Abstract: A detection unit of a charged particle imaging system includes a multi type detection subunit in the charged particle imaging system, with the assistance of a Wien filter (also known as an E×B charged particle analyzer). The imaging system is suitable for a low beam current, high resolution mode and a high beam current, high throughput mode. The unit can be applied to a scanning electron inspection system as well as to other systems that use a charged particle beam as an observation tool.

Abstract: The present invention relates to a multi-axis magnetic lens for a charged particle beam system. The apparatus eliminates the undesired non-axisymmetric transverse magnetic field components from the magnetic field generated by a common excitation coil and leaves the desired axisymmetric field for focusing each particle beam employed within the system.

Abstract: A selectable Coulomb aperture in charged particle system comprises a non-magnetic conductive plate with a plurality of holes therein. The plurality of holes has variant sizes or diameters to select different beam currents of primary beam in the charged particle system. The charged particle system may include a charged particle source for emitting a primary beam, a condenser lens for receiving the primary beam and condensing the primary beam, an objective lens for receiving the primary beam and focusing the primary beam on a surface of a specimen. The selectable Coulomb aperture is positioned between the charged particle source and the condenser lens.

Abstract: The present invention relates to a multi-axis magnetic lens for a charged particle beam system. The apparatus eliminates the undesired non-axisymmetric transverse magnetic field components from the magnetic field generated by a common excitation coil and leaves the desired axisymmetric field for focusing each particle beam employed within the system.

Abstract: The present invention relates to a charged particle beam apparatus which employs a scanning electron microscope for sample inspection and defect review. The present invent provides solution of improving imaging resolution by utilizing a field emission cathode tip with a large tip radius, applying a large accelerating voltage across ground potential between the cathode and anode, positioning the beam limit aperture before condenser lens, utilizing condenser lens excitation current to optimize image resolution, applying a high tube bias to shorten electron travel time, adopting and modifying SORIL objective lens to ameliorate aberration at large field of view and under electric drifting and reduce the urgency of water cooling objective lens while operating material analysis. The present invent provides solution of improving throughput by utilizing fast scanning ability of SORIL and providing a large voltage difference between sample and detectors.

Abstract: The present invention relates to an operation stage of a charged particle beam apparatus which is employed in a scanning electron microscope for substrate (wafer) edge and backside defect inspection or defect review. However, it would be recognized that the invention has a much broader range of applicability. A system and method in accordance with the present invention provides an operation stage for substrate edge inspection or review. The inspection region includes top near edge, to bevel, apex, and bottom bevel. The operation stage includes a supporting stand, a z-stage, an X-Y stage, an electrostatic chuck, a pendulum stage and a rotation track. The pendulum stage mount with the electrostatic chuck has the ability to swing from 0° to 180° while performing substrate top bevel, apex and bottom bevel inspection or review.

Abstract: System and method for charged particle beam. According an embodiment, the present invention provides a charged particle beam apparatus. The apparatus includes a charged particle source for generating a primary charged particle beam. The apparatus also includes at least one condenser lens for pre-focusing the primary charge particle beam. Furthermore, the apparatus includes a compound objective lens for forming the magnetic field and the electrostatic field to focus the primary charged particle beam onto a specimen in the charged particle beam path. The specimen includes a specimen surface. The compound objective lens includes a conical magnetic lens, an immersion magnetic lens, and an electrostatic lens, the conical magnetic lens including an upper pole piece, a shared pole piece being electrically insulated from the upper pole piece, and an excitation coil.

Abstract: System and method for charged particle beam. According an embodiment, the present invention provides a charged particle beam apparatus. The apparatus includes a charged particle source for generating a primary charged particle beam. The apparatus also includes at least one condenser lens for pre-focusing the primary charge particle beam. Furthermore, the apparatus includes a compound objective lens for forming the magnetic field and the electrostatic field to focus the primary charged particle beam onto a specimen in the charged particle beam path. The specimen includes a specimen surface. The compound objective lens includes a conical magnetic lens, an immersion magnetic lens, and an electrostatic lens, the conical magnetic lens including an upper pole piece, a shared pole piece being electrically insulated from the upper pole piece, and an excitation coil.

Abstract: Novel proton exchange membrane fuel cells and direct methanol fuel cells with nanostructured components are configured with higher precious metal utilization rate at the electrodes, higher power density, and lower cost. To form a catalyst, platinum or platinum-ruthenium nanoparticles are deposited onto carbon-based materials, for example, single-walled, dual-walled, multi-walled and cup-stacked carbon nanotubes. The deposition process includes an ethylene glycol reduction method. Aligned arrays of these carbon nanomaterials are prepared by filtering the nanomaterials with ethanol. A membrane electrode assembly is formed by sandwiching the catalyst between a proton exchange membrane and a diffusion layer that form a first electrode. The second electrode may be formed using a conventional catalyst. The several layers of the MEA are hot pressed to form an integrated unit.

Abstract: The present invention relates to a defect review system, and/or particularly, to an apparatus and method of defect review sampling, review method and classification on a semiconductor wafer or a pattern lithography reticle during integrated circuit fabrication. These objects are achieved in comparing a reviewed image with a reference image pick-up through a smart sampling filter. A clustering computer system base on high speed network will provide data cache and save operation time and memory. A smart review sampling filter automatically relocate abnormal pattern or defects and classify the device location extracted from design database and/or from golden die image on the same substrate. The column of the present defect review system is comprised of the modified SORIL type objective lens. This column provides solution of improving throughput during sample review, material identification better image quality, and topography image of defect.

