Abstract: A full-electric drive cementing control system is disclosed.

Abstract: A combustion-gas supply system and a combustion-gas supply method thereof, a device equipped with a turbine engine, and a fracturing system are provided. The combustion-gas supply system includes a main pipeline and a multi-functional pipeline; the main pipeline includes a first sub-pipeline and a second sub-pipeline; the first sub-pipeline includes a first gas intake pipe, a first gas supply valve and a first gas outlet pipe arranged in sequence; the second sub-pipeline includes a combustion-gas supply valve and a gas supply pipe, the first gas outlet pipe is connected with the combustion-gas supply valve, the gas supply pipe is configured to be connected with a turbine engine, the multi-functional pipeline includes a second gas intake pipe, a second gas supply valve and a second gas outlet pipe arranged in sequence, and the second gas outlet pipe is communicated with the first gas outlet pipe.

Abstract: A continuous high-power turbine fracturing equipment may include a lubrication system, which may include a first lubrication unit configured to lubricate a plunger pump. The first lubrication unit may further include a high pressure lubrication unit. The high pressure lubrication unit may include a high pressure motor, a high pressure pump, and a high pressure oil line. The high pressure motor may be configured to drive the high pressure pump, which may be configured to pump high pressure lubricating oil into the high pressure oil line. The high pressure oil line may be configured to lubricate at least one of connecting rod bearing bushes or crosshead bearing bushes in the plunger pump.

Abstract: A high-power turbine fracturing system may include a lubrication system, which may include a first lubrication unit configured to lubricate a plunger pump. The first lubrication unit may further include a high-pressure lubrication unit. The high-pressure lubrication unit may include a high-pressure motor, a high-pressure pump, and a high-pressure oil line. The high-pressure motor may be configured to drive the high-pressure pump, which may be configured to pump high-pressure lubricating oil into the high-pressure oil line. The high-pressure oil line may be configured to lubricate at least one of connecting rod bearing bushes or crosshead bearing bushes in the plunger pump.

Abstract: A system for supplying combustion gas to a turbine engine for fracturing operation by fracturing manifold equipment is disclosed. The system may include a gas supply device, a gas delivery manifold, a filtering device, a gas detecting system and a connecting device. The gas delivery manifold, and the filtering device, and the gas detecting system are integrated on the fracturing manifold equipment. The gas supply device is connected to the gas delivery manifold through the filtering device. The gas delivery manifold supplies gas to the turbine engine through the connecting device. The disclosed system help reduce operational risk, save floor space, reduce wiring/routing of on-site delivery manifold, enhance connection efficiency, and reduce the complexity of wellsite installation.

Abstract: An example molded fluidic die assembly includes a fluidic die including an electrical component and a fluidic architecture on a first face of the fluidic die, the fluidic architecture including a front face; circuitry; an electrical connection coupling the circuitry to the electrical component on the first face of the fluidic die; and a continuous molded compound that surrounds the fluidic die and encompasses the electrical connection.

Abstract: The present disclosure provides an LED assembly, a light source, and a liquid crystal display device. The LED assembly includes: a substrate; a plurality of blue LED chips which are disposed on the substrate at intervals and have different emission wavelengths; a white light phosphor layer which is disposed on the substrate and covers the plurality of blue LED chips; and a sealing frame which is disposed on the substrate and is configured to encapsulate the plurality of blue LED chips and the white light phosphor layer. The LED assembly encapsulates the blue LED chips having different emission wavelengths together, which can avoid LED mixing from an LED encapsulation source, thereby saving cost. Moreover, problems such as nonuniform images and chromatic aberration are basically avoided when the LED assembly is applied to an LCD module.

Abstract: A backlight assembly and a display device are provided. The backlight assembly includes a light guide plate, a light source, and a first reflector sheet. The light guide plate includes a bottom surface and a light emitting surface opposite to each other, and a light incident surface intersecting the bottom surface and the light emitting surface. The light source is on the light incident surface of the light guide plate. The first reflector sheet is on the bottom surface of the light guide plate and at an end of the light guide plate distal to the light source. The backlight assembly further includes a second reflector sheet proximal to the light source. The second reflector sheet is on the bottom surface and/or the light emitting surface of the light guide plate, and a reflectivity of the second reflector sheet is greater than 90%.

Abstract: The present disclosure provides an LED assembly, a light source, and a liquid crystal display device. The LED assembly includes: a substrate; a plurality of blue LED chips which are disposed on the substrate at intervals and have different emission wavelengths; a white light phosphor layer which is disposed on the substrate and covers the plurality of blue LED chips; and a sealing frame which is disposed on the substrate and is configured to encapsulate the plurality of blue LED chips and the white light phosphor layer. The LED assembly encapsulates the blue LED chips having different emission wavelengths together, which can avoid LED mixing from an LED encapsulation source, thereby saving cost. Moreover, problems such as nonuniform images and chromatic aberration are basically avoided when the LED assembly is applied to an LCD module.

Abstract: A backlight assembly and a display device are provided. The backlight assembly includes a light guide plate, a light source, and a first reflector sheet. The light guide plate includes a bottom surface and a light emitting surface opposite to each other, and a light incident surface intersecting the bottom surface and the light emitting surface. The light source is on the light incident surface of the light guide plate. The first reflector sheet is on the bottom surface of the light guide plate and at an end of the light guide plate distal to the light source. The backlight assembly further includes a second reflector sheet proximal to the light source. The second reflector sheet is on the bottom surface and/or the light emitting surface of the light guide plate, and a reflectivity of the second reflector sheet is greater than 90%.

Abstract: A pixel unit, a display method thereof and a display panel are provided. The pixel unit includes a display region and a non-display region, further includes a first substrate, a second substrate, a fluid layer and a control structure, the fluid layer is disposed between the first substrate and the second substrate, a fluid is disposed in the fluid layer, a flow of the fluid is controllable, and the control structure is disposed between the first substrate and the second substrate and configured to control the flow of the fluid.

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: A pixel unit, a display method thereof and a display panel are provided. The pixel unit includes a display region and a non-display region, further includes a first substrate, a second substrate, a fluid layer and a control structure, the fluid layer is disposed between the first substrate and the second substrate, a fluid is disposed in the fluid layer, a flow of the fluid is controllable, and the control structure is disposed between the first substrate and the second substrate and configured to control the flow of the fluid.

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

Abstract: A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole.

Abstract: Described herein are techniques for receiving, by a telecommunication service provider, used telecommunication devices from a plurality of subscribers of the telecommunication service provider. The used telecommunication devices may each have been purchased with an installment plan on which a balance is owed, and different balances may be owed on different ones of the used telecommunication devices. In exchange for the used telecommunication devices, the telecommunication service provider may pay off up to at least part of each of the balances. Further, prior to paying off the balances, the telecommunication service provider may obtain identifiers for the used telecommunication devices and verify that the obtained identifier for each used telecommunication device matches an identifier that is associated with one of the subscribers and is stored in a data store of the telecommunication service provider.