Heat exchanger assembly
A heat exchanger assembly for use in an electronic assembly having a heat source comprises a heat transfer section and heat dissipation fins. The heat transfer section includes a first portion attachable to the heat source and a second portion extending away from the first portion. The heat dissipation fins have a longitudinal dimension and are attached to at least part of the second portion of the heat transfer section along the longitudinal dimension.
Heat generated by components within electronic devices/systems, such as computer systems, etc., must be transferred away from the components in order to ensure proper and efficient operation of these components. As the electronic systems and/or components become faster, smaller, more densely packed and/or more powerful, the amount or density of heat generated by the various components becomes greater. Likewise, the difficulty encountered in dissipating the heat from these components within the confines of the systems becomes greater. Consequently, electronic systems makers continue to pursue heat transfer technology or devices capable of satisfying the increased heat transfer requirements of new components and/or new systems.
BRIEF DESCRIPTION OF THE DRAWINGS
A computer system 100 incorporating various embodiments of the present invention is shown in
The first heat exchanger assembly 108, according to the embodiment shown, generally includes heat transfer sections 118 and a central heat dissipation section 120. (See also
The heat dissipation section 120, according to the embodiment shown, generally includes a number of sets of thermally conductive heat dissipation fins 126 with each set of heat dissipation fins 126 surrounded by an optional sleeve 128. The illustrated embodiment shows four sets of the heat dissipation fins 126, but it is understood that the invention is not so limited. Instead, any appropriate number of sets of heat dissipation fins 126 may be used.
The sleeves 128 duct airflow passed the heat dissipation fins 126. Additionally, one or more optional fans 130 may be positioned adjacent one end of the heat dissipation section 120 to flow the air through the sleeves 128 and passed the heat dissipation fins 126. Furthermore, each set of heat dissipation fins 126 is attached to a part of the second portion 124 of one of the heat transfer sections 118. In this manner, heat generated by the components 110 is transferred through the first portion 122 of the heat transfer sections 118, through the second portion 124 to the heat dissipation fins 126, where the heat is dissipated to the air flowing through the sleeves 128. Without the sleeves 128, much of the air still flows passed the heat dissipation fins 126, but is not specifically channeled to pass with maximum airflow next to the heat dissipation fins 126. With the sleeves 128, the airflow through the housing 102 or the number of fans used in the housing 102 may be reduced, thereby reducing fan noise and electrical power usage.
Additionally, the first heat exchanger assembly 108 may be removed and replaced for ease of manufacturing and/or servicing the first heat exchanger assembly 108 and/or the components 110. Alternatively, each set of heat dissipation fins 126, with or without the sleeves 128, may be individually removed and replaced.
An exemplary way to form a set of the heat dissipation fins 126 uses a folded metal fin structure 132, as shown in
The heat dissipation fins 126 are attached along the longitudinal dimension, rather than around the circumference of the second portion 124. In this manner, the heat dissipation fins 126 are parallel to the axis of the cylindrical second portion 124, rather than perpendicular to the axis. This configuration maximizes the contact between the heat dissipation fins 126 and the second portion 124 of the heat transfer section 118. In this manner, the transfer of heat from the second portion 124 through the heat dissipation fins 126 is also maximized.
Having the heat dissipation fins 126 attached to only part of the second portion 124 enables the heat dissipation fins 126 to be located away from the components 110. Thus, the components 110 can be laid out on the printed circuit board 116 without regard to the size of the heat dissipation fins 126 or other mechanical constraints related thereto. In this manner, components can be placed close together to maximize the use of the surface area of the printed circuit board 116 and/or to reduce electrical line length and propagation delay problems. Additionally, having the heat dissipation fins 126 located away from the components 110 enables the dissipation fins 126 to be placed adjacent an outer wall of the housing 102, where the air heated by the first heat exchanger assembly 108 can be dispelled directly out of the housing 102. Therefore, an almost direct thermal path is provided from the components 110 to the outside environment. Furthermore, having the heat dissipation fins 126 located away from the components 110 also minimizes restriction of airflow to other components within the housing 102 and enables removal of heat from the components 110 without heating the air used to cool the other components.
The second heat exchanger assembly 112, according to the embodiment shown, generally includes an inverted T-shaped heat transfer section 138 and heat dissipation fins 140, as shown in
The heat transfer section 138 generally includes a horizontal base 148 and a vertical section 150, both of which are substantially rectangular in shape. The horizontal base 148 may have optional small vertical fins 152 protruding therefrom.
The heat dissipation fins 140 and the vertical section 150 have a longitudinal dimension in the direction of arrow A, as shown in
According to a particular embodiment, the heat transfer section 138 generally includes a vapor chamber 154, as shown in
According to another particular embodiment, the heat transfer section 138 generally includes one or more embedded heat pipes 160, 162 and 164, as shown in
Other embodiments having evaporative-cycle closed-loop type heat transfer means, in addition to those illustrated in
The embodiments shown in
Furthermore, the horizontal base 148 and the vertical section 150 provide structural strength in x-y-z directions for the second heat exchanger assembly 112. Thus, the second heat exchanger assembly 112 has a robust structure that prevents shock and vibration problems and allows for strong retention methods to hold the second heat exchanger assembly 112 onto the component 114 (
Claims
1. A heat exchanger assembly for use in an electronic assembly having a heat source comprising:
- a heat transfer section including a first portion attachable to the heat source and a second portion extending away from the first portion; and
- a set of heat dissipation fins, each heat dissipation fin having a longitudinal dimension and attached to at least part of the second portion of the heat transfer section along the longitudinal dimension.
2. A heat exchanger assembly as defined in claim 1 wherein:
- the electronic assembly is a computer system.
3. A heat exchanger assembly as defined in claim 1 wherein:
- the heat transfer section comprises an evaporative-type heat transfer device.
4. A heat exchanger assembly as defined in claim 3 wherein:
- the second portion of the heat transfer section has a cylindrical shape; and
- the heat dissipation fins extend radially away from the second portion.
5. A heat exchanger assembly as defined in claim 4 further comprising:
- a cylindrical sleeve surrounding the heat dissipation fins to duct airflow passed the heat dissipation fins within the cylindrical sleeve.
6. A heat exchanger assembly as defined in claim 3 further comprising:
- a fan positioned adjacent the heat dissipation fins to flow air passed the heat dissipation fins.
7. A heat exchanger assembly as defined in claim 3, wherein the electronic assembly has a plurality of the heat sources, further comprising:
- a plurality of the heat transfer sections attached together, each including the first portion attachable to one of the heat sources and the second portion extending away from the first portion; and
- a plurality of the sets of heat dissipation fins, each set of heat dissipation fins attached to at least part of the second portion of one of the heat transfer sections along the longitudinal dimension of the heat dissipation fins.
8. A heat exchanger assembly as defined in claim 3 wherein:
- the first portion of the heat transfer section has a horizontal rectangular shape;
- the second portion of the heat transfer section has a vertical rectangular shape; and
- the heat dissipation fins extend horizontally from the second portion.
9. A heat exchanger assembly as defined in claim 8 wherein:
- the first and second portions of the heat transfer section form an inverted T shape.
10. A heat exchanger assembly as defined in claim 8 further comprising:
- a vapor chamber within the heat transfer section.
11. A heat exchanger assembly as defined in claim 8 further comprising:
- at least one heat pipe embedded within the heat transfer section.
12. A heat exchanger assembly for use in a computer system having a heat source comprising:
- a means for attaching to and receiving heat from the heat source;
- a means for transferring the received heat to a location within the computer system remote from the heat source; and
- a plurality of means for dissipating the transferred heat from the transferring means, the dissipating means each having a longitudinal dimension and being attached to the transferring means along the longitudinal dimension.
13. A computer system comprising:
- a heat source; and
- a heat exchanger assembly comprising:
- a heat transfer section including a first portion attached to the heat source and a second portion extending away from the first portion and the heat source; and
- heat dissipation fins having a longitudinal dimension and attached to at least part of the second portion of the heat transfer section along the longitudinal dimension.
14. A computer system as defined in claim 13 wherein:
- the heat transfer section of the heat exchanger assembly comprises an evaporative-type heat transfer device.
15. A computer system as defined in claim 14 wherein:
- the second portion of the heat transfer section comprises a cylindrical heat pipe; and
- the heat dissipation fins extend radially out from the heat pipe.
16. A computer system as defined in claim 15 wherein:
- the heat exchanger assembly further comprises:
- a plurality of the heat transfer sections attached together.
17. A computer system as defined in claim 15 wherein:
- the heat exchanger assembly further comprises:
- a sleeve surrounding the heat dissipation fins to duct airflow passed the heat dissipation fins.
18. A computer system as defined in claim 15 wherein:
- the heat exchanger assembly further comprises:
- a fan adjacent the heat dissipation fins to flow air passed the heat dissipation fins.
19. A computer system as defined in claim 14 wherein:
- the first portion of the heat transfer section has a horizontal rectangular shape;
- the second portion of the heat transfer section has a vertical rectangular shape; and
- the heat dissipation fins extend horizontally from the second portion.
20. A computer system as defined in claim 19 wherein:
- the second portion of the heat transfer section comprises a vapor chamber.
21. A computer system as defined in claim 19 wherein:
- the heat transfer section comprises at least one embedded heat pipe.
Type: Application
Filed: Feb 24, 2005
Publication Date: Aug 24, 2006
Inventors: David Moore (Tomball, TX), John Franz (Houston, TX)
Application Number: 11/065,326
International Classification: F28D 15/00 (20060101);