Electronic device manufacturing chamber and methods of forming the same
In a first aspect, a first multi-piece chamber is provided. The first multi-piece chamber includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include openings in the top of the pieces and flat mounting surfaces for coupling the pieces together. Numerous other aspects are provided.
The present application is a continuation-in-part of and claims priority from U.S. patent application Ser. No. 11/145,003, filed Jun. 2, 2005 and titled “ELECTRONIC DEVICE MANUFACTURING CHAMBER AND METHODS OF FORMING THE SAME” (Attorney Docket No. 8840), which is hereby incorporated by reference herein in its entirety for all purposes. The present application is also related to U.S. patent application Ser. No. 11/214,475, filed Aug. 29, 2005 and titled “ELECTRONIC DEVICE MANUFACTURING CHAMBER AND METHODS OF FORMING THE SAME” (Attorney Docket No. 8840/P01), which is hereby incorporated by reference herein in its entirety for all purposes.
FIELD OF THE INVENTIONThe present invention relates generally to flat panel display and/or electronic device manufacturing, and more particularly to an electronic device manufacturing chamber and methods of forming the same.
BACKGROUND OF THE INVENTIONAs substrates used in flat panel displays increase in size, the dimensions of electronic device manufacturing chambers (e.g., processing and/or transfer chambers) used to manufacture the larger flat panel displays also must increase in size. However, the difficulty of manufacturing and transporting such chambers also increases with chamber size due to the overall dimensions and/or weight of the chambers. As such, a need exists for improved electronic device manufacturing chambers used for manufacturing large flat panel displays, as well as for improved methods of transporting such chambers.
SUMMARY OF THE INVENTIONIn certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes a central piece having (1) a first open side; (2) a second open side opposite the first open side; (3) a first facet, between the first open side and the second open side, adapted to couple to a chamber and having an opening sized to allow a substrate to pass through the opening; and (4) a second facet opposite the first facet and between the first open side and the second open side. The second facet is adapted to couple to a chamber and has at least two vertically stacked openings each sized to allow a substrate to pass through the opening. The multi-piece chamber also includes (1) a first side piece adapted to couple with the first open side of the central piece and having at least a first facet with an opening sized to allow a substrate to pass through the opening; and (2) a second side piece adapted to couple with the second open side of the central piece and having at least a first facet with an opening sized to allow a substrate to pass through the opening. The opening of the first facet of the first side piece, the opening of the first facet of the second side piece and a first opening of the second facet of the central piece are at substantially the same elevation when the first side piece, the second side piece and the central piece are coupled together. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes (1) a first piece; and (2) at least a second piece coupled to the first piece so as to form the multi-piece chamber. The dimensions of each of the pieces comply with at least one of ground and air transportation regulations, and an overall dimension of the third multi-piece chamber does not comply with at least one of ground and air transportation regulations. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side, a second side and a bottom having a domed portion; (2) a first side piece adapted to couple with the first side of the central piece; and (2) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes a central piece having a first side, a second side and a bottom having a domed portion and a flat portion. The flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness. The multi-piece chamber also includes (1) a first side piece adapted to couple with the first side of the central piece; and (2) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes a central piece having (1) a first side; (2) a second side; (3) a first facet that includes at least one opening sized to allow a substrate to pass through the opening; and (4) a second facet that includes at least three openings each sized to allow a substrate to pass through the opening. The multi-piece chamber also includes (1) a first side piece adapted to couple with the first side of the central piece; and (2) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The first side of the central piece includes at least a first notch adapted to allow a substrate to be rotated within the multi-piece chamber and to be transferred from the multi-piece chamber to a chamber coupled to the first side piece of the multi-piece chamber. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece and having at least one fin structure adapted to reduce movement of a side wall of the first side piece; and (3) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; and (2) a first side piece adapted to couple with the first side of the central piece. The first side piece includes at least one support structure adapted to reduce movement of a side wall of the first side piece. The multi-piece chamber also includes a second side piece adapted to couple with the second side of the central piece. The second side piece includes at least one support structure adapted to reduce movement of a side wall of the second side piece. Further, the central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; (3) a second side piece adapted to couple with the second side of the central piece; and (4) a lid adapted to cover at least the central piece. The lid includes a flat portion and a plurality of support members adapted to reduce movement of the flat portion in a vertical direction. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; (3) a second side piece adapted to couple with the second side of the central piece; and (4) a lid adapted to cover at least the central piece. The lid comprises at least one hatch adapted to provide access to an inner region of the multi-piece chamber without requiring the lid to be removed. The side pieces may each include sealable openings in the top of the side pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a method for manufacturing a multi-piece electronic device manufacturing chamber is provided that includes (1) determining one or more overall dimensions of an electronic device manufacturing chamber; (2) determining how to divide the electronic device manufacturing chamber into a plurality of pieces such that a dimension of each of the plurality of pieces complies with at least one of ground and air transportation regulations; and (3) manufacturing the plurality of pieces. The overall dimensions of the multi-piece chamber do not comply with at least one of ground and air transportation regulations. The plurality of pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.
