Abstract: A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.

Abstract: A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.

Abstract: An apparatus and method for correcting the ionospheric distortion of an SAR (Synthetic Aperture Radar) interferogram are disclosed herein. The apparatus includes a multiple aperture SAR interferometry (MAI) interferogram generation unit, a transformed MAI interferogram generation unit, an ionospheric distortion interferogram generation unit, and a corrected SAR interferogram acquisition unit. The multiple aperture SAR interferometry (MAI) interferogram generation unit generates a multiple aperture SAR interferometry (MAI) interferogram using an SAR interferogram. The transformed MAI interferogram generation unit generates a transformed MAI interferogram representative of the azimuth direction derivatives of ionospheric distortion phases using the phases of the MAI interferogram. The ionospheric distortion interferogram generation unit generates an ionospheric distortion interferogram using the transformed MAI interferogram.

Abstract: Provided are a method and a system for the correction of an optical satellite image, the method including: a first step in which a satellite image judgment unit inputs and receives a plurality of satellite images divided according to spectral information and judges whether or not some area is a missing satellite image; a second step in which when the satellite image judgment unit judges that the some areas is the missing satellite images, a first interpolation unit inputs and receives the plurality of satellite images and carries out one-dimensional interpolation for each satellite image; a third step in which a second interpolation unit carries out two-dimensional interpolation for each satellite image in which the one-dimensional interpolation is carried out; and a fourth step in which a satellite image composing unit composes a corrected satellite image by gathering each satellite image in which the two-dimensional interpolation is carried out.

Abstract: A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: A system and method are disclosed for applying a die attach epoxy to substrates on a panel of substrates. The system includes a window clamp having one or more windows through which the epoxy may be applied onto the substrate panel. The size and shape of the one or more windows correspond to the size and shape of the area on the substrate to receive the die attach epoxy. Once the die attach epoxy is sprayed onto the substrate through the windows of the window clamp, the die may be affixed to the substrate and the epoxy cured in one or more curing steps. The system may further include a clean-up follower for cleaning epoxy off of the window clamp, and a window cleaning mechanism for cleaning epoxy off of the sidewalls of the windows of the window clamp.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure.

Abstract: A laminating device (230) and method are disclosed for laminating semiconductor die (220) on substrates on a panel (200) of substrates. The laminating device (230) includes lamination units (234,236,238,240) that operate independently of each other so that a row or column of semiconductor die (220) may be independently laminated onto a row or column of substrates simultaneously.

Abstract: A lighting device includes a microwave sensor for adjusting its sensing range based on a range gate selected from multiple range gates. An active antenna module transmits first FMCW signal toward a target based on the selected range gate and for receiving second FMCW signal reflected from the target. The microwave sensor demodulates the first FMCW signal and the second FMCW signal to generate beat frequency signal. Then another demodulator demodulates the beat frequency signal to generate Doppler signal. The microwave sensor calculates a range between the microwave sensor and the target based on the beat frequency signal, calculates velocity of the target according to frequency of the Doppler signal, and determine whether to generate triggering signal according to the calculated velocity and the calculated range, when the object located within the range gate. The power module enables a lamp based on the triggering signal.

Abstract: A semiconductor device including two or more die stacks mounted to a substrate. The first die stack is mounted, at least partially encapsulated, and then tested. If the first die stack functions within predefined parameters, a second die stack is mounted on the first die stack, and then the device may undergo a second encapsulation process. Testing the first die stack before mounting the second improves yield by identifying faulty semiconductor die before all die are mounted within the semiconductor device.

Abstract: A microwave sensor is disclosed. The microwave sensor includes an active antenna module, a first low pass filter, a second demodulator, a modulation module, and a discrimination control module. The active antenna module is utilized for transmitting a first FMCW signal towards a target and receiving a second FMCW signal reflected back from the target according to a sweep period. The active antenna module includes a loop antenna and a radio frequency transistor. The first low pass filter and the radio frequency transistor form a first demodulator. The first demodulator and the second demodulator perform two-stage down converting and demodulating to extract information for calculating range and velocity, respectively. The present invention adjusts a radio frequency bandwidth of the FMCW signal by first adjusting an amplitude of a modulation signal generated by the modulation module to control various detection ranges.

Abstract: Cageless toilet dispensing devices for use in conjunction with a sanitary appliance particularly a toilet, and methods for their use.

Abstract: An active antenna module is disclosed. The active antenna module comprises a loop antenna, a RF transistor, a LR series circuit, a first bypass capacitor and a second bypass capacitor. The RF transistor comprises a control port, a first port, and a second port. Each of two ends of the loop antenna is electrically connected to one of the control port and the second port, and the control port and the second port are out of phase. The second port is electrically connected to the first port via the first bypass capacitor. The first port is electrically connected to ground via the LR series circuit. The second bypass capacitor and a resistor of the LR series circuit are connected in parallel.

Abstract: A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device.

Abstract: The present invention relates to a process for the production of improved toilet dispensing devices for use in conjunction with a sanitary appliance particularly a toilet, and methods of using the same.

Abstract: Provided are a method and a system for the correction of an optical satellite image, the method including: a first step in which a satellite image judgment unit inputs and receives a plurality of satellite images divided according to spectral information and judges whether or not some area is a missing satellite image; a second step in which when the satellite image judgment unit judges that the some areas is the missing satellite images, a first interpolation unit inputs and receives the plurality of satellite images and carries out one-dimensional interpolation for each satellite image; a third step in which a second interpolation unit carries out two-dimensional interpolation for each satellite image in which the one-dimensional interpolation is carried out; and a fourth step in which a satellite image composing unit composes a corrected satellite image by gathering each satellite image in which the two-dimensional interpolation is carried out.

Abstract: A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.

Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.

Abstract: Disclosed is exposure machine, comprising: a loading frame, for placing an object to be exposed; a light source device, located at one side of a plane where the loading frame is positioned, wherein the light emitting direction of the light source device is perpendicular to a plane where the object to be exposed is positioned. During exposure, the loading frame will not reflect the light transmitting through the object to be exposed, and thus the stage spots are avoided. Further, when the exposure machine is operated in a vertical manner, a bidirectional exposure may be achieved only by adding a single prism into the light source device in the prior art, and thus the exposure efficiency is greatly improved.