Abstract: Methods and systems are described herein for minimizing resource expenditure during model training using user-defined constraints in sample selection. A system may obtain user-defined target parameter values for data labeling, a user input indicative of a value added per unit of model performance improvement, and a dataset (e.g., unlabeled samples). The system may select a first subset of the dataset and may transmit a request for labeling the samples. The system may receive a first training dataset comprising label data and the samples of the first subset. The system may train a machine learning model using the first training dataset and generate a margin curve. Based on the margin curve, the system may determine whether an amount of resource usage exceeds value added and responsive to determining that it does not exceed the amount of resource usage, select a second subset of the dataset.

Abstract: A system includes three modules: a local odometry module, a map feature matching module, and a map-based positioning module, where the local odometry module is configured to receive data of a camera and an inertial measurement unit (IMU); the map feature matching module is configured to detect a similarity between a scene observed by the camera at a current moment and a pre-built map scene, and obtain a feature matching pair of an image feature at the current moment and a map feature; and the map-based positioning module is configured to receive an output amount of the local odometry and the feature matching pair. In the present invention, a maintained odometry-related variable and the relative transformation between a local odometry reference system and a pre-built map reference system are expressed in a Lie group, such that a new invariant Kalman filter (IKF) algorithm is obtained.

Abstract: An epoxy resin compound is provided. The epoxy resin compound includes a hardener, an inorganic based filler, a catalyst, and a conductive additive. The amount of inorganic based filler is greater than 80 weight percent (wt %) of the epoxy resin compound. The catalyst is to accelerate curing of the epoxy resin compound. The amount of conductive additive is 0.1 to 5 wt % of the epoxy resin compound.

Abstract: Systems and methods for improving training efficiency while reducing total labeling cost for downstream modeling using entropy scores for labeling predictions. The system may receive a first text string, process the first text string in an artificial intelligence model, and determine: a first likelihood that the first text string has a first label component; a second likelihood that the first text string has a second label component; a composite likelihood for the first text string based on the first likelihood and the second likelihood; and a first entropy score from the composite likelihood. It may compare the first entropy score to a first threshold entropy score and generate a recommendation to review a first label being assigned to the first text string.

Abstract: Systems and methods for improving label quality in datasets using a quality filter based on a consistency score. The system may receive a first given label for a first text string. It may process the first text string in an artificial intelligence model, as well as determine: a first predicted label for the first text string; and a first consistency score for the first text string based on a comparison of the first predicted label and the first given label. The system may compare the first consistency score to a first threshold consistency score and, in response to comparing the first consistency score to the first threshold consistency score, filter the first text string to a first group. The system may generate a recommendation to use the first group for a supervised learning task.

Abstract: Systems and methods for propagating labels through a sparsely labeled dataset using a supervised projection of a semantic embedding. The system may receive the dataset and a labeling task. It may determine a semantic graph by embedding the dataset using a language model. It may process the semantic graph in an artificial intelligence model, as well as determine: an optimal set of dimensions for the labeling task based on the semantic graph; a projected graph based on the optimal set of dimensions; a first distance between a first projection and a second projection in the projected graph; a first likelihood the first projection has a first label; and a second likelihood the first projection has a second label based in part on the first distance to the second projection. It may compare the first likelihood to the second likelihood and generate a recommendation to stop the labeling task.

Abstract: An example molded fluidic die assembly includes a fluidic die including an electrical component and a fluidic architecture on a first face of the fluidic die, the fluidic architecture including a front face; circuitry; an electrical connection coupling the circuitry to the electrical component on the first face of the fluidic die; and a continuous molded compound that surrounds the fluidic die and encompasses the electrical connection.

Abstract: The present disclosure provides an LED assembly, a light source, and a liquid crystal display device. The LED assembly includes: a substrate; a plurality of blue LED chips which are disposed on the substrate at intervals and have different emission wavelengths; a white light phosphor layer which is disposed on the substrate and covers the plurality of blue LED chips; and a sealing frame which is disposed on the substrate and is configured to encapsulate the plurality of blue LED chips and the white light phosphor layer. The LED assembly encapsulates the blue LED chips having different emission wavelengths together, which can avoid LED mixing from an LED encapsulation source, thereby saving cost. Moreover, problems such as nonuniform images and chromatic aberration are basically avoided when the LED assembly is applied to an LCD module.

Abstract: A backlight assembly and a display device are provided. The backlight assembly includes a light guide plate, a light source, and a first reflector sheet. The light guide plate includes a bottom surface and a light emitting surface opposite to each other, and a light incident surface intersecting the bottom surface and the light emitting surface. The light source is on the light incident surface of the light guide plate. The first reflector sheet is on the bottom surface of the light guide plate and at an end of the light guide plate distal to the light source. The backlight assembly further includes a second reflector sheet proximal to the light source. The second reflector sheet is on the bottom surface and/or the light emitting surface of the light guide plate, and a reflectivity of the second reflector sheet is greater than 90%.

Abstract: The present disclosure provides an LED assembly, a light source, and a liquid crystal display device. The LED assembly includes: a substrate; a plurality of blue LED chips which are disposed on the substrate at intervals and have different emission wavelengths; a white light phosphor layer which is disposed on the substrate and covers the plurality of blue LED chips; and a sealing frame which is disposed on the substrate and is configured to encapsulate the plurality of blue LED chips and the white light phosphor layer. The LED assembly encapsulates the blue LED chips having different emission wavelengths together, which can avoid LED mixing from an LED encapsulation source, thereby saving cost. Moreover, problems such as nonuniform images and chromatic aberration are basically avoided when the LED assembly is applied to an LCD module.

Abstract: A backlight assembly and a display device are provided. The backlight assembly includes a light guide plate, a light source, and a first reflector sheet. The light guide plate includes a bottom surface and a light emitting surface opposite to each other, and a light incident surface intersecting the bottom surface and the light emitting surface. The light source is on the light incident surface of the light guide plate. The first reflector sheet is on the bottom surface of the light guide plate and at an end of the light guide plate distal to the light source. The backlight assembly further includes a second reflector sheet proximal to the light source. The second reflector sheet is on the bottom surface and/or the light emitting surface of the light guide plate, and a reflectivity of the second reflector sheet is greater than 90%.

Abstract: A pixel unit, a display method thereof and a display panel are provided. The pixel unit includes a display region and a non-display region, further includes a first substrate, a second substrate, a fluid layer and a control structure, the fluid layer is disposed between the first substrate and the second substrate, a fluid is disposed in the fluid layer, a flow of the fluid is controllable, and the control structure is disposed between the first substrate and the second substrate and configured to control the flow of the fluid.

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: A pixel unit, a display method thereof and a display panel are provided. The pixel unit includes a display region and a non-display region, further includes a first substrate, a second substrate, a fluid layer and a control structure, the fluid layer is disposed between the first substrate and the second substrate, a fluid is disposed in the fluid layer, a flow of the fluid is controllable, and the control structure is disposed between the first substrate and the second substrate and configured to control the flow of the fluid.

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

Abstract: In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

Abstract: A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.

Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole.