Micro-mechanically strained semiconductor film
One aspect of the present subject matter relates to a method for forming strained semiconductor film. In various embodiments, a single crystalline semiconductor film is formed on a substrate surface, and a recess is created beneath the film. A portion of the film is influenced into the void and strained. In various embodiments, the naturally-occurring Van der Waal's force is sufficient to influence the film into the void. In various embodiments, a nano-imprint mask is used to assist with influencing the film into the void. In various embodiments, an oxide region is formed in a silicon substrate, and a single crystalline silicon film is formed on the semiconductor substrate and on at least a portion of the oxide region. The oxide region is removed allowing the Van der Waal's force to bond the film to the silicon substrate. Other aspects are provided herein.
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The present application is a divisional of U.S. application Ser. No. 10/379,749, filed on Mar. 5, 2003, which is herein incorporated by reference in its entirety.
This application is related to the following commonly assigned U.S. patent applications which are herein incorporated by reference in their entirety: “Output Prediction Logic Circuits With Ultra-Thin Vertical Transistors and Methods of Formation,” U.S. application Ser. No. 10/164,611, filed on Jun. 10, 2002; “Localized Ultra-Thin Strained Silicon On Insulator,” U.S. application Ser. No. 10/425797, filed on Apr. 29, 2003; “Strained Si/SiGe Layer Structures By Ion Implantation,” U.S. application Ser. No. 10/431134, filed on May 7, 2003; and “Strained Silicon By A Twist/Tilt Misorientation In Wafer Bonding,” U.S. application Ser. No. 10/425484, filed on Apr. 29, 2003.
TECHNICAL FIELDThis disclosure relates generally to semiconductor devices, and more particularly, to devices formed with strained semiconductor films.
BACKGROUNDThe semiconductor industry continues to strive for improvements in the speed and performance of semiconductor devices. Strained silicon technology has been shown to enhance carrier mobility in both n and p-channel devices, and thus has been of interest to the semiconductor industry as a means to improve device speed and performance.
One technique for producing strained silicon involves growing silicon (Si) layers on relaxed silicon-germanium (Si—Ge) layers. There is a large mismatch in the cell structure between the Si and Si—Ge layers. This mismatch causes a pseudo-morphic layer of Si on relaxed SiGe to be under biaxial tensile strain. The biaxial strain modifies the band structure and enhances carrier transport in the Si layer. In an electron inversion layer, the subband splitting is larger in strained Si because of the strain-induced band splitting in addition to that provided by quantum confinement. For example, the ground level splitting (E0(d4)-E0(d2)) in a MOS inversion layer at 1 MV/cm transverse field is ˜120 meV for unstrained Si and ˜250 meV for strained Si. The increase in energy splitting reduces inter-valley scattering and enhances NMOSFET mobility, as demonstrated at low (<0.6 MV/cm) and higher (˜1 MV/cm) vertical fields. The scaled transconductance (gm) is also improved due to the reduced density of states and enhanced non-equilibrium transport.
Si has a lattice constant of 5.43095 Å, and Ge has a lattice constant of 5.64613 Å. The lattice constant of SiGe is between the lattice constant of Si and the lattice constant of Ge, and depends on the percentage of Ge in the SiGe layer.
where the subscript LC represents the lattice constant of the SiGe or Si. Thus, as shown in Equation 2, the Si on the SiGe substrate has a biaxial strain of about 1.28%.
Referring again to
One method for forming the strained Si layer on the relaxed SiGe layer involves epitaxially growing the Si and SiGe layers using an ultra-high vacuum chemical vapor deposition (UHVCVD) process. The UHVCVD process which is a costly and complex process. The Ge content is graded in steps to form a fully relaxed SiGe buffer layer before a thin (˜20 nm) strained Si channel layer is grown. X-ray diffraction analysis can be used to quantify the Ge content and strain relaxation in the SiGe layer. The strain state of the Si channel layer can be confirmed by Raman spectroscopy.
A proposed back end approach for straining silicon applies uniaxial strain to wafers/dies after the integrated circuit process is complete. The dies are thinned to membrane dimensions and then affixed to curved substrates to apply an in-plane, tensile strain after device manufacture.
Research has found that uniaxial strained silicon has advantages over biaxial strained silicon. Less strain is required to obtain an improvement factor if the silicon is strained uniaxially rather than biaxially. Uniaxial strained silicon reduces band gap and in-plane effective mass to improve conduction. Additionally, the work function is altered and contact potentials are reduced.
There is a need in the art to provide improved strained semiconductor films and devices that incorporate the strained films, and to provide improved methods for forming strained semiconductor films.
SUMMARYThe above mentioned problems are addressed by the present subject matter and will be understood by reading and studying the following specification. The present subject matter relates to strained semiconductor films along with the structures and devices that include strained semiconductor films. The present subject matter further relates to methods of forming the strained semiconductor films along with methods of forming structures and devices that include strained semiconductor films.
The present subject provides uniaxially-strained semiconductor films, which has been shown to possess advantages over biaxially strained films. The strained films are produced using semiconductor processes that are simple and low cost. Strained semiconductor layers are provided by forming dimpled semiconductor layers using a micro-mechanical technique. The micro-mechanical technique uses the strong Van der Waal's force that naturally bond surfaces together as the bonding force between a substrate with recesses and the semiconductor layer. The semiconductor layers dimple as they are drawn into the recesses and bonded to the substrate. In various embodiments, an imprint mask is used to provide the dimpling force, in addition to the Van der Waal's force. The strained semiconductor material enhances electron mobility, and is also capable of enhancing hole mobility.
One aspect of the present subject matter relates to a method for forming strained semiconductor film. In various embodiments of the method, a single crystalline semiconductor film is formed on a substrate surface, and a recess is created beneath the film such that a portion of the film is influenced into the recess to strain the film. In various embodiments, the naturally-occurring Van der Waal's force is sufficient to influence the film into the recess. In various embodiments, a nano-imprint mask is used to assist with influencing the film into the recess.
In various embodiments of the method, an oxide region is formed in a silicon substrate using a LOCal Oxidation of Silicon (LOCOS) process. A single crystalline silicon film is formed on the semiconductor substrate and on at least a portion of the oxide region. The oxide region is removed from underneath the film such that a Van der Waal's force acts to draw a portion of the film into the void and bond the film to the silicon substrate.
One aspect of the present subject matter relates to a semiconductor structure. In various embodiments, the structure includes a substrate with a number of recesses and a single crystalline semiconductor film bonded to the substrate within the number of recesses, which micro-mechanically strains the semiconductor film. The structure further includes a gate formed over the semiconductor film over at least a portion of each of the number of recesses. The gate is separated from the semiconductor film by a gate insulator. The semiconductor film formed over at least a portion of each of the number of recesses includes a channel region having a length less than 1000 Å and a depth less than about 300 Å. Thus, an ultra-thin body is capable of being formed in the semiconductor film.
These and other aspects, embodiments, advantages, and features will become apparent from the following description of the present subject matter and the referenced drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
The following detailed description refers to the accompanying drawings which show, by way of illustration, specific aspects and embodiments in which the present subject matter may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present subject matter. The various embodiments of the present subject matter are not necessarily mutually exclusive as aspects of one embodiment can be combined with aspects of another embodiment. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present subject matter. In the following description, the terms wafer and substrate are interchangeably used to refer generally to any structure on which integrated circuits are formed, and also to such structures during various stages of integrated circuit fabrication. Both terms include doped and undoped semiconductors, epitaxial layers of a semiconductor on a supporting semiconductor or insulating material, combinations of such layers, as well as other such structures that are known in the art. The term “horizontal” as used in this application is defined as a plane parallel to the conventional plane or surface of a wafer or substrate, regardless of the orientation of the wafer or substrate. The term “vertical” refers to a direction perpendicular to the horizontal as defined above. Prepositions, such as “on”, “side” (as in sidewall), “higher”, “lower”, “over” and “under” are defined with respect to the conventional plane or surface being on the top surface of the wafer or substrate, regardless of the orientation of the wafer or substrate. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled.
In various embodiments, the present subject matter micro-mechanically strains ultra-thin transistor body layers using the naturally-occurring Van der Waal's force. The term micro-mechanical refers to the quantitative relations of force and matter at a very small or microscopic level. An ultra-thin body relates to transistor bodies having a length of about 100 nm (1000 Å) or less, and a thickness of about 30 nm (300 Å) or less. Once strained, the ultra-thin body layer is bonded to the substrate by Van der Waal's force, which is the natural force that holds together bonded wafers. The present subject matter uses well-known, low cost semiconductor processing techniques, and takes advantage of the naturally-occurring Van der Waal's force to mechanically flex or bend the semiconductor film to obtain a desired strain in the film. The resulting strain is sufficient to desirably modify the band structure and electron mobility of the semiconductor material.
In various embodiments, the semiconductor film 302 includes a single crystalline semiconductor material such a single crystalline silicon film. In various embodiments, the substrate 301 includes a silicon substrate. In various embodiments, the recess is formed in the substrate so as to cause the semiconductor film to undergo uniaxial strain when it is mechanically flexed into the recess and bonded to the substrate via the Van der Waal's force.
The illustrated semiconductor structure includes a transistor. In various embodiments, the strained semiconductor film includes an ultra thin body region 304 of a transistor that has a channel length less than or equal to about 100 nm and a thickness less or equal to about 30 nm. The transistor includes a first diffusion region 305 and a second diffusion region 306 (also referred to as source/drain regions). In various embodiments, the strained portion of the semiconductor film in the recess includes at least a portion of the first and second diffusion regions. According to various embodiments of the present subject matter, at least a portion of the first and second diffusion regions extend to non-strained portions of the semiconductor film. Furthermore, in various embodiments, at least a portion of the first and second diffusion region extend into the substrate. The illustrated transistor includes a gate insulator 307, such as an oxide and the like, formed above the body region 304 of the transistor and a gate 308 is formed on the gate insulator using relatively inexpensive semiconductor processes that are known to one of ordinary skill in the art.
Upon reading and comprehending this disclosure, one of ordinary skill in the art will understand the benefits associated with having a strained ultra-thin body region to form a channel region in the transistor. The continuous scaling of MOSFET technology to reduce channel lengths to sub-micron dimensions causes significant problems in conventional transistor structures. It is desired that the junction depth is much less than the channel length to minimize short channel effects such as drain induced barrier lowering, threshold voltage roll off, and sub-threshold conduction. In a Dynamic Random Access Memory (DRAM) application, for example, sub-threshold conduction is a significant problem as it reduces the charge storage retention time on capacitor nodes. When a MOSFET is scaled to have sub-micron channel lengths, the junction depths should be around a few hundred Å for channel lengths of about 1000 Å (100 nm). However, such shallow junctions are difficult to form by conventional implantation and diffusion techniques. One known method for suppressing short-channel effects uses extremely high levels of channel doping. However, these extremely high channel doping levels increase leakage and reduce carrier mobility such that the improved performance achieved by making the channel shorter is negated by lower carrier mobility. The strained silicon films of the present subject increase carrier mobility in the channel region, and thus can alleviate problems associated with the high channel doping.
The single crystalline semiconductor layer in various embodiments of the present subject matter includes a single crystalline silicon layer. One method for forming the single crystalline silicon layer involves a solid phase epitaxial process. In various embodiments, the solid phase epitaxial process includes depositing a thin amorphous silicon layer and annealing the structure to recrystallize the amorphous silicon. One end of the amorphous layer is seeded to promote a desired crystalline growth. In various embodiments, for example, one end of the amorphous layer is implanted with silicon (illustrated by the vertical arrow and the “Si” reference). Upon annealing, the amorphous silicon laterally recrystallizes (illustrated by the horizontal arrow), thus providing an ultra-thin (less than or equal to about 300 Å thick) single crystalline layer of silicon 415 grown over the buried oxide 414. A grain boundary 416 is illustrated on the non-seeded end of the layer. In various embodiments, the deposited amorphous layer is lightly doped with desired channel impurities for a desired design of a transistor structure.
One of ordinary skill in the art will understand, upon reading and comprehending this disclosure, that the slowly tapering shape of the bird's beak is useful to controllably induce strain in ultra-thin semiconductor films. However, the tapered bird's beak shape is not required to practice the present subject matter. One of ordinary skill in the art will understand, upon reading and comprehending this disclosure, that other means for creating a recess or void in the substrate can be used. For example, a grinding process can be used to create a recess or a trench can be otherwise formed in the substrate. The resulting recess can be filled using a material that can be later etched away or otherwise removed after the single crystalline semiconductor layer is formed over the recess.
Referring to
The present subject matter is capable of being used to create dimpled semiconductor layers such as ultra-thin silicon layers. The dimpled areas of the silicon layers provide a desired strain in the semiconductor. FIGS. 6A-B, 7A-B, 8 and 9 illustrate a process for creating a pattern of dimples in a semiconductor film to create locally strained film, according to various embodiments of the present subject mater. Semiconductor devices are capable of being fabricated to incorporate the strained film. For example, the dimpled or micro-mechanically strained film is capable of being incorporated in the channel region of MOSFETs.
In various embodiments, a solid phase epitaxial process is performed to form single crystalline silicon films on the substrate. In one solid phase epitaxial process, an amorphous silicon film is deposited on the substrate and patterned to form rows as illustrated in
One of ordinary skill in the art will understand, upon reading and comprehending this disclosure, that the transistors can be fabricated in the micro-mechanical strained ultra-thin silicon body layer using conventional techniques. Each transistor includes a gate insulator 907, such as a gate oxide and the like, deposited over the channel region, and a gate 908 deposited over the gate insulator. Each transistor includes a first diffusion region 905 and a second diffusion region 906. In the illustrated embodiment, the transistors share second diffusion regions 906. Other layouts are encompassed by the present subject matter. One of ordinary skill in the art will also understand, upon reading and comprehending this disclosure, how to fabricate the appropriate wiring level(s) for these transistors.
The diffusion regions can be formed using a number of processes. In various embodiments, for example, the substrate includes appropriately doped regions beneath the desired diffusion regions in the semiconductor film. These diffusion regions in the substrate may be positioned where the amorphous region contacts the substrate in
The memory array 1270 includes a number of memory cells 1200. The memory cells in the array are arranged in rows and columns. In various embodiments, word lines connect the memory cells in the rows, and bit lines connect the memory cells in the columns. The read/write control circuitry 1272 includes word line select circuitry 1274, which functions to select a desired row. The read/write control circuitry 1272 further includes bit line select circuitry 1276, which functions to select a desired column. The read/write control circuitry 1272 further includes read circuitry 1280, which functions to detect a memory state for a selected memory cell in the memory array 1270.
The illustration of the system 1300 is intended to provide a general understanding of one application for the structure and circuitry of the present subject matter, and is not intended to serve as a complete description of all the elements and features of an electronic system using strained semiconductor films according to the present subject matter. As one of ordinary skill in the art will understand, such an electronic system can be fabricated in single-package processing units, or even on a single semiconductor chip, in order to reduce the communication time between the processor and the memory device.
Applications containing strained semiconductor films, such as transistors with a strained ultra-thin semiconductor body layer, as described in this disclosure include electronic systems for use in memory modules, device drivers, power modules, communication modems, processor modules, and application-specific modules, and may include multilayer, multichip modules. Such circuitry can further be a subcomponent of a variety of electronic systems, such as a clock, a television, a cell phone, a personal computer, an automobile, an industrial control system, an aircraft, and others.
