Abstract: A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

Abstract: A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.

Abstract: A method for reflowing a solder dispersed between a plurality electrical circuit conductor pads attached to a flexible substrate and at least one electronic component using a laser is disclosed. The method includes aligning the plurality of electric circuit conductor pads along a common axis, placing the at least one electronic component having a light colored surface side on a pair of the electrical circuit conductor pads wherein the light colored surface faces the laser, and sweeping the laser across a plurality of electronic components and conductor pads to reflow the solder without damaging the substrate.

Abstract: A signal transmission system comprising a signal conduction matrix formed into a shape that allows transmission of a signal through the matrix using at least one surface signal router, at least one signal source operatively connected to a surface of the matrix and that generates a signal that propagates through matrix, and at least one signal receiver operatively connected to a surface of the matrix and that receives the signal from the signal source. The signal may be coded, modulated, frequency-converted, or amplified. The surface signal router can be a reflective coating, an indentation, a pressure fit structure, or at least one inclined cut on the surface of the matrix. A frequency-selective filter can be used to allow selective detection by a target signal receiver. The invention is also directed to various method of transmitting a signal using a signal conduction matrix.

Abstract: An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.

Abstract: A central power source and method for distributing power to at least one sensor and/or actuators connected to or integrated in an LCC. In an aspect of the invention, a power distribution system is provided comprising a power source, at least one sensor, an LCC structure, and at least one routing means for directing the energy through the LCC structure. In another aspect, the at least one sensor is connected to an LCC bus connected to an electronic system. In still another aspect, an energy storage means for storing the energy received by the at least one sensor is provided. The invention is also directed to a method for distributing power comprising transmitting energy using a power source, directing the energy through an LCC structure, and receiving the energy from the power source using the at least one sensor.

Abstract: A non-mechanical fluid level sensor based on light communication channel (LCC) technology. In a preferred embodiment, one end of the LCC is connected to a signal source while another end is connected to a sensor. The LCC is dipped in a fluid container and a signal propagates and undergoes internal reflection through the LCC towards one of its ends which is connected to the sensor. The fluid level is detected preferably by measuring the intensity of the signal reflected with the LCC that reaches a sensor. Different fluid levels preferably correspond to linearly varying detected signal intensities. A main LCC bus may communicate remotely with the sensor without wiring or other electrical connectors.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract: A multi-layer circuit board with heat pipes and a method forming a multi-layer circuit board with heat pipes is disclosed. The circuit board includes a heat pump which communicates with the heat pipe to circulate an amount of cooling material within the heat pipe effective to efficiently dissipate heat from the circuit board.

Abstract: A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.

Abstract: There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.

Abstract: A fiber optic lighted instrument panel includes an instrument panel having at least one portion to be illuminated and adapted to be disposed in an occupant compartment of a vehicle. The fiber optic lighted instrument panel also includes a fiber optic light cable extending around the at least one portion. The fiber optic lighted instrument panel further includes a light source connected to the fiber optic light cable to illuminate the at least one portion of the instrument panel.

Abstract: This invention relates generally to the development of and a method of fabricating a fiber optic micro-light source and sensor (50). An optical fiber micro-light source (50) is presented whose aperture is extremely small yet able to act as an intense light source. Light sources of this type have wide ranging applications, including use as micro-sensors (22) in NSOM. Micro-sensor light sources have excellent detection limits as well as photo stability, reversibility, and millisecond response times. Furthermore, a method for manufacturing a micro optical fiber light source is provided. It involves the photo-chemical attachment of an optically active material onto the end surface of an optical fiber cable which has been pulled to form an end with an extremely narrow aperture. More specifically, photopolymerization has been applied as a means to photo-chemically attach an optically active material (60). This process allows significant control of the size of the micro light source (50).

Abstract: This invention relates generally to the development of and a method of fabricating a micro optical fiber light source. An optical fiber micro-light source is presented whose aperture is extremely small yet able to act as an intense light source. Light sources of this type have wide ranging applications, including use as micro-sensors in NSOM. Micro-sensor light sources have excellent detection limits as well as photo stability, reversibility, and millisecond response times. Furthermore, a method for manufacturing a micro optical fiber light source is provided. It involves the photo-chemical attachment of an optically active material onto the end surface of an optical fiber cable which has been pulled to form an end with an extremely narrow aperture. More specifically, photopolymerization has been applied as a means to photo-chemically attach an optically active material. This process allows significant control of the size of the micro light source.