Abstract: According to an example, a structure is generally described. The structure may include an inductor core having a plurality of surfaces; and at least one conductor integrated with at least one surface of the plurality of surfaces of the inductor core.

Abstract: A power electronic module is provided that includes an electrical connection on opposing surfaces of an electronic component that allows a high current path from a top board to a bottom board through the body of the electronic component thus improving the power electronic module's electrical resistance and reducing the current load on the connector structure which is located between the first substrate and the second substrate. The power electronic module further includes a semiconductor component positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink thus providing an efficient system thermal management via a reduced heat dissipation path. Additional heat dissipation can be obtained by disposing a metallic spacer on the semiconductor component of the power electronic module of the present disclosure.

Abstract: A power electronic module is provided that includes an electrical connection on opposing surfaces of an electronic component that allows a high current path from a top board to a bottom board through the body of the electronic component thus improving the power electronic module's electrical resistance and reducing the current load on the connector structure which is located between the first substrate and the second substrate. The power electronic module further includes a semiconductor component positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink thus providing an efficient system thermal management via a reduced heat dissipation path. Additional heat dissipation can be obtained by disposing a metallic spacer on the semiconductor component of the power electronic module of the present disclosure.

Abstract: One embodiment of the present invention relates to a memory cell. The memory cell comprises a substrate and a stacked gate structure disposed on the substrate, wherein the stacked gate structure comprises a charge trapping dielectric layer that is adapted to store at least one bit of data. The memory cell further includes a source and drain in the substrate, wherein the source and drain are disposed at opposite sides of the stacked gate structure. A barrier region is disposed substantially beneath the source or the drain and comprises an inert species. Other embodiments are also disclosed.

Abstract: Semiconductor devices having reduced parasitic current and methods of malting the semiconductor devices are provided. Further provided are memory devices having reduced adjacent wordline disturb. The memory devices contain wordlines formed over a semiconductor substrate, wherein at least one wordline space is formed between the wordlines. Adjacent wordline disturb is reduced by implanting one or more of indium, boron, and a combination of boron and indium in the surface of the at least one wordline space.

Abstract: Selecting an array from among a plurality of arrays in a memory as a reference array. An exemplary method includes evaluating memory cells within the reference array to select a first reference cell associated with a first operation of the memory, and repeating the evaluating and the selecting to select a second reference cell from within the reference array, the second reference cell being associated with a second operation of the memory.

Abstract: Disclosed herein are system, method and computer program product embodiments for utilizing soft programming a nonvolatile memory. An embodiment operates by sequentially applying a single soft programming voltage pulse to all memory cells along each word line in the nonvolatile memory that fail soft programming verification in a first phase. This sequential application of the single soft programming voltage pulse in the first phase may repeat a predetermined number of times or until a threshold is met. Once the predetermined number of times completes, or the threshold is met, soft programming proceeds to a second phase where soft programming remains with each word line until all memory cells along the word line passes soft programming verification.

Abstract: Disclosed herein are system, method and computer program product embodiments for utilizing soft programming a nonvolatile memory. An embodiment operates by sequentially applying a single soft programming voltage pulse to all memory cells along each word line in the nonvolatile memory that fail soft programming verification in a first phase. This sequential application of the single soft programming voltage pulse in the first phase may repeat a predetermined number of times or until a threshold is met. Once the predetermined number of times completes, or the threshold is met, soft programming proceeds to a second phase where soft programming remains with each word line until all memory cells along the word line passes soft programming verification.

Abstract: Selecting an array from among a plurality of arrays in a memory as a reference array. An exemplary method includes evaluating memory cells within the reference array to select a first reference cell associated with a first operation of the memory, and repeating the evaluating and the selecting to select a second reference cell from within the reference array, the second reference cell being associated with a second operation of the memory.

Abstract: A non-volatile memory device comprising a memory cell array including a plurality of non-volatile memory cells arranged in rows and columns, wherein memory cells arranged in a same row share a word line and memory cells arranged in a same column share a bit line; and at least an address decoder to provide a negative voltage to at least one non-accessed word line in said array when a programming or erasure voltage is provided along a shared bit line.

Abstract: A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.

Abstract: A semiconductor device includes a substrate and a memory cell formed on the substrate. The memory cell includes a word line. The semiconductor device also includes a protection area formed in the substrate, a conductive structure configured to extend the word line to the protection area, and a contact configured to short the word line and the protection area.

Abstract: A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.

Abstract: An apparatus and method for dimming a light emitting diode (LED) driver. The apparatus includes a triode alternating current (TRIAC) dimmer and an LED driver receiving an input voltage from an output of the TRIAC dimmer so that the state of the LED driver is controlled by the TRIAC dimmer. The LED driver includes an active damping circuit configured for damping, upon detecting a rising edge of a bridge rectified input voltage, resonance caused by the TRIAC dimmer and the LED driver for a fixed period of time.

Abstract: A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.

Abstract: A semiconductor device includes a substrate, a memory cell formed on the substrate, and a contact to the substrate. The contact is formed in an area away from the memory cell and functions to raise the potential of the substrate.

Abstract: A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.

Abstract: Systems, methods, and devices that facilitate applying a predefined negative gate voltage to wordlines adjacent to a selected wordline associated with a memory cell selected during a read or verify operation to facilitate reducing adjacent wordline disturb are presented. A memory component can comprise an optimized operation component that can apply a predefined negative gate voltage to wordlines adjacent to a selected wordline associated with a memory cell selected for a read or verify operation, based at least in part on predefined operation criteria, to facilitate reducing adjacent wordline disturb in the selected memory cell to facilitate reducing a shift in the voltage threshold and maintain a desired operation window. The optimized operation component optionally can include an evaluator component that can facilitate determining whether a negative gate voltage applied to adjacent wordlines is to be adjusted to facilitate reducing adjacent wordline disturb below a predetermined threshold amount.

Abstract: A system and methodology that can minimize disturbance during an AC operation associated with a memory, such as, program, read and/or erase, is provided. The system pre-charges all or a desired subset of the bit lines in a memory array to a specified voltage, during an AC operation to facilitate reducing AC disturbances between neighboring cells. A pre-charge voltage can be applied to all bit lines in a block in the memory array, or to bit lines associated with a selected memory cell and neighbor memory cells adjacent to the selected memory cell in the block. The system ensures that source and drain voltage levels can be set to desired levels at the same or substantially the same time, while selecting a memory cell. This can facilitate minimizing AC disturbances in the selected memory cell during the AC operation.

Abstract: Novel fabrication methods implement the use of dummy tiles to avoid the effects of in-line charging, ESD events, and such charge effects in the formation of a memory device region region. One method involves forming at least a portion of a memory core array upon a semiconductor substrate that involves forming STI structures in the substrate substantially surrounding a memory device region region within the array. An oxide layer is formed over the substrate in the memory device region region and over the STI's, wherein an inner section of the oxide layer formed over the memory device region region is thicker than an outer section of the oxide layer formed over the STI's. A first polysilicon layer is then formed over the inner and outer sections comprising one or more dummy tiles formed over one or more outer sections and electrically connected to at least one inner section.