Abstract: A wafer processing system and a rework method thereof are provided. An image capture device captures an image of a wafer to generate a captured image. A control device detects a defect pattern in the captured image, calculates a target removal thickness according to distribution of contrast values of the defect pattern, and controls a processing device to perform processing on the wafer according to the target removal thickness.

Abstract: A housing assembly for electrical connector includes a housing body and a locking lever pivotally connected to the housing body. The locking lever is pivotable relative to the housing body between a pre-locked position and a locked position. A groove is formed in an outer side surface of the housing body, and an elastic protrusion is formed on an inner side surface of the locking lever. The groove and the elastic protrusion are adapted such that the elastic protrusion is engaged into the groove when the locking lever is in the pre-locked position, and the elastic protrusion is disengaged from the groove when the locking lever is moved from the pre-locked position.

Abstract: A vehicle power supply circuit monitoring system and a vehicle power supply circuit monitoring method are provided. The vehicle power supply circuit monitoring system is adapted to a vehicle power supply and a vehicle load device, and includes a power monitoring circuit and a control circuit. The power monitoring circuit is electrically connected to the vehicle power supply and the control circuit. The power monitoring circuit monitors two different input load powers at two different time points. The control circuit calculates an external power loop equivalent impedance according to the two different input load powers. When the external power loop equivalent impedance is greater than a designed impedance threshold, the control circuit executes a warning procedure.

Abstract: An image sleep analysis method and system thereof are disclosed. During sleep duration, a plurality of visible-light images of a body are obtained. Positions of image differences are determined by comparing the visible-light images. A plurality of features of the visible-light images are identified and positions of the features are determined. According to the positions of the image differences and features, the motion intensities of the features are determined. Therefore, a variation of the motion intensities is analyzed and recorded to provide accurate sleep quality.

Abstract: A LED bulb apparatus has a bulb shell, a head cap, a driver circuit and at least one light strip. The bulb shell has a light passing shell and a bottom portion. A head cap has a neck portion, a first electrode and a second electrode. The neck portion of the head cap is connected to the bottom portion of the bulb shell forming a container space. A fluorescent layer covers the multiple LED modules. The driving current is transmitted via at least one of the top end and the bottom end of the light strip to the LED modules. The substrate has a light transmittance less than 50%.

Abstract: The disclosure provides a wafer inspection method and wafer inspection apparatus. The method includes: receive scanning information of at least one wafer, wherein the scanning information includes a plurality of haze values; the scanning information is divided into a plurality of information blocks according to the unit block, and the feature value of each of the plurality of information blocks is calculated according to the plurality of haze values included in each of the plurality of information blocks; and converting the feature value into a color value according to the haze upper threshold and the haze lower threshold, generating the color value corresponding to the at least one wafer according to the converted color value according to the feature value, whereby the color graph displays the texture content of the at least one wafer.

Abstract: Systems and methods are provided for synchronizing multiple channels in an access network, where the multiple channels are neighboring channels such that a guard band between them or use of a diplexer to prevent inter-channel interference is not required. Synchronization is achieved by defining channel MAP (media access plan) cycle structures such that all channels work in the same direction (upstream US or downstream DS) at any given time. Moreover, the network controller of channel may send out a beacon to allow new nodes to join. A long MAP cycle (402) may be followed by three consecutive regular MAP cycles (404, 406), and (408). These MAP cycles are repeated between beacon transmissions. Synchronization allows multiple channels to be configured contiguous (without a guard band between neighbouring channels) and without utilizing diplexers. A plurality of customer premises equipment may operate on each of the communications channels.

Abstract: A method of manufacturing an epitaxial structure includes steps of: A: provide a silicon carbide (SiC) substrate, wherein a silicon face (Si-face) of the SiC substrate is taken as a growth face, and the growth face has an off-angle relative to the Si-face of the SiC substrate; B: deposit a nitride angle adjustment layer on the growth face of the SiC substrate through physical vapor deposition (PVD); C: deposit a first group III nitride layer on the nitride angle adjustment layer; and D: deposit a second group III nitride layer on the first group III nitride layer. Through the method of manufacturing the epitaxial structure, when the silicon face of the silicon carbide substrate has the off-angle, the problem of a poor epitaxial quality of the first group III nitride layer and a poor epitaxial quality of the second group III nitride layer could be effectively relieved.

Abstract: A method of manufacturing an epitaxial structure includes steps of: A: provide a silicon nitride (SiC) substrate having a carbon face (C-face) without an off-angle; B: form an amorphous structure layer on the C-face of the SiC substrate; C: deposit a first group III nitride layer on the amorphous structure layer; and D: deposit a second group III nitride layer on the first group III nitride layer. By forming the amorphous structure layer, a top surface of the second group III nitride layer could be made to be in a flat and smooth state.

Abstract: A method of manufacturing an epitaxial structure includes steps of: A: provide a silicon carbide (SiC) substrate, wherein a silicon face (Si-face) of the SiC substrate is taken as a growth face having an off-angle relative to the Si-face of the SiC substrate; B: deposit a nitride angle adjustment layer having a thickness less than 50 nm on the growth face of the SiC substrate through physical vapor deposition (PVD); C: deposit a first group III nitride layer on the nitride angle adjustment layer; and D: deposit a second group III nitride layer on the first group III nitride layer. Through the method of manufacturing the epitaxial structure, when the silicon face of the silicon carbide substrate has the off-angle, the problem of a poor epitaxial quality of the first group III nitride layer and a poor epitaxial quality of the second group III nitride layer could be effectively relieved.

