Publication number: 20240379643
Abstract: An optical module (100, 200, 300), comprising a housing (11, 21, 31) as well as a circuit board (12, 22, 32), a digital signal processing chip (13, 23, 33), a substrate (14, 24, 34) and an optoelectronic chip (15, 25, 35) which are located within the housing (11, 21, 31). The circuit board (12, 22, 32) is provided with, in the thickness direction, a first surface (121, 221, 321) and a second surface (122, 222, 322) which are disposed opposite to one another. The digital signal processing chip (13, 23, 33) is electrically connected to a signal line (1201, 2201) of the circuit board (12, 22, 32) at the first surface (121, 221, 321). The substrate (14, 24, 34) is provided with a third surface (142, 242) and a fourth surface (141, 241) which are disposed opposite to one another. The optoelectronic chip (15, 25, 35) is electrically connected to a signal line (1401, 2401) of the substrate (14, 24, 34).
Type:
Application
Filed:
June 23, 2022
Publication date:
November 14, 2024
Inventors:
Zhen-Zhong WANG, Shuai WANG