Current-in-plane magnetic sensor including a trilayer structure
A current-in-plane magnetic sensor comprises a sensor stack including first and second layers of ferromagnetic material, a first nano-oxide layer positioned adjacent to the first layer of ferromagnetic material, and a layer of non-magnetic material positioned between the first and second layers of ferromagnetic material, wherein the thickness of the non-magnetic layer is selected to provide antiferromagnetic coupling between the first and second ferromagnetic layers, a magnetic field source for biasing the directions of magnetization of the first and second layers of ferromagnetic material in directions approximately 90° with respect to each other, a first lead connected to a first end of the sensor stack, and a second lead connected to a second end of the sensor stack. Disc drives that use the current-in-plane magnetic sensor are also included.
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This invention relates to magnetic sensors, and more particularly to current-in-plane magnetic sensors.
BACKGROUND OF THE INVENTIONCurrent-in-plane spin-valve (CIP-SV) magnetic sensors have been used as read sensors in magnetic disc drives. It has been predicted that the current-in-plane spin-valve (CIP-SV) will not be able to be used in discs having data densities beyond ˜100 Gbpsi. Other read sensor alternatives such as tunneling magnetoresistance sensors and current-perpendicular-to-plane (CPP) giant magnetoresistance sensors are being explored to replace the CIP-SV. There are issues with both of these types of sensors that are delaying them from being incorporated into products. Because of the vast amount of experience with CIP sensors, it would be advantageous to be able to use the CIP sensor in disc drives having data densities beyond 100 Gbpsi.
A general rule of thumb equation that gives the output voltage for a read sensor is ΔV=Ib*DRsheet (width/length)*ε, where Ib is the bias current, DRsheet is the maximum change in the sheet resistance of the sensor, width and length are the width and length of the sensor, and ε is an efficiency factor that takes into account things such as the sensitivity lost when patterning the sheet film into a final read head structure. For the CIP-SV, the DRsheet has reached its maximum around 3 to 4 Ω/square. The maximum Ib is limited by such things as Joule heating and asymmetry induced by the self fields from the bias current.
Spin valves include two layers of ferromagnetic material separated by a non-magnetic (NM) spacer layer. The direction of magnetization of one of the layers of ferromagnetic (FM) material, called the free layer, can be changed by interacting with an external magnetic field. The direction of magnetization of the other layer of ferromagnetic material, called the pinned layer, is fixed. Antiferromagnetic (AFM) material is needed in the CIP-SV to pin the pinned layer so that both an AFM and FM state can be achieved between the pinned and free layers when reading bits from the media.
This invention seeks to overcome the limitations spin valve CIP sensors by providing a CIP sensor that can produce a larger output from a smaller sensor, and does not require a pinning layer.
SUMMARY OF THE INVENTIONA current-in-plane magnetic sensor constructed in accordance with this invention comprises a sensor stack including first and second layers of ferromagnetic material, a first nano-oxide layer positioned adjacent to the first layer of ferromagnetic material, and a layer of non-magnetic material positioned between the first and second layers of ferromagnetic material, wherein the thickness of the non-magnetic layer is selected to provide antiferromagnetic coupling between the first and second ferromagnetic layers, a magnetic field source for biasing the directions of magnetization of the first and second layers of ferromagnetic material in directions approximately 90° with respect to each other, a first lead connected to a first end of the sensor stack, and a second lead connected to a second end of the sensor stack.
In another aspect, the invention encompasses disc drives comprising a motor for rotating a magnetic storage disc, an arm for positioning a read head adjacent to the disc, and wherein the read head includes a sensor stack including first and second layers of ferromagnetic material, a first nano-oxide layer positioned adjacent to the first layer of ferromagnetic material, and a layer of non-magnetic material positioned between the first and second layers of ferromagnetic material, wherein the thickness of the non-magnetic layer is selected to provide antiferromagnetic coupling between the first and second ferromagnetic layers, a magnetic field source for biasing the directions of magnetization of the first and second layers of ferromagnetic material in directions approximately 90° with respect to each other, a first lead connected to a first end of the sensor stack, and a second lead connected to a second end of the sensor stack.
BRIEF DESCRIPTION OF THE DRAWINGS
Referring to the drawings,
To demonstrate the invention, two example sensors were analyzed. The first example used a metal oxide as the nano-oxide layer on both the bottom and top of the sensor stack, and the second example used the metal oxide on only the bottom of the sensor stack.
Different materials have been investigated for use as the NOL material. In one example, referred to as a “Top and Bottom” configuration, the stack using a Cr oxide NOL is:
NiFeCr60 Å/Cr10 Å/RPO10010/CoFe15 Å/Cu19 Å/CoFe15 Å/Cr10 Å/RPO10010/Ta50 Å,
where RPO10010 represents a 10 second remote plasma oxidation (RPO) using 10 mT of oxygen. In this example, NiFeCr is the seed layer, the nano-oxide is CrO (formed by oxidation of the Cr layer), the ferromagnetic layers are CoFe, the non-magnetic layer is Cu, and the cap layer is Ta. The RPO can be performed by striking an oxygen plasma over a sputtering target (only oxygen in the chamber), but keeping the shutter closed so that the shutter is between the plasma and the wafer.
Because the oxide layer on the bottom may have an effect on the giant magnetoresistance (GMR) by altering the texture of the CoFe/Cu/CoFe trilayer, a second set of samples was deposited keeping the bottom oxide layer as a CoFeO layer. The second set of samples are referred to as “Top Only” samples. The “Top Only” samples kept the bottom layer as CoFeO and the top layer was varied. In one example the “Top Only” stack with a Cr oxide NOL is:
NiFeCr60 Å/CoFe10 Å/RPO10010/CoFe15 Å/Cu19 Å/CoFe15 Å/Cr10 Å/RPO10010/Ta 50 Å
The data for several different materials is shown in
To increase the DR/R ratio, the number of FM layers can be increased. The number of CoFe layers was varied in several samples to determine the enhancement due to the NOL. It would be expected for a given specularity from the NOL that the enhancement would be larger for the thinner sensors (fewer CoFe layers). The number of CoFe layers refers to the number of free CoFe layers. For example, a two CoFe layer stack would be:
NiFeCr60 Å/CoFe10 Å/RPO10010/CoFe 15 521 /Cu19 Å/CoFe20 Å/RPO10010/Ta 50 Å,
and a five CoFe layer stack would be:
NiFeCr60 Å/CoFe10 Å/RPO10010/CoFe15 Å/Cu19 Å/CoFe15 Å/Cu19 Å/CoFe15 Å/Cu19 Å/CoFe15 Å/Cu19Å/CoFe20 Å/RPO10010/Ta50 Å.
Two modifications were tried to reduce the hysteresis in the transfer curve. First, the bottom oxide layer was removed.
The three samples used to obtain the data shown in
NiFeCr60 Å/CoFe15 Å/Cu10.5 Å/CoFe20 Å/RPO10010/Ta50 Å;
NiFeCr50 Å/CoFe10 Å/RPO10020/NiFe10 Å/CoFe10 Å/Cu10.5 Å/CoFe10 Å/NiFe10 Å/CoFe10 Å/RPO1002/Ta50 Å; and
NiFeCr50 Å/CoFe10 Å/RPO10020/NiFe10 Å/CoFe10 Å/CuO10.5 Å/CoFe15 Å/RPO10020/Ta50 Å.
The NOL combined with the near first AFM peak Cu thickness worked very well. Without much optimization, a DR/R of 20% was achieved, and a very large DR/sq. of 8 Ω/sq. was achieved. With this large increase in DR and the potential for increasing the Ib, these sensors could have a much higher voltage amplitude than CIP-SVs.
Experiments were conducted to demonstrate the ability to control the Cu thickness.
Table No. 1 compares parameters for a CIP trilayer sensor of this invention and a standard CIP spin-valve.
The large DR/R and DR/sq. in the CIP sensor that produced the results in Table No. 1 were achieved by using: a thin Cu spacer layer to reduce shunting, thin seedlayers to reduce shunting, an insulating cap layer to reduce shunting, dual NOLs to increase specular scattering, and thin FM layers to reduce shunting. The CIP sensors of this invention can include a nonmagnetic layer having a thickness in the range of 5 to 12 Å.
This combination of features takes advantage of the fact that Rsheet vs. thickness is highly non-linear for a layer thickness much less than the mean free path (MFP), which greatly enhances the magnetoresistance. When in a low resistance (ferromagnetic state), the electrons freely move between the two ferromagnetic layers and the non-magnetic layer. When in the high resistance (antiferromagnetic state), the electrons can only freely move between one ferromagnetic layer and the non-magnetic layer. Once the electrons enter the second ferromagnetic layer, they are quickly scattered.
Several examples have been prepared. A first trilayer CIP sensor (sample 1) with nano-oxide layers had the structure:
Sputter etch/NiFeCr60 Å/CoFe10 Å/RPO10010/CoFe15 Å/Cu19 Å/CoFe20 Å/RPO10010/Ta50 Å.
The first sensor had DR/sq. ˜4.2 Ω/sq.; DR/R ˜15.5%; and Rsheet ˜27 Ω/sq.
A second trilayer CIP sensor (sample 2) with nano-oxide layers and a thin Cu nonmagnetic layer had the structure:
Sputter etch/NiFeCr60 Å/CoFe10 Å/RPO10010/CoFe15 Å/Cu10.5 Å/CoFe15 Å/RPO10010/Ta50 Å.
The second sensor had DR/sq. ˜8.2 Ω/sq.; DR/R ˜18.2%; and Rsheet ˜45 Ω/sq.
A third trilayer CIP sensor (sample 3) with nano-oxide layers and a thinner seed layer and cap layer had the structure:
Sputter etch/NiFeCr20 Å/CoFe10 Å/RPO10020/CoFe15 Å/Cu 0.5 Å/CoFe15 Å/RPO10020/Ta35 Å.
The third sensor had DR/sq. ˜13.7 Ω/sq.; DR/R ˜20.3%; and Rsheet ˜67 Ω/sq.
A fourth trilayer CIP sensor (sample 4) with nano-oxide layers had the structure:
Sputter etch/NiFeCr20 Å/CoFe10 Å/RPO10020/CoFe15 Å/Cu10.5 Å/CoFe15 Å/Al5 Å/RPO10020/(Al15 Å/RPO10060)×3.
The fourth sensor had DR/sq. ˜22 Ω/sq.; DR/R ˜27%; and Rsheet ˜82 Ω/sq.
The data for these examples is shown in
Micromagnetic modeling of a full magnetic recording head using the CIP sensor of this invention has been performed. The head included shields and a permanent magnet for biasing, and it read data from perpendicular media. The transfer curve for the head is shown in
The graph of
Thermal stability is an important consideration for these sensors. Thermally stable stacks have been achieved with DR/sq. ˜16.5 Ω/sq.; DRR ˜33%; and Rsheet ˜50 Ω/sq. Thermal stability has been tested with 300° C. anneals and
Thin Cu diffusion barriers have also been inserted at different locations to block the diffusion of oxygen. In the example used for
This invention provides CIP sensors that do not require an AFM pinning layer. By removing the pinning layer, no high temperature, high magnetic field anneal is needed to set the AFM pinning direction. In addition, there is much less current shunting, so more of the current remains in the layers that give the MR effect (FM/NM/FM), which leads to a larger GMR. Since the AFM is the thickest layer in a CIP-SV stack, removing the AFM allows for a decreased shield-to-shield spacing. Also, the FM/NM/FM layers are smoother without the thick AFM layer under them, so the NM layer can be made much thinner without having too large of Neel coupling.
This invention provides a CIP sensor that has a much larger output by increasing the DR/sq. The sensor is also thinner than a CIP-SV, which helps to increase the linear bit density by reducing the shield-to-shield spacing. In addition, the effect of specular scattering layers is greater in a thinner structure.
These sensors utilize AFM magnetostatic and FM or AFM RKKY coupling between two FM layers, and a magnetic bias field for biasing the layers such that their magnetizations are oriented ˜90° with respect to each other.
The sensors of this invention can be used in magnetic storage systems such as disc drives or probe storage devices, or in any other devices where magnetic sensors are used.
While this invention has been described in terms of several examples, it will be understood by those skilled in the art that various changes can be made to the described examples without departing from the scope of the invention as set forth in the following claims.
Claims
1. A current-in-plane magnetic sensor comprising:
- a sensor stack including first and second layers of ferromagnetic material, a first nano-oxide layer positioned adjacent to the first layer of ferromagnetic material, and a layer of non-magnetic material positioned between the first and second layers of ferromagnetic material, wherein the thickness of the non-magnetic layer is selected to provide antiferromagnetic coupling between the first and second ferromagnetic layers;
- a magnetic field source for biasing the directions of magnetization of the first and second layers of ferromagnetic material in directions approximately 90° with respect to each other;
- a first lead connected to a first end of the sensor stack; and
- a second lead connected to a second end of the sensor stack.
2. The magnetic sensor of claim 1, wherein the layer of non-magnetic material has a thickness in the range of 5 to 12 Å.
3. The magnetic sensor of claim 1, wherein the first and second layers of ferromagnetic material each have a thickness in the range of 10 to 20 Å.
4. The magnetic sensor of claim 1, wherein the antiferromagnetic coupling between the first and second ferromagnetic layers comprises:
- RKKY coupling, magnetostatic coupling, or a combination of RKKY coupling and magnetostatic coupling.
5. The magnetic sensor of claim 1, wherein the first nano-oxide layer is formed by oxidizing a metallic layer.
6. The magnetic sensor of claim 5, wherein the metallic layer comprises a material selected from Al, Ta, Fe, Co and Ni, and alloys of Al, Ta, Fe, Co and Ni.
7. The magnetic sensor of claim 5, wherein the metallic layer has a thickness in the range of 5 to 15 Å.
8. The magnetic sensor of claim 1, further comprising:
- a substrate positioned adjacent to a first side of the sensor stack; and
- a cap layer positioned adjacent to the first nano-oxide layer, wherein the first nano-oxide layer is positioned adjacent to a second side of the sensor stack opposite the substrate.
9. The magnetic sensor of claim 8, wherein the cap layer comprises an insulator.
10. The magnetic sensor of claim 8, wherein the cap layer comprises a material selected from the group of: Al oxide, Fe oxide, Co oxide, Ni oxide, Ta, and TaN.
11. The magnetic sensor of claim 1, further comprising:
- a second nano-oxide layer positioned adjacent to the second layer of ferromagnetic material.
12. The magnetic sensor of claim 11, wherein the second nano-oxide layer is formed by oxidizing a metallic layer comprising a material selected from Fe, Co and Ni, and alloys of Fe, Co and Ni.
13. The magnetic sensor of claim 12, wherein the metallic layer has a thickness in the range of 5 to 15 Å.
14. The magnetic sensor of claim 11, further comprising:
- a seed layer positioned adjacent to the second nano-oxide layer.
15. The magnetic sensor of claim 14, wherein the seed layer comprises NiFeCr.
16. The magnetic sensor of claim 14, wherein the seed layer has a thickness less than 40 Å.
17. The magnetic sensor of claim 1, wherein the first ferromagnetic layer comprises a material selected from the group of CoFe, NiFe, Fe, Co and Ni, and alloys thereof, and the second ferromagnetic layer comprises a material selected from the group of CoFe, NiFe, Fe, Co and Ni, and alloys thereof.
18. The magnetic sensor of claim 1, wherein the magnetic field source comprises:
- a permanent magnet positioned adjacent to a side of the sensor stack.
19. The magnetic sensor of claim 18, wherein the side is opposite an air bearing side of the sensor stack.
20. The magnetic sensor of claim 1, further comprising:
- a diffusion layer positioned adjacent to the first nano-oxide layer.
21. The magnetic sensor of claim 1, wherein:
- AFM magnetostatic coupling between the first and second layers of ferromagnetic material is substantially balanced with the FM RKKY coupling.
22. A disc drive comprising:
- a motor for rotating a magnetic storage disc;
- an arm for positioning a read head adjacent to the disc; and
- wherein the read head includes a sensor stack including first and second layers of ferromagnetic material, a first nano-oxide layer positioned adjacent to the first layer of ferromagnetic material, and a layer of non-magnetic material positioned between the first and second layers of ferromagnetic material, wherein the thickness of the non-magnetic layer is selected to provide antiferromagnetic coupling between the first and second ferromagnetic layers, a magnetic field source for biasing the directions of magnetization of the first and second layers of ferromagnetic material in directions approximately 90° with respect to each other, a first lead connected to a first end of the sensor stack, and a second lead connected to a second end of the sensor stack.
23. The disc drive of claim 22, further comprising:
- a cap layer positioned adjacent to the first nano-oxide layer.
24. The disc drive of claim 22, further comprising:
- a second nano-oxide layer positioned adjacent to the second layer of ferromagnetic material.
25. The disc drive of claim 22, further comprising:
- a diffusion layer positioned adjacent to the first nano-oxide layer.
26. The disc drive of claim 22, wherein:
- AFM magnetostatic coupling between the first and second layers of ferromagnetic material is substantially balanced with the FM RKKY coupling.
Type: Application
Filed: Jan 26, 2004
Publication Date: Jul 28, 2005
Patent Grant number: 7019371
Applicant: Seagate Technology LLC (Scotts Valley, DE)
Inventor: Michael Seigler (Pittsburgh, PA)
Application Number: 10/764,720