Abstract: An electronic device with a connector supporting multiple connection standards includes the connector, a first multiplexer circuit, a processor and a controller. The connector includes a detection pin and at least one signal pin. The first multiplexer circuit is coupled to the at least one signal pin. The processor is coupled to the first multiplexer circuit. The controller monitors the detection pin. The first multiplexer circuit electrically connects the at least one signal pin to the controller. Upon detecting a hot-plug signal occurring at the detection pin, the controller issues a confirmation command via the first multiplexer circuit and the at least one signal pin to request a reply of a device signal. Upon receiving the device signal, the controller controls the first multiplexer circuit according to the device signal to electrically connect the at least one signal pin to the processor or the controller.

Abstract: A LED bulb apparatus has a bulb shell, a head cap, a driver circuit and at least one light strip. The bulb shell has a light passing shell and a bottom portion. A head cap has a neck portion, a first electrode and a second electrode. The neck portion of the head cap is connected to the bottom portion of the bulb shell forming a container space. A fluorescent layer covers the multiple LED modules. The driving current is transmitted via at least one of the top end and the bottom end of the light strip to the LED modules. The substrate has a light transmittance less than 50%.

Abstract: Systems and methods are provided for synchronizing multiple channels in an access network, where the multiple channels are neighboring channels such that a guard band between them or use of a diplexer to prevent inter-channel interference is not required. Synchronization is achieved by defining channel MAP (media access plan) cycle structures such that all channels work in the same direction (upstream US or downstream DS) at any given time. Moreover, the network controller of channel may send out a beacon to allow new nodes to join. A long MAP cycle (402) may be followed by three consecutive regular MAP cycles (404, 406), and (408). These MAP cycles are repeated between beacon transmissions. Synchronization allows multiple channels to be configured contiguous (without a guard band between neighbouring channels) and without utilizing diplexers. A plurality of customer premises equipment may operate on each of the communications channels.

Abstract: An electronic device with a connector supporting multiple connection standards includes the connector, a processor, a controller, an EDID (Extended Display Identification Data) ROM, a first multiplexer circuit and a second multiplexer circuit. The first multiplexer circuit is coupled to at least one signal pin of the connector, the processor and the controller. The second multiplexer circuit is coupled to the EDID ROM, the first multiplexer circuit, the processor and the controller. Under an update state, the controller is electrically connected to the EDID ROM through the second multiplexer circuit, and updates EDID in the EDID ROM with update data.

Abstract: An electronic device with a connector supporting multiple connection standards includes the connector, a first multiplexer circuit, a processor and a controller. The connector includes a detection pin and at least one signal pin. The first multiplexer circuit is coupled to the at least one signal pin. The processor is coupled to the first multiplexer circuit. The controller monitors the detection pin. The first multiplexer circuit electrically connects the at least one signal pin to the controller. Upon detecting a hot-plug signal occurring at the detection pin, the controller issues a confirmation command via the first multiplexer circuit and the at least one signal pin to request a reply of a device signal. Upon receiving the device signal, the controller controls the first multiplexer circuit according to the device signal to electrically connect the at least one signal pin to the processor or the controller.

Abstract: Provided is a wafer jig including a bottom wall and a ring-shaped side wall. The bottom wall has a supporting surface. The ring-shaped side wall is connected to a periphery of the bottom wall. The ring-shaped side wall includes at least two step portions. The two step portions include a first step portion and a second step portion. The first step portion is connected between the supporting surface and the second step portion, and the first step portion protrudes along a direction toward a center of the bottom wall. The ring-shaped side wall surrounds the center. In addition, a wafer structure and a wafer processing method are also provided.

Abstract: A method for calculating an object pick-and-place sequence and an electronic apparatus for automatic storage pick-and-place are provided. When a warehousing operation is to be performed, the following steps are performed. A weight of an object to be stocked that is to be put on a shelf is obtained. The weight is substituted into a plurality of coordinate positions corresponding to a plurality of unused grid positions respectively, so as to calculate a plurality of estimated center of gravity positions. Whether the estimated center of gravity positions are located within a balance standard area is determined so as to sieve out a plurality of candidate grid positions from these unused grid positions. One of the candidate grid positions is selected as a recommended position of the object to be stocked.

Abstract: An electronic device with a connector supporting multiple connection standards includes the connector, a processor, a controller, an EDID (Extended Display Identification Data) ROM, a first multiplexer circuit and a second multiplexer circuit. The first multiplexer circuit is coupled to at least one signal pin of the connector, the processor and the controller. The second multiplexer circuit is coupled to the EDID ROM, the first multiplexer circuit, the processor and the controller. Under an update state, the controller is electrically connected to the EDID ROM through the second multiplexer circuit, and updates EDID in the EDID ROM with update data.

Abstract: A breath detecting system and breath detecting mat thereof are disclosed. The breath detecting mat is placed under bed mattress and has a hollow board, a vibration sensor and a signal processing circuit. The vibration sensor and the signal processing circuit are mounted in the hollow board. The vibration sensor senses the micro-vibrations caused by the breathing of the person is lying on the bed mattress and outputs the breath sensing signal to the signal processing circuit. The signal processing circuit samples the sensing signal according to different moving average points to generate the fast-moving and slow-moving average signals. Since the first fast-moving and slow-moving average signals have many cross points, the signal processing circuit calculates each time difference between every two adjacent cross points. A present breath frequency is calculated according to the time differences. Therefore, the noises of the sensing signal are effectively removed.

Abstract: A wafer includes a semiconductor substrate. The semiconductor substrate includes a plurality of first doped regions and a plurality of second doped regions. The first doped regions and the second doped regions are located on a first surface of the semiconductor substrate. The second doped regions contact the first doped regions. The first doped regions and the second doped regions are alternately arranged. Both of the first doped regions and the second doped regions include a plurality of N-type dopants. The doping concentration of the N-type dopants in each of the first doped regions is not greater than the doping concentration of the N-type dopants in each of the second doped regions.