Abstract: The present invention relates to an operation stage of a charged particle beam apparatus which is employed in a scanning electron microscope for substrate (wafer) edge and backside defect inspection or defect review. However, it would be recognized that the invention has a much broader range of applicability. A system and method in accordance with the present invention provides an operation stage for substrate edge inspection or review. The inspection region includes top near edge, to bevel, apex, and bottom bevel. The operation stage includes a supporting stand, a z-stage, an X-Y stage, an electrostatic chuck, a pendulum stage and a rotation track. The pendulum stage mount with the electrostatic chuck has the ability to swing from 0° to 180° while performing substrate top bevel, apex and bottom bevel inspection or review.

Abstract: The present invention relates to a charged particle beam apparatus which employs a scanning electron microscope for sample inspection and defect review. The present invent provides solution of improving imaging resolution by utilizing a field emission cathode tip with a large tip radius, applying a large accelerating voltage across ground potential between the cathode and anode, positioning the beam limit aperture before condenser lens, utilizing condenser lens excitation current to optimize image resolution, applying a high tube bias to shorten electron travel time, adopting and modifying SORIL objective lens to ameliorate aberration at large field of view and under electric drifting and reduce the urgency of water cooling objective lens while operating material analysis. The present invent provides solution of improving throughput by utilizing fast scanning ability of SORIL and providing a large voltage difference between sample and detectors.

Abstract: Electrocatalyst durability has been recently recognized as one of the most important issues that have to be addressed before the commercialization of the proton exchange membrane fuel cells (PEMFCs). The present invention is directed to a new class of cathode catalysts based on supportless platinum nanotubes (PtNTs) and platinum alloy nanotubes, for example, platinum-palladium nanotubes (PtPdNTs), that have remarkable durability and high catalytic activity. Due to their unique combination of dimensions at multiple length scales, the platinum nanotubes of the present invention can provide high platinum surface area due to their nanometer-sized wall thickness, and have the potential to eliminate or alleviate most of the degradation pathways of the commercial carbon supported platinum catalyst (Pt/C) and unsupported platinum-black (PtB) as a result of their micrometer-sized length.

Abstract: A hybrid lithography system is disclosed to achieve high throughput and high resolution of sub 32 nm lithography. The hybrid system contains an optical lithographer for expose pattern area where features above 32 nm, and a cluster e-beam lithography system for expose pattern area where features is sub 32 nm.

Abstract: System and method for charged particle beam. According an embodiment, the present invention provides a charged particle beam apparatus. The apparatus includes a charged particle source for generating a primary charged particle beam. The apparatus also includes at least one condenser lens for pre-focusing the primary charge particle beam. Furthermore, the apparatus includes a compound objective lens for forming the magnetic field and the electrostatic field to focus the primary charged particle beam onto a specimen in the charged particle beam path. The specimen includes a specimen surface. The compound objective lens includes a conical magnetic lens, an immersion magnetic lens, and an electrostatic lens, the conical magnetic lens including an upper pole piece, a shared pole piece being electrically insulated from the upper pole piece, and an excitation coil.

Abstract: The present inventions provides a pharmaceutical composition comprising a safe and efficient amount of OGP, a safe and efficient amount of G-CSF and a pharmaceutically acceptable carrier, wherein the molar ratio of OGP to G-CSF is from 0.25:1 to 100:1. According to the present invention, there is a good synergism between OGP and G-CSF. Thus the haematogenesis of G-CSF is greatly promoted. The invention also discloses the preparation method and usage of the pharmaceutical composition, especially in promoting the haematogenesis of G-CSF and the immune response of lymphocyte.

Abstract: An apparatus and method for scanning the surface of a specimen is disclosed for defect inspection purposes. Scanning Electron Microscope (SEM) is used to scan the surface of a specimen. The scanning method employed by the SEM comprises the steps of: generating a particle beam from a particle beam emitter, and scanning the surface of the specimen by bending the particle beam at an angle with respect to the surface of the specimen, wherein the particle beam traverses an angle that is not parallel or perpendicular to the orientation of the specimen. The specimen being scanned is a semiconductor wafer or a photomask.

Abstract: A method for in-line monitoring of via/contact etching process based on a test structure is described. The test structure is comprised of via/contact holes of different sizes and densities in a layout such that, for a certain process, the microloading or RIE lag induced non-uniform etch rate produce under-etch in some regions and over-etch in others. A scanning electron microscope is used to distinguish these etching differences in voltage contrast images. Image processing and simple calibration convert these voltage contrast images into a “fingerprint” image characterizing the etching process in terms of thickness over-etched or under-etched. Tolerance of shifting or deformation of this image can be set for validating the process uniformity. This image can also be used as a measure to monitor long-term process parameter shifting, as well as wafer-to-wafer or lot-to-lot variations.

Abstract: A method for in-line monitoring of via/contact etching process based on a test structure is described. The test structure is comprised of via/contact holes of different sizes and densities in a layout such that, for a certain process, the microloading or RIE lag induced non-uniform etch rate produce under-etch in some regions and over-etch in others. A scanning electron microscope is used to distinguish these etching differences in voltage contrast images. Image processing and simple calibration convert these voltage contrast images into a “fingerprint” image characterizing the etching process in terms of thickness over-etched or under-etched. Tolerance of shifting or deformation of this image can be set for validating the process uniformity. This image can also be used as a measure to monitor long-term process parameter shifting, as well as wafer-to-wafer or lot-to-lot variations.