In certain embodiments, a method of transporting a multi-piece chamber is provided that includes (1) transporting a first piece of a plurality of chamber pieces via one of ground and air transportation; (2) transporting a second piece of the plurality of chamber pieces via one of ground and air transportation; and (3) complying with necessary transportation regulations while transporting the first and second pieces. The overall dimensions of the multi-piece chamber violate at least one of ground and air transportation regulations. The plurality of pieces may each include flat mounting surfaces for coupling the pieces together.
In certain embodiments, a method of transporting a multi-piece chamber having a central piece, a first side piece and a second side piece is provided. The method includes (1) placing at least a portion of a vacuum robot in the central piece of the chamber; (2) transporting the central piece via one of ground and air transportation; (3) coupling the first side piece to the second side piece; (4) transporting the first and second side pieces together via one of ground and air transportation; and (5) complying with necessary transportation regulations while transporting the central, first side and second side pieces. The overall dimensions of the multi-piece chamber violate at least one of ground and air transportation regulations. The plurality of pieces may each include flat mounting surfaces for coupling the pieces together.
In certain embodiments, an apparatus is provided that includes a unit having (1) a central piece of a multi-piece chamber adapted to couple to a first side piece and a second side piece so as to form the multi-piece chamber; (2) a vacuum robot positioned within the central piece; and (3) a base frame for the central piece coupled to the central piece. Dimensions of the unit comply with at least one of ground and air transportation regulations. The pieces may each include flat mounting surfaces for coupling the pieces together. The pieces may each include sealable openings in the top of the pieces.
In certain embodiments, an apparatus is provided that includes a unit having (1) a first side piece of a multi-piece chamber; and (2) a second side piece of the multi-piece chamber. The first and second side pieces are adapted to couple to a central piece so as to form the multi-piece chamber. The unit also includes (1) a first base frame piece coupled to the first side piece; (2) a second base frame piece coupled to the second side piece. Dimensions of the unit comply with at least one of ground and air transportation regulations. The pieces may each include flat mounting surfaces for coupling the pieces together. The pieces may each include sealable openings in the top of the pieces. Numerous other aspects are provided in accordance with these and other aspects of the invention.
Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.
BRIEF DESCRIPTION OF THE FIGURES
With regard to a central transfer chamber, both machining a central transfer chamber “on-site” from a single aluminum block and breaking down a central transfer chamber into a number of elements have been discussed as possible approaches to further scaling transfer chambers. See, for example, “LCD Large-Area Substrate Issues, Substrate Enlargement: Where is the Size Limitation?”, Flat Panel Display 2003 (panel discussion), in which I. D. Kang of Applied Komatsu Technologies (AKT) states:
One equipment alternative would be, if the transfer chamber is further enlarged, to have the machining of a single aluminum block done locally in Asia . . . Another option is to break down the central transfer chamber into a number of elements. Although machining a chamber from a single block of aluminum does guarantee vacuum conditions, it would be possible to make a large transfer chamber composed of elements made from several aluminum blocks and to assemble the structure on site.
A first aspect of the present methods and apparatus relates to an improved method and apparatus for addressing the scalability of large electronic device manufacturing chambers, such as transfer chambers. A second aspect of the present methods and apparatus relates to dynamically supporting an electronic device manufacturing chamber.
Electronic Device Manufacturing Chamber
In accordance with some embodiments of the invention, the transfer chamber 101 may include multiple pieces which are coupled together. More specifically, the transfer chamber 101 may include a first piece 109 (e.g., a first side piece) and a second piece 111 (e.g., a second side piece) coupled to a third piece 113 (e.g., a center piece). The first piece 109 and second piece 111 may each be coupled to the third piece 113 via an O-ring (not separately shown). The first piece 109 and second piece 111 may each be secured to the third piece 113 using securing means, such as screws, bolts, or the like. Although, the multi-piece electronic device manufacturing chamber 101 of
The width of conventional transfer chambers (e.g., one-piece transfer chambers) is generally limited to about 3 m or less by ground and/or air transportation regulations, transport capacity or building design. For example, a transfer chamber larger than about 3 m may be barred by local regulation from transport in most normal capacity 747 freight airplanes and may be too large to fit through entrance doorways in a standard electronic device fabrication facility. In contrast, in one or more embodiments of the present invention, the width W1 of the multi-piece transfer chamber, when assembled (e.g., the overall width), is 4.2 meters. Therefore, the present electronic device manufacturing chamber 101 can accommodate a larger substrate than can conventional, one-piece transfer chambers. The electronic device manufacturing chamber 101 may be of a larger or smaller width than 4.2 meters.
The shape of the exemplary multi-piece electronic device manufacturing chamber 101 when assembled (e.g., the overall shape) is hexagonal. However, the multi-piece electronic device manufacturing chamber 101 may have other overall shapes (e.g., octagonal if eight chambers are to be coupled to the transfer chamber 101, in which case the first and second pieces 109, 111 may be trapezoidally shaped rather then triangularly shaped as shown).
In one or more embodiments, the width WC1 of the third piece 113 is about 2.4 m and the length LC1 of the third piece 113 is about 4.2 meters. Larger or smaller lengths and/or widths may be employed for the third piece 113. In the embodiment shown, the length LC1 of the third piece 113 serves as the overall width W1 of the chamber 101. As shown, the length LS1 of the first piece 109 and the length LS2 of the second piece 111 are equal to the length LC1 of the third piece 113. However, the length LS1 of the first piece 109 and/or the length LS2 of the second piece 111 may be different. In one embodiment the width WS1 of the first piece 109 and/or the width WS2 of the second piece 111 is about 1.2 meters. However, the width WS1 of the first piece 109 and/or the width WS2 of the second piece 111 may be different (e.g., larger or smaller). (In one particular embodiment, the third piece 113 may have a width that is approximately equal to or less than the width of the first piece 109 plus the width of the second piece 111, although other relationships between the widths of the first, second and third pieces 109, 111 and 113 may be employed). Each piece 109-113 of the multi-piece electronic device manufacturing chamber 101 may be made of, for example, aluminum, stainless steel, or any practicable, relatively inert material suitable for use as a transfer chamber.
Although the overall dimensions of the multi-piece electronic device manufacturing chamber 101 do not comply with ground and/or air transportation regulations, the dimensions of each piece 109-113 of the multi-piece electronic device manufacturing chamber 101 do comply with ground and/or air transportation regulations. More specifically, in the example described above, the overall width W1 of the multi-piece electronic device manufacturing chamber 101 is 4.2 m, which does not comply with ground and/or air transportation regulations. However, the width WS1 of the first piece 109 and the width WS2 of the second piece 111 are 1.2 m and the width WC1 of the third piece 113 is 2.4 m, each of which complies with ground and/or air transportation regulations. (In another embodiment, the width WC1 of the third piece 113 may be about 3 to 3.2 m and the widths WS1, WS2 of the first and second pieces 109, 111 may be about 1.5 to 1.6 m.)
Further, each piece 109-113 of the multi-piece electronic device manufacturing chamber 101 may be fabricated in a conventional machining center or shop. Therefore, a manufacturer of the multi-piece electronic device manufacturing chamber 101 may select one or more of a plurality of conventional machining centers or shops to fabricate the pieces 109-113 of the multi-piece electronic device manufacturing chamber 101. Competition among the plurality of conventional machining centers or shops enables the manufacturer of the multi-piece electronic device manufacturing chamber 101 to obtain a better price. In contrast, the number of machining centers or shops that may fabricate a one-piece electronic device manufacturing chamber with dimensions that can accommodate larger substrates, similar to the multi-piece electronic device manufacturing chamber 101, is limited. This limited number of machining centers or shops results in reduced competition. Due to reduced competition, the manufacturer may pay more for fabrication of such a one-piece chamber than for the multi-piece semiconductor manufacturing chamber 101. Further, because such a one-piece chamber does not comply with ground and/or air transportation regulations, the manufacturer of such a one-piece chamber may need to obtain special accommodations, such as a police escort, an “Oversized Load” sign, or the like, while transporting the device. The multi-piece electronic device manufacturing chamber 101 does not require such accommodations.
