integrated circuit device includes providing a substrate carrier having first and second opposing surfaces and an aperture extending between the first and second surfaces. A first semiconductor die is bonded to the first surface of the substrate carrier such that the first die covers the aperture of the substrate carrier. An encapsulant and a second die are deposited within the aperture of the substrate carrier such that an active surface of the second die is exposed and coplanar with the second surface of the substrate carrier. One or more redistribution layers are then applied on the second surface of the substrate carrier to form a 3D fan-out structure.

Abstract: A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening.