ELECTRONIC ASSEMBLY PACKAGING
The present invention provides an assembly for protecting automotive electronics. The assembly includes a circuit board, a cover, and a metal housing. The metal housing is disposed over and around the circuit board. The cover and metal housing are crimped together to create a seal that protects the circuit board inside the metal housing and attaches the cover to the metal housing.
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1. Field of the Invention
The present invention generally relates to an assembly for protecting electronic components.
2. Description of Related Art
Powertrain control modules are currently packaged in diverse mechanical configurations. Such mechanical configurations often involve expensive custom die cast and stamp metal covers bonded to other custom polymeric or metal parts to protect the electronic assembly. Powertrain control modules must be designed to operate in harsh, under hood environmental conditions. Yet the high volume required to fulfill an automotive application also requires a cost effective design. The current cost of a typical aluminum die cast housing may represent a significant cost of the overall module. In addition, stamped metal and die cast covers are susceptible to gaps between the top and bottom covers increasing susceptibility to environmental conditions and electromagnetic interference. Further, plastic configurations may offer no electromagnetic interference protection at all.
In view of the above, it is apparent that there exists a need for an improved assembly for protecting electronic components.
SUMMARYIn satisfying the above need, as well as, overcoming the enumerated drawbacks and other limitations of the related art, the present invention provides an assembly for protecting automotive electronics. The assembly includes a circuit board, a cover, and a metal housing. The metal housing is disposed over and around the circuit board. The cover and metal housing are crimped together to create a seal that protects the circuit board inside the metal housing and attaches the cover to the metal housing.
In another aspect of the present invention, the metal housing may be a deep drawn metal housing, or alternatively a rolled metal sheet joined at two ends to create a seam that is welded or soldered. In addition, the metal housing may be coated with an anti-corrosive material. To provide thermal dissipation and support the circuit board, a surface in the form of a groove or trough extending inward from the metal housing towards the circuit board.
In another aspect of the present invention, the cover may include an electrical connector providing electrical communication with the circuit board from outside the assembly. Further, the electrical connector may be molded into the cover thereby providing improved sealing between the cover and the connector.
In another aspect of the present invention, the crimped region attaching the cover to the metal housing extends along the entire perimeter or along substantially the entire perimeter between the metal housing and the cover. The enlarged region includes a portion of the metal housing and a portion of the cover crimped together forming mating surfaces on the metal housing and the flange, thereby attaching the metal housing to the cover.
Further objects, features and advantages of this invention will become readily apparent to persons skilled in the art after a review of the following description, with reference to the drawings and claims that are appended to and form a part of this specification.
BRIEF DESCRIPTION OF THE DRAWINGS
Referring now to
The cover 14 is disposed about the circuit board 12 to protect electronic components from the environment surrounding the assembly 10. The cover 16 may include an electrical connector 17 with electrical contacts 18 that provide an electrical connection through the cover 16 to the printed circuit board 12. The electrical connector 17 may be molded as part of the cover 16 to provide a robust seal therebetween. The metal housing 14 is attached to and seals with the cover 16 in a crimped region 20. The metal housing 14 may be a deep drawn metal housing, as shown in
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As a person skilled in the art will readily appreciate, the above description is meant as an illustration of implementation of the principles this invention. This description is not intended to limit the scope or application of this invention in that the invention is susceptible to modification, variation and change, without departing from spirit of this invention, as defined in the following claims.
Claims
1. An assembly for protecting automotive electronics, the assembly comprising:
- a circuit board;
- a cover including a flange extending from the cover;
- a metal housing disposed over the circuit board, wherein the metal housing and the flange includes a crimped region the crimped region including a bent portion wherein the metal housing is in mated engagement with the flange.
2. The assembly according to claim 1, wherein the crimped region forms a seal between the metal housing and the cover.
3. The assembly according to claim 1, wherein the metal housing includes a seamless recess formed in the metal housing and configured to receive the circuit board.
4. The assembly according to claim 1, wherein the metal housing is a metal sheet including a seam along the length of the housing where two ends of the metal sheet are joined.
5. The assembly according to claim 4, wherein the metal housing is welded along the length of the seam.
6. The assembly according to claim 4, wherein the metal housing is soldered along the length of the seam.
7. The assembly according to claim 4, wherein the metal housing is crimped together along the seam.
8. The assembly according to claim 4, wherein the metal housing is an adhesive applied along the seam.
9. The assembly according to claim 8, wherein the adhesive is an electrically conductive adhesive.
10. The assembly according to claim 1, wherein the metal housing is coated with an anti-corrosive material.
11. The assembly according to claim 1, wherein the metal housing includes at least one surface extending toward the circuit board to provide improved thermal dissipation.
12. The assembly according to claim 11, wherein the at least one surface provides mechanical support to the circuit board.
13. The assembly according to claim 1, wherein the crimped region extends along the entire perimeter between the metal housing and the cover.
14. The assembly according to claim 1, wherein the crimped region extends along substantially the entire perimeter between the metal housing and the cover.
15. The assembly according to claim 1, wherein a portion of the metal housing and a portion of the cover are crimped together forming mating surfaces on the metal housing and the cover, thereby attaching the metal housing to the cover.
16. The assembly according to claim 15, wherein the metal housing is folded over the cover and crimped such that a first surface of the metal housing mates with a first side of the cover and a second surface of the metal housing mates with a second side of the cover.
17. The assembly according to claim 15, wherein both the metal housing and cover are folded over and crimped such that a first surface of the metal housing mates with a first surface of the cover, a second surface of the cover mates with a third surface of the cover, and a fourth surface of the cover mates with a second surface of the metal housing.
18. The assembly according to claim 1, wherein the metal housing and the cover are rolled together to form the crimped region thereby attaching the metal housing to the cover.
19. The assembly according to claim 1, wherein the cover is mechanically coupled to the circuit board.
20. The assembly according to claim 1, wherein the cover Includes an electrical connector providing electrical communication with the circuit board from outside the assembly.
21. The assembly according to claim 1, wherein the electrical connector is molded together with the cover.
Type: Application
Filed: Jun 16, 2004
Publication Date: Dec 22, 2005
Applicant:
Inventors: Anthony Satullo (Beverly Hills, MI), Robert Belke (West Bloomfield, MI), Hong Zhou (Ann Arbor, MI), Diane Jett (Warren, MI), Bertrand Mohr (Ann Arbor, MI), John Trublowski (Troy, MI), Michael Schulke (Royal Oak, MI), Adam Schubring (Canton, MI)
Application Number: 10/869,729