Additional features of the first multi-piece electronic device manufacturing chamber 101 will now be described with reference to
With reference to
Each facet 201a-f provides a flat sidewall to which a processing chamber, load lock chamber or other chamber may be sealingly coupled (e.g., via an o-ring or other sealing member) as shown, for example, in
Because of the cylindrical walls 203, 205 of the first and second pieces 109, 111, the interior region of the first chamber 101 is substantially cylindrical (see, for example,
To accommodate rotations of a vacuum robot through the third (central) piece 113 of the chamber 101, the third piece 113 includes notched regions 211a-d (see
While facets 201b, 201c, 201e, 201f are shown as having only one opening, each facet may include additional openings (e.g., 2, 3, 4 or more openings). Likewise, the facet 201a of the third (central) piece 113 is shown having a single opening 221 (
Referring again to
As further shown in
With reference to
Because of the weight of the lid 235, it may be desirable to provide one or more access hatches or other openings within the lid 235 so that the entire lid 235 need not be removed from the first chamber 101 to gain access to the interior of the first chamber 101 (e.g., for maintenance or other servicing).
The domed top lid 303 is coupled to the second piece 305, which is coupled to the third piece 307, which is coupled to the fourth piece 309 of the second exemplary multi-piece electronic device manufacturing chamber 301. The second through fourth pieces 305-309 of the second exemplary multi-piece electronic device manufacturing chamber 301 form a main body of the second exemplary multi-piece electronic device manufacturing chamber 301. The width W2 of each of the second through fourth pieces 305-309 may be about 4.2 meters, for example. Each of the widths of the second 305, third 307 and/or fourth piece 309 may be different, and although each of the second through fourth 305-309 pieces is shown as hexagonal-shaped, other shapes may be employed. In one aspect, each of the second through fourth pieces 305-309 is aluminum, although other materials may be employed. Additionally, a single piece may be employed for the main body.
The fifth piece 311 is a domed bottom lid for the second exemplary multi-piece electronic device manufacturing chamber 301. The fifth piece 311 is coupled to the bottom of the fourth piece 309. Similar to the-domed top lid, the diameter D2 of the domed bottom lid may be about 4.2 meters, for example. Other sizes may be used.
To manufacture the multi-piece electronic device manufacturing chamber 101, 301, a user, such as a manufacturer, may employ the inventive method described below. According to the inventive method, one or more overall dimensions of the electronic device manufacturing chamber is determined. More specifically, a manufacturer may need to manufacture a substrate of a required size. Based on the required size, the manufacturer may determine (e.g., design) one or more overall dimensions of an electronic device manufacturing chamber capable of manufacturing such a substrate. If the required substrate size is large enough, the overall dimensions of the chamber will not comply with at least one of ground and air transportation regulations.
Thereafter, the manufacturer, for example, may determine how to divide the electronic device manufacturing chamber into a plurality of pieces such that the dimensions of each of the plurality of pieces complies with at least one of ground and air transportation regulations and at the same time, the structural integrity of the chamber when assembled will be sufficient to perform manufacturing operations. For example, the manufacturer may divide the designed multi-piece electronic device manufacturing chamber into pieces using vertical sectioning, such as with the electronic device manufacturing chamber 101 shown in
Thereafter, the plurality of pieces are manufactured. For example, the manufacturer may employ a machining center or shop to fabricate the plurality of pieces. In this manner, the multi-piece electronic device manufacturing chamber 101, 301 is manufactured.
