Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Abstract: A device including a semiconductor and a substrate. The substrate has a first surface and a second surface that opposes the first surface. The substrate has a hole that extends from the first surface to the second surface and the semiconductor is secured to the substrate via adhesive in the hole.

Abstract: Described herein are techniques for receiving, by a telecommunication service provider, used telecommunication devices from a plurality of subscribers of the telecommunication service provider. The used telecommunication devices may each have been purchased with an installment plan on which a balance is owed, and different balances may be owed on different ones of the used telecommunication devices. In exchange for the used telecommunication devices, the telecommunication service provider may pay off up to at least part of each of the balances. Further, prior to paying off the balances, the telecommunication service provider may obtain identifiers for the used telecommunication devices and verify that the obtained identifier for each used telecommunication device matches an identifier that is associated with one of the subscribers and is stored in a data store of the telecommunication service provider.

Abstract: A structured glass wafer for packaging a microelectromechanical-system (MEMS) wafer. The structured glass wafer includes a sheet of glass, and an access hole. The sheet of glass has a first side and a second side, and is configured to provide a protective covering for MEMS devices. The access hole extends through the sheet of glass from the first side to the second side of the sheet of glass, and is configured to provide access to a group of electrical contacts of a group of MEMS devices. A packaged MEMS wafer including the structured glass wafer, and a method for fabricating a packaged MEMS wafer are also provided.

Abstract: In one embodiment, a method for making an optical micro device package includes: providing a substrate wafer having a plurality of solid state light sensors integrate therein; providing a transparent cover wafer coated with a material that alters the transparency characteristics of the cover wafer; forming a layer of light sensitive, photo definable adhesive material on the substrate wafer; selectively removing part of the layer of adhesive material in a pattern for a plurality of adhesive spacers between the substrate wafer and the cover wafer with each spacer surrounding a corresponding one of the light sensors; bonding the substrate wafer and the cover wafer together at the spacers to form a wafer assembly in which each spacer surrounds and seals a corresponding one of the light sensors within a cavity bounded by a spacer and the two wafers; and singulating individual device packages from the wafer assembly.

Abstract: A display element for a display device includes a display mechanism and a resin layer. One or more busbars and one or more multiplexing resistors are disposed within the resin layer. The multiplexing resistors are communicatively connected to one or more address lines to permit the display element to be addressed by selective assertion of the address lines in a multiplexing manner.

Abstract: An imprint lithography stamp (101, 201, 401, 501, 617) includes a base layer (301, 619); a functional layer (303, 621) of lithography features (307, 309, 403, 405, 503, 505) protruding from the base layer (301, 619); and a support layer (305, 623) comprising a regular pattern of sub-features (311, 313, 407, 409, 507, 509, 613, 615, 625) protruding from the lithography features (307, 309, 403, 405, 503, 505).

Abstract: A display element for a display device includes a display mechanism and a resin layer. One or more busbars and one or more multiplexing resistors are disposed within the resin layer. The multiplexing resistors are communicatively connected to one or more address lines to permit the display element to be addressed by selective assertion of the address lines in a multiplexing manner.