Patents by Inventor Zhuang Ma

Zhuang Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180159651
    Abstract: The present disclosure discloses a method and an apparatus for implementing registration. The method includes: tuning, by optical network units (ONUs), own reception wavelengths to a downlink wavelength corresponding to any one of time-wavelength division multiplexing (TWDM) channels; and receiving, from optical line terminals (OLTs) by the ONUs, downlink frames containing operator information, judging that the operator information in the received downlink frames is same as operator information preconfigured in the ONUs, searching for an uplink wavelength corresponding to a current received wavelength in a corresponding relationship between the uplink wavelength and the downlink wavelength received from the OLTs, and tuning own uplink wavelengths to the searched uplink wavelength for registration.
    Type: Application
    Filed: March 31, 2016
    Publication date: June 7, 2018
    Applicant: ZTE CORPORATION
    Inventors: Mingsheng LI, Dan GENG, Zhuang MA
  • Patent number: 9978712
    Abstract: A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P1), a second input pin (P2), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: May 22, 2018
    Assignee: Texas Instruments Incorporated
    Inventors: Danyang Zhu, Zhuang Ma, Xinyu Yin, Michael Dean Shilhanek, Steven Bolen, Albert Eardley, Abha Singh Kasper
  • Publication number: 20170272160
    Abstract: A method for implementing a variable optical splitter and a variable optical splitter are provided. the method includes that: the variable optical splitter is divided into one or more virtual optical splitting units according to wavelengths/wavebands of optical signals, wherein the virtual optical splitting units and the wavelengths/wavebands are in a one-to-one correspondence, and moreover, the wavelengths/wavebands and splitting ratios are also in a one-to-one correspondence; and optical guiding or optical splitting is performed on the incident optical signals through the virtual optical splitting units. By adopting the technical solutions provided by the present disclosure, the technical problems that there is yet no optical splitter with a variable splitting ratio in the related technology and the like are solved, and controllability of the splitting ratios of the optical splitter is achieved.
    Type: Application
    Filed: November 18, 2014
    Publication date: September 21, 2017
    Inventors: Jidong XU, Zhiming FU, Mingsheng LI, Zhuang MA
  • Publication number: 20170194285
    Abstract: A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P1), a second input pin (P2), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.
    Type: Application
    Filed: May 25, 2016
    Publication date: July 6, 2017
    Inventors: DANYANG ZHU, ZHUANG MA, XINYU YIN, MICHAEL DEAN SHILHANEK, STEVEN BOLEN, ALBERT EARDLEY, ABHA SINGH KASPER
  • Publication number: 20170142502
    Abstract: An optical-electrical receiving and transmitting method and apparatus, as well as an optical-electrical transceiving method and device and an optical-electrical transceiver are provided. The optical-electrical transceiving processing method may include: in a reception direction, a received optical signal is split into multipath optical signals, the multipath optical signals are processed into multipath parallel electrical signals, and the multipath parallel electrical signals are converted into a single-path serial electrical signal; in a transmission direction, a received single-path serial electrical signal, which is to be transmitted, is converted into multipath parallel electrical signals, then the multipath parallel electrical signals are processed into multipath optical signals, and finally the multipath optical signals are combined into a single beam of optical signals.
    Type: Application
    Filed: August 21, 2014
    Publication date: May 18, 2017
    Inventors: Yongjia YIN, Mingsheng LI, Liquan YUAN, Songlin ZHU, Zhuang MA, Yong GUO
  • Publication number: 20160126233
    Abstract: An apparatus includes an integrated circuit, a plurality of bi-directional pins, and an electro-static discharge (ESD) clamp. The integrated circuit is configured to provide a ground potential. The plurality of bi-directional pins are configured to provide a differential input signal for the integrated circuit. The electro-static discharge (ESD) clamp is coupled between the ground potential and the plurality of bi-directional pins.
    Type: Application
    Filed: November 5, 2014
    Publication date: May 5, 2016
    Inventors: Zhong Chen, Danyang Zhu, Zhuang Ma