Once the electronic device manufacturing chamber 101, 301 is manufactured, the electronic device manufacturing chamber 101, 301 may be transported, for example, to a customer site. To transport a multi-piece electronic device manufacturing chamber 101, 301, the manufacturer may employ a method of transporting such a chamber in accordance with one or more embodiments of the present invention. For example, a first piece of a plurality of electronic device manufacturing chamber pieces may be transported via one of ground and air transportation. The first piece may be placed in a container that complies with transportation regulations such that the first piece forms an angle with a side (such as a bottom side) of the container. Thus, the first piece may have an actual height or width dimension larger than permitted if it was not placed in the container at such an angle, yet may still fit within a container that complies with transportation regulations. The ability to ship larger pieces allows the inventive multi-piece chamber to be formed from fewer pieces. Therefore, placing the pieces at an angle within the shipping container is preferred, though not required. In some embodiments it may be preferred to manufacture a multi-piece chamber such that a main or central piece is as large as possible and still capable of being fit into a standard size shipping container while the remaining pieces are smaller or as small as possible so that assembly is easier.
Similarly, the second piece 305 of the electronic device manufacturing chamber 301 is transported via one of ground and air transportation. The second piece 305 is placed in a container that complies with transportation regulations such that the second piece 305 forms an angle with the bottom of the container. For example,
The overall dimensions of the assembled multi-piece electronic device manufacturing chamber 301 violate at least one of ground and air transportation regulations. For example, the overall width of the electronic device manufacturing chamber 301 is not less than 3 meters, and therefore, does not comply with ground and/or air transportation regulations. Therefore, the first and/or the second pieces are transported separately, for example, in containers 501.
In this manner, a multi-piece electronic device manufacturing chamber 101, 301 may be manufactured at a machining center or shop without the disadvantages (e.g., cost) of manufacturing a similarly-dimensioned one-piece electronic device manufacturing chamber. Further, the multi-piece electronic device manufacturing chamber 101, 301 may be transported to a customer site without the disadvantages (e.g., cost, time, etc.) of transporting a similarly-dimensioned one-piece electronic device manufacturing chamber.
Supporting an Electronic Device Manufacturing Chamber
Note that in a conventional manufacturing chamber support, one or more portions of a base are attached (e.g., fixedly) to the bottom of an electronic device manufacturing chamber. In contrast to a conventional manufacturing chamber support, the electronic device manufacturing chamber support 701 in accordance with some embodiments of the present invention, additionally or alternatively, may include one or more sliding mechanisms 705 for providing dynamic support at the bottom 707 of an electronic device manufacturing chamber 709. The one or more sliding mechanisms 705 may include a slide-able bearing, such as a polytetrafluoroethylene (PTFE)-coated bearing, and an elastomer mount including a load bearing rubber or the like. Other suitable materials may be employed for the one or more sliding mechanisms 705.
Alternatively, the one or more sliding mechanisms 705 may include rollers in place of, or in addition to, sliding bearings. In some embodiments, the electronic device manufacturing chamber 709 may be suspended by vertical, diagonal, and/or horizontal flexible lines such that any expansion may be accommodated by the flexible lines which may have an expansion capacity in excess of the maximum possible expansion of the electronic device manufacturing chamber 709.
The one or more sliding mechanisms 705 are adapted to accommodate thermal or other expansion of the electronic device manufacturing chamber 709. For example, during electronic device manufacturing, heat from adjacent process chambers may cause the temperature of the electronic device manufacturing chamber 101, 301 to exceed 200 or 300 degrees Celsius, which may cause the electronic device manufacturing chamber 709 to expand. The sliding mechanism 705 prevents the electronic device manufacturing chamber 709 from shifting out of position on the electronic device manufacturing chamber support 701 (e.g., on the base frame 703). A sliding mechanism 705 is effective for accommodating any possible amount of electronic device manufacturing chamber expansion, thereby preventing the electronic device manufacturing chamber 709 from shifting off of the electronic device manufacturing chamber support 701 or even just shifting out of position.
In the example shown in
Note that if thermal expansion causes one or more sliding mechanisms 705 to reach the edge of their individual range, in some embodiments, the other sliding mechanisms 705 will begin to accommodate any further thermal expansion directed at the original sliding mechanisms 705. In other words, once the force applied to move a sliding mechanism 705 to the limit of its individual range encounters a stop frame (described below), the expansion force will be redirected in the opposite direction to be accommodated by other sliding mechanisms 705.
The slide bearing 905 may include a shaft or threaded rod 903 attached to a foot or slip disk 901. The slip disk 901 may sit in a recess 904 that is coated with, for example, a low friction fluoropolymer resin such as Teflon™ made by the Dupont Corporation. The recess or “stop frame” 904 may be square or round or any suitable shape to accommodate a desired range of horizontal motion of the slip disk 901. Likewise, the slip disk 901 may be square or round or any suitable shape to accommodate a desired range of horizontal motion within the recess 904. The slide bearing 905 may be made of steel or any suitable material. In some embodiments, the lower and side surfaces of the slip disk 901 may also be coated with a low-friction fluoropolymer resin such as Teflon® to enable the slide bearing 905 to move freely within the recess 904. Further, the slip disk 901 may include rollers or ball bearings instead of, or in addition to, a low-friction coating. In some embodiments, any suitable moveable bearing may be used in place of the slide bearing 905.
The shaft or threaded rod 903 attached to the slip disk 901 may also be attached to the bottom 707 (
An elastomer mount 907 may include a flexible material, such as load bearing vulcanized rubber, sandwiched between, and attached to, mounting plates 908a-b. Other suitable flexible materials including metal springs may be used. The mounting plates may be made of steel or any suitable material and may include holes to allow the mounting plates to be attached to the bottom 707 of the electronic device manufacturing chamber 709 and a bracket 909 portion of the base frame 803, respectively.
In operation, the slide bearings 905 may carry the weight of the electronic device manufacturing chamber 709 and also allow the electronic device manufacturing chamber 709 to move within an acceptable range as it expands. At the same time, the elastomer mount 907 may act to effectively bias the electronic device manufacturing chamber 709 toward an ideal position on the electronic device manufacturing chamber support 801. As indicated above, the acceptable range of motion of the electronic device manufacturing chamber 709 may be defined by the sizes of the slip disks 901 and the recesses 904 in which they sit. The position and geometry of the recesses may also effect the range of motion. In some embodiments, the elastomer mount 907 may additionally or alternatively limit the range of motion of the electronic device manufacturing chamber 709.
To further illustrate the invention, example dimensions are provided. Note however, that the following dimensions are merely illustrative of particular embodiments and are merely intended to convey an example of appropriate relative sizes. In some embodiments, the diameter D3 of the slip disk 901 is approximately 100 mm, the recess 904 is approximately 125 mm across, the height h1 of the slip disk 901 is approximately 25 mm, the shaft or threaded rod 903 diameter D4 is approximately 25 mm and the threaded rod 903 height h2 is approximately 137 mm. In some embodiments an M25 bolt (ISO 965-1, Sect. 5, metric fastener size designation) may be used as the threaded rod 903. The sliding mechanism 705 may be shaped and/or dimensioned differently than pictured. In some embodiments, the elastomer mount 907 may deflect or stretch up to approximately 15 mm. The elastomer mount 907 may be shaped and/or dimensioned differently than pictured.
During electronic device manufacturing, the electronic device manufacturing chamber 101 may grow due to thermal expansion or other forces. More specifically, a portion of the electronic device manufacturing chamber 101 above the support 801 may expand both vertically and horizontally. The growth or expansion of the electronic device manufacturing chamber 101 compresses or stretches the elastomer mounts 907 and moves the slide bearings 705. In this manner, each sliding mechanism 705 accommodates growth or deflection of any expanding portion of the electronic device manufacturing chamber 101. The remaining sliding mechanisms 705 are employed in a similar manner to accommodate the electronic device manufacturing chamber expansion, thereby preventing the electronic device manufacturing chamber 101 from shifting out of position on the electronic device manufacturing chamber support 801. In this manner, the electronic device manufacturing chamber 101 remains substantially balanced and level during electronic device manufacturing. In contrast, thermal expansion of a manufacturing chamber supported by a conventional support, which is only fixedly coupled to the electronic device manufacturing chamber, may cause the electronic device manufacturing chamber to shift out of position with, fall off of, and/or damage the support.
To support an electronic device manufacturing chamber a method for supporting the electronic device manufacturing chamber in accordance with some embodiments of the present invention may be employed. More specifically, the electronic device manufacturing chamber is coupled to one or more sliding mechanisms 705 of an electronic device manufacturing chamber support 801. The one or more sliding mechanisms 705 are employed to accommodate electronic device manufacturing chamber expansion, thereby preventing the electronic device manufacturing chamber from shifting out of position or falling off the electronic device manufacturing chamber support 801. For example, the elastomer mounts 907 of the sliding mechanisms 705 may be stretched or compressed to accommodate electronic device manufacturing chamber expansion.
The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. For instance, although some of the embodiments described above relate to a transfer chamber, the present methods and apparatus may be employed for other types of electronic device manufacturing chambers, such as processing chambers for PVD, CVD or the like. Further, in one or more embodiments, a robot may be inserted (e.g., assembled) into a piece of the multi-piece electronic device manufacturing chamber 101, 301 before the piece is transported to the customer site. For example, a bottom portion of a vacuum robot may be installed in the third (central) piece 809 (
In one or more embodiments of the invention, the assembly 1101 is dimensioned to comply with at least one of ground and air transportation regulations. For example, the assembly 1101 may have a height of about 3 m or less.
In another embodiment of the invention, the first and second side chamber pieces 109, 111 and the first and second base frame pieces 807, 805 may be assembled and/or transported together as a unit. For example,
In one or more embodiments of the invention, the assembly 1201 is dimensioned to comply with at least one of ground and air transportation regulations. For example, the assembly 1201 may have a height of about 3 m or less.
The pieces of the chambers 101, 103 and/or the base frame 803 may be transported using any suitable method. In at least one embodiment, the side pieces 109, 111 of the chamber 101 may be transported using a first mode of transportation (e.g., land, boat, air, etc.), and the central piece 113 of the chamber 101 may be transported using a second mode of transportation (e.g., land, boat, air, etc.). As another example, the first and/or second side piece 109, 111 may be transported via a first truck, and the central piece 113 may be transported using a second truck.
In at least one embodiment of the invention, the vacuum robot may employ a floating seal to isolate the robot from movement of the chamber bottom as shown in
As shown in
While the present invention has been described primarily with regard to flat panel displays, it will be understood that the inventive multi-piece chamber may be used to transfer, process and/or manufacture any type of substrate, and may be used to transfer, process and/or manufacture any type of device (e.g., flat panel displays, solar panels and/or cells, etc.).
It will be understood that transportation regulations may vary from country to country (e.g., U.S., Japan, Korea, Taiwan, China, etc.). For example, size limitations or other relevant transportation parameters may vary from country to country. However, the present invention may be adapted/modified to accommodate the particular transportation regulations of any country (and still fall within the spirit and scope of the invention).
In at least one embodiment of the invention, a method of processing a substrate is provided. The method includes the steps of (1) transferring the substrate from a load lock chamber to a multi-piece transfer chamber that includes a central piece, a first side piece, and a second side piece; (2) transferring the substrate from the multi-piece transfer chamber into a processing chamber; (3) depositing at least one film over the substrate; and (4) transferring the substrate to the load lock chamber. The step of transferring the substrate from the multi-piece transfer chamber into a processing chamber may include rotating the substrate through a notch in a sidewall of the central piece of the transfer chamber (as previously described, for example, with reference to
The step of transferring the substrate from the load lock chamber to the multi-piece transfer chamber may include elevating or lowering the substrate. For example, if the load lock chamber is adapted to support at least two vertically stacked substrates, the central piece may include a facet having two or more vertically stacked openings (
The step of depositing at least one film over the substrate may include depositing at least one film over the substrate by using chemical vapor deposition, physical vapor deposition or any other suitable technique.
As mentioned above with respect to
To aid in the sealing of the openings 1205, a flat surface may be machined into the top portion of the side pieces 109, 111 around the openings 1205. For example, for a 20 mm thick chamber top portion such as on an a Model 40Ki/A transfer chamber manufactured by Applied Materials, an approximately 2 mm deep flat surface may be provided in the top portion of the side pieces 109, 111 for an o-ring to create a sealing flange around the periphery of the openings 1205 which may be approximately 12 inches by 25 inches at the widest/longest points. The flange thickness T may be approximately 1.2 inches with an approximately 0.015 inch o-ring groove clearance for lid rubbing. M6×9 mm fasteners may be used to securely attach the lids 1201, 1203 to the side pieces 109, 111. Note that these sizes are provided merely as examples; other dimensions and component sizes are possible.
In some embodiments, the openings 1205 may be as large as possible without compromising the structural integrity of the chamber, particularly when the chamber is under vacuum pressure. More than two openings may be provided. The openings 1205 may be located generally in the center of each half of the top portion of the side pieces 109, 111 as shown in the drawings. Other locations are possible. The openings 1205 may be generally shaped to match the general shape of the part of the top portion of the side pieces 109, 111 within which the openings 1205 are located. However, other shapes are possible. The openings 1205 may be suitable to provide access and/or a view into the chamber without having to disassemble the chamber. The openings 1205 and corresponding lids 1201, 1203 may have any shape that is practicable. The openings 1205 may be useful for cleaning the chamber, retrieving an object that may have inadvertently been deposited in the chamber, and/or for monitoring or viewing activity within the chamber.