CONCLUSIONUniaxially strained semiconductor films are adapted to be fabricated using common and economical semiconductor processing techniques. Semiconductor layers are dimpled using a micro-mechanical technique to provide strained semiconductor material. The micro-mechanical technique uses the strong Van der Waal's force that naturally bond surfaces together to dimple and bond the strained semiconductor layer to recesses in a substrate. In various embodiments, an imprint mask is used to assist the Van der Waal's force to dimple the semiconductor layers. The strained semiconductor material enhances electron mobility, and is also capable of enhancing hole mobility.
This disclosure includes several processes, circuit diagrams, and cell structures. The present subject matter is not limited to a particular process order or logical arrangement. Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that any arrangement which is calculated to achieve the same purpose may be substituted for the specific embodiments shown. This application is intended to cover adaptations or variations of the present subject matter. It is to be understood that the above description is intended to be illustrative, and not restrictive. Combinations of the above embodiments, and other embodiments, will be apparent to those of skill in the art upon reviewing the above description. The scope of the present subject matter should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
Claims
1. A semiconductor structure, comprising:
- a substrate with a top surface and a recess in the top surface; and
- a crystalline layer bonded to the substrate, the crystalline layer having a thickness sufficiently thin to be bonded to the recess of the substrate and induce a strain in the crystalline layer.
2. The structure of claim 1, wherein the strain in the crystalline layer is at least 0.5%.
3. The structure of claim 1, wherein the strain in the crystalline layer is at least 1%.
4. A structure, comprising:
- a substrate with a top surface and a recess in the top surface; and
- a crystalline layer bonded to the substrate including to the recess in the top surface, the crystalline layer having a thickness no more than approximately 300 Å, and further having a local strain of at least 0.5% induced by a bond between the crystalline layer and the recess.
5. The structure of claim 4, wherein the strain in the crystalline layer is at least 1%.
6. The structure of claim 4, wherein the strain is uniaxial.
7. A structure, comprising:
- a substrate with a top surface and a recess in the top surface, the recess having a horizontal dimension in a first direction approximately equal to 1000 Å; and
- a crystalline layer bonded to the substrate including to the recess in the top surface, the crystalline layer having a thickness of approximately 300 Å, and further having a local strain where the crystalline layer is bonded to the recess.
8. The structure of claim 7, wherein the strain in the crystalline layer is at least 0.5%.
9. The structure of claim 7, wherein the strain in the crystalline layer is at least 1%.
10. A structure, comprising:
- a substrate with a top surface and a recess in the top surface, the recess having a predetermined contour; and
- a crystalline layer having a thickness less than approximately 300 Å bonded to the substrate, the crystalline layer being conformed to the predetermined contour of the recess to induce a local uniaxial strain.
11. The structure of claim 10, wherein the predetermined contour is created by performing a local oxidation of silicon (LOCOS) process and removing oxide resulting from the LOCOS process.
12. The structure of claim 10, wherein a horizontal dimension in a first direction of the LOCOS process is approximately 1000 Å.
13. A semiconductor structure, comprising:
- a substrate having a number of recesses; and
- a single crystalline semiconductor film bonded to the substrate within the number of recesses via a Van der Waal's force to form a semiconductor film with a number of dimples corresponding to the number of recesses, wherein the semiconductor film in the number of dimples is strained.
14. The structure of claim 13, wherein the semiconductor film has a depth less than 30 nm.
15. The structure of claim 13, further comprising a transistor formed at each of the number of dimples, wherein the transistor includes a body region formed by at least a portion of the strained semiconductor film in the dimple.
16. The structure of claim 15, wherein the body region of each transistor is an ultra-thin body region.
17. The structure of claim 15, wherein the body region of each transistor has a length less than 100 nm and a depth less than 30 nm.
18. A silicon structure, comprising:
- a silicon substrate formed with a number of recesses;
- a single crystalline silicon film bonded to the substrate within the number of recesses due to a Van der Waal's force to micro-mechanically strain the silicon film; and
- a gate formed over the silicon film over at least a portion of each of the number of recesses, the gate being separated from the silicon film by a gate insulator,
- wherein the silicon film formed over at least a portion of each of the number of recesses includes a strained ultra-thin body region.
