Abstract: Optical apparatus (20) includes a laser (22), which is configured to emit a beam of coherent optical radiation at a specified wavelength along a beam axis. A deflector (24) is configured to intercept and selectably deflect the beam over a range of angles relative to the beam axis. A plurality of diffractive optical elements (DOEs—32, 34, 36, 64, 66, 68) are positioned to receive the deflected beam at different, respective deflection angles within the range and to output respective diffracted beams. Beam-combining optics (42, 74) are configured to receive and deflect the diffracted beams from the DOEs so that all of the diffracted beams are directed along a common output axis toward a target (48).

Abstract: Printing apparatus includes a donor supply assembly, which positions a transparent donor substrate having opposing first and second surfaces and a donor film formed on the second surface so that the donor film is in proximity to a target area on an acceptor substrate. An optical assembly directs one or more beams of laser radiation to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate. Means are provided to mitigate or compensate for the variation in reflection of the laser radiation across an area of the donor substrate, so as to equalize a flux of the laser radiation that is absorbed in the donor film across the area of the donor substrate.

Abstract: A method for manufacturing includes applying patterned electromagnetic energy to each of a sequence of layers of a dry film comprising a photosensitive material so as to create in the photosensitive material in each of the layers a respective two-dimensional (2D) pattern corresponding to a slice of a predefined three-dimensional (3D) structure. The layers in the sequence in which the respective 2D pattern has been created are laminated together to produce a multi-layer stack. The multi-layer stack is developed so as to remove the photosensitive material in which the 2D pattern has not been created, thereby forming the 3D structure.

Abstract: A method for circuit fabrication includes inspecting an array of solder bumps on a circuit substrate so as to identify a solder bump having a height above the substrate that is greater than a predefined maximum. A first laser beam is directed toward the identified solder bump so as to ablate a selected amount of a solder material from the identified solder bump. Alternatively or additionally, a further solder bump having a height above the substrate that is less than a predefined minimum is identified, and one or more molten droplets of the solder material are deposited on the further solder bump. After ablating or depositing the solder material, a second laser beam is directed toward the identified solder bump with sufficient energy to cause the solder material in the identified solder bump to melt and reflow.

Abstract: A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

Abstract: A method for circuit fabrication includes defining a locus of a conductive trace to be formed on a circuit substrate. Molten droplets of a metal are ejected from a donor substrate in proximity to the circuit substrate onto the defined locus by a process of laser-induced forward transfer (LIFT), whereby the droplets adhere to and harden on the circuit substrate along a length of the defined locus. After the droplets have hardened, a laser beam is directed toward the defined locus with sufficient energy to cause the metal in the hardened droplets to melt and coalesce into a bulk layer extending along the length of the defined locus.

Abstract: A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.

Abstract: A method for fabrication includes providing a donor sheet, including a donor substrate, which is transparent in a specified spectral range, a sacrificial layer, which absorbs optical radiation within the specified spectral range and is disposed over the donor substrate, and a donor film, which includes a paste and is disposed over the sacrificial layer. The donor sheet is positioned so that the donor film is in proximity to a target location on an acceptor substrate. A pulsed laser beam impinges on the sacrificial layer with a pulse energy and spot size selected so as to ablate the sacrificial layer, thus causing a viscoelastic jet of the paste to be ejected from the donor film and to deposit, at the target location on the acceptor substrate, a dot having a diameter less than the spot size of the laser beam.

Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

Abstract: Optical apparatus includes an acousto-optic medium and an array of multiple piezoelectric transducers attached to the acousto-optic medium. A drive circuit is coupled to apply to the piezoelectric transducers respective drive signals including at least first and second frequency components at different, respective first and second frequencies and with different, respective phase offsets for the first and second frequency components at each of the multiple piezoelectric transducers.

Abstract: A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.

Abstract: Optical apparatus (20) includes a laser (22), which is configured to emit a beam of coherent optical radiation at a specified wavelength along a beam axis. A deflector (24) is configured to intercept and selectably deflect the beam over a range of angles relative to the beam axis. A plurality of diffractive optical elements (DOEs—32, 34, 36, 64, 66, 68) are positioned to receive the deflected beam at different, respective deflection angles within the range and to output respective diffracted beams. Beam-combining optics (42, 74) are configured to receive and deflect the diffracted beams from the DOEs so that all of the diffracted beams are directed along a common output axis toward a target (48).

Abstract: A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 ?m. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

Abstract: Printing apparatus includes a donor supply assembly, which positions a transparent donor substrate having opposing first and second surfaces and a donor film formed on the second surface so that the donor film is in proximity to a target area on an acceptor substrate. An optical assembly directs one or more beams of laser radiation to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate. Means are provided to mitigate or compensate for the variation in reflection of the laser radiation across an area of the donor substrate, so as to equalize a flux of the laser radiation that is absorbed in the donor film across the area of the donor substrate.

Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

Abstract: A method for manufacturing, the method includes coupling a sample to a mount, and immersing at least part of the sample in a photosensitive liquid having an upper surface defining an interface between the photosensitive liquid and a surrounding environment. At least a polymer layer that is coupled to at least a section of the sample is formed by: setting a thickness of the polymer layer by controlling a position of the sample relative to the upper surface, and illuminating at least the upper surface so as to polymerize the photosensitive liquid to form the polymer layer.

Abstract: A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

Abstract: A method for fabrication includes providing a substrate having an upper surface with pattern of one or more recesses formed therein. A laser beam is directed to impinge on a donor film so as to eject droplets of a fluid from the donor film by laser-induced forward transfer (LIFT) into the one or more recesses. The fluid hardens within the one or more recesses to form a solid piece having a shape defined by the one or more recesses. The substrate is removed from the solid piece. In some embodiments, the recesses are coated with a thin-film layer before ejecting the droplets into the recesses, such that the thin-film layer remains as an outer surface of the solid piece after removing the substrate.

Abstract: A method for 3D printing includes printing a first metallic material on a substrate as a support structure (48). A second metallic material, which is less anodic than the first metallic material, is printed on the substrate as a target structure (46), in contact with the support structure. The support structure is chemically removed from the target structure by applying a galvanic effect to selectively corrode the first metallic material.

Abstract: A method for material deposition includes providing a transparent donor substrate (56, 60) having opposing first and second surfaces and multiple donor films (62, 64) including different, respective materials on the second surface. The donor substrate is positioned in proximity to an acceptor substrate (41), with the second surface facing toward the acceptor substrate. Pulses of laser radiation are directed to pass through the first surface of the donor substrate and impinge on the donor films so as to induce ejection of molten droplets containing a bulk mixture of the different materials from the donor films onto the acceptor substrate.