Patents by Inventor Zong-Kun LIN

Zong-Kun LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240392464
    Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 28, 2024
    Inventors: Zong-Kun LIN, Hsuan-Chih CHU, Chien-Hsun PAN, Yen-Yu CHEN, Yi-Ming DAI
  • Patent number: 12104268
    Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
    Type: Grant
    Filed: June 23, 2023
    Date of Patent: October 1, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zong-Kun Lin, Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Yi-Ming Dai
  • Publication number: 20240271314
    Abstract: The present disclosure is directed to a fluid head that is configured to eject a first fluid (e.g., a liquid state fluid) and a second fluid (e.g., a gaseous state fluid). The fluid head is movable in a rotatable-fashion and a translatable-fashion such that the fluid head may be utilized to increase a speed and decrease a period of time for cleaning and drying a workpiece after an electro-chemical polishing (ECP) process or step. The fluid head may also be utilized to increase a speed and decrease a period of time for beveling an edge of a conductive layer on the workpiece. The present disclosure is also directed to methods for cleaning and drying the workpiece as well as beveling the conductive layer of the workpiece utilizing the fluid head.
    Type: Application
    Filed: February 10, 2023
    Publication date: August 15, 2024
    Inventors: Wen-Hao CHENG, Hsuan-Chih CHU, Yen-Yu CHEN, Zong-Kun LIN
  • Publication number: 20230332322
    Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
    Type: Application
    Filed: June 23, 2023
    Publication date: October 19, 2023
    Inventors: Zong-Kun LIN, Hsuan-Chih CHU, Chien-Hsun PAN, Yen-Yu CHEN, Yi-Ming DAI
  • Patent number: 11732379
    Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: August 22, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zong-Kun Lin, Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Yi-Ming Dai
  • Publication number: 20210388524
    Abstract: The treatment system provides a feature that may reduce cost of the electrochemical plating process by reusing the virgin makeup solution in the spent electrochemical plating bath. The treatment system provides a rotating filter shaft which receives the spent electrochemical plating bath and captures the additives and by-products created by the additives during the electrochemical plating process. To capture the additives and the by-products, the rotating filter shaft includes one or more types of membranes. Materials such as semi-permeable membrane are used to capture the used additives and by-products in the spent electrochemical plating bath. The treatment system may be equipped with an electrochemical sensor to monitor a level of additives in the filtered electrochemical plating bath.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 16, 2021
    Inventors: Zong-Kun LIN, Hsuan-Chih CHU, Chien-Hsun PAN, Yen-Yu CHEN, Yi-Ming DAI