19. The structure of claim 18, wherein the ultra-thin body region is under a strain of at least 0.5%.
20. The structure of claim 18, wherein the ultra-thin body region is under a strain of about 1%.
21. A semiconductor structure, comprising:
- a semiconductor membrane with local strained areas, formed by a process including: performing a local oxidation of silicon (LOCOS) process in a substrate and removing resulting oxide to form a recess in the substrate; and bonding a semiconductor membrane to the substrate to induce a strain where the membrane conforms to the recess in the substrate.
22. The structure of claim 21, wherein the local strained areas of the semiconductor membrane have a strain greater than 0.5%.
23. The structure of claim 21, wherein the recess has a horizontal dimension in a first direction of approximately 100 Å and a vertical depth of approximately 75 Å.
24. The structure of claim 21, wherein the semiconductor membrane has a thickness less than approximately 300 Å.
25. A transistor, comprising:
- a single crystalline body region positioned between a first source/drain region and a second source/drain region, the single crystalline body region being bonded to a recess in a substrate to induce a strain in the single crystalline body region;
- a gate insulator formed over the body region; and
- a gate formed over the gate insulator.
26. The transistor of claim 25, wherein the single crystalline body region includes silicon.
27. The transistor of claim 25, wherein the single crystalline body region is under a strain of at least 0.5%.
28. The transistor of claim 25, wherein the single crystalline body region is under a strain of about 1%.
29. The transistor of claim 25, wherein the single crystalline body region includes an ultra-thin body region.
30. The transistor of claim 25, wherein the single crystalline body region includes a body region having a length equal to 100 nm or less and a depth 30 nm or less.
31. A transistor, comprising:
- a single crystalline layer bonded to a substrate to locally strain the single crystalline layer where the single crystalline layer conforms to a recess in the substrate, the single crystalline layer including a body region, a first source/drain region and a second source/drain region, the body region being positioned where the single crystalline layer is locally strained between the first source/drain region and the second source/drain region;
- a gate insulator formed over the body region; and
- a gate formed over the gate insulator.
32. The transistor of claim 31, wherein the single crystalline layer has a thickness of approximately 300 Å, and the length of the body region is approximately 1000 Å.
33. The transistor of claim 31, wherein the single crystalline layer has a thickness less than approximately 300 Å.
34. The transistor of claim 31, wherein the strain in the single crystalline layer is at least 0.5%.
35. The transistor of claim 31, wherein the strain in the single crystalline layer is approximately 1%.
36. The transistor of claim 31, wherein the strain in the single crystalline layer is uniaxial.
37. A transistor, comprising:
- a single crystalline layer bonded to a substrate with a recess, where the recess is formed by performing a local oxidation of silicon process to form a local area of silicon oxide and then removing the silicon oxide, wherein a local strain is induced where the single crystalline layer conforms to the substrate;
- the single crystalline layer including a body region, a first source/drain region and a second source/drain region, the body region being positioned in the local strain of the single crystalline layer between the first source/drain region and the second source/drain region;
- a gate insulator formed over the body region; and
- a gate formed over the gate insulator.
38. The transistor of claim 37, wherein the recess is approximately 1000 Å long and has a depth of approximately 300 Å.
39. The transistor of claim 37, wherein the strain in the single crystalline layer is at least 0.5%.
40. The transistor of claim 37, wherein the strain in the single crystalline layer is approximately 1%.
41. The transistor of claim 37, wherein the strain in the single crystaline layer is uniaxial.
Type: Application
Filed: Aug 24, 2005
Publication Date: Jan 19, 2006
Patent Grant number: 7202530
Applicant:
Inventor: Leonard Forbes (Corvallis, OR)
Application Number: 11/210,927
International Classification: H01L 27/01 (20060101);