In the example shown, the lids 1201, 1203 are approximately 13 inches by 26 inches at the widest/longest points and approximately 1.2 inches thick. However other sizes are possible. The lids may be made from Aluminum or any practicable material. In some embodiments, the lids 1201, 1203 may include a sealed window or may be made from a transparent material. In some embodiments, the lids may be curved or have a domed shape (as opposed to the flat lids 1201, 1203 depicted) to improve the structural strength of the lids.
As shown in
Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.
Claims
1. A multi-piece chamber comprising:
- a central piece having a first side and a second side;
- a first side piece adapted to couple with the first side of the central piece; and
- a second side piece adapted to couple with the second side of the central piece;
- wherein the central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together, and
- wherein the first side piece includes a top portion having at least one opening.
2. The multi-piece chamber of claim 1 wherein central piece, the first side piece and the second side piece form a transfer chamber when coupled together.
3. The multi-piece chamber of claim 1 wherein the central piece has a substantially rectangular shape.
4. The multi-piece chamber of claim 1 wherein the central piece has a length of about 3 meters or greater.
5. The multi-piece chamber of claim 4 wherein the central piece has a width of about 2.4 meters or greater.
6. The multi-piece chamber of claim 1 wherein the central piece includes a bottom having a domed portion.
7. The multi-piece chamber of claim 6 wherein the domed portion is adapted to accommodate a vacuum robot.
8. The multi-piece chamber of claim 6 wherein the domed portion includes at least one support fin adapted to reduce movement of the domed portion in a vertical direction.
9. The multi-piece chamber of claim 8 wherein the domed portion includes a plurality of support fins, each support fin adapted to reduce movement of the domed portion in a vertical direction.
10. The multi-piece chamber of claim 6 wherein the bottom of the central piece includes a flat portion.
11. The multi-piece chamber of claim 10 wherein the flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness.
12. The multi-piece chamber of claim 11 wherein the first thickness is about 0.75 to 1.0 inches or less and the second thickness is about 0.375 inches or less.
13. The multi-piece chamber of claim 11 wherein both the flat portion and domed portion are formed from stainless steel.
14. The multi-piece chamber of claim 1 wherein the central piece has a first facet and a second facet, and wherein:
- the first facet includes at least one opening sized to allow a substrate to pass through the opening; and
- the second facet includes at least two openings each sized to allow a substrate to pass through the opening.
15. The multi-piece chamber of claim 14 wherein the second facet includes at least three openings each sized to allow a substrate to pass through the opening.
16. The multi-piece chamber of claim 14 wherein the first facet is adapted to sealingly couple to a processing chamber.
17. The multi-piece chamber of claim 16 wherein the second facet is adapted to sealingly couple to a load lock chamber.
18. The multi-piece chamber of claim 17 wherein the second facet is adapted to sealingly to couple to a load lock chamber that stores at least three substrates stacked vertically, and wherein the second facet has:
- a first opening sized to allow a substrate to pass between the central piece and the load lock chamber at a first elevation;
- a second opening sized to allow a substrate to pass between the central piece and the load lock chamber at a second elevation; and
- a third opening sized to allow a substrate to pass between the central piece and the load lock chamber at a third elevation.
19. The multi-piece chamber of claim 18 wherein:
- the first side piece includes at least a first facet having an opening sized to allow a substrate to pass through the opening;
- the second side piece includes at least a first facet having an opening sized to allow a substrate to pass through the opening; and
- the opening of the first facet of the first side piece, the opening of the first facet of the second side piece and the first opening of the second facet of the central piece are at substantially the same elevation when the first side piece, the second side piece and the central piece are coupled together.
20. The multi-piece chamber of claim 1 wherein the first side of the central piece includes at least a first notch adapted to allow a substrate to be rotated within the multi-piece chamber and to be transferred from the multi-piece chamber to a chamber coupled to the first side piece of the multi-piece chamber.
21. The multi-piece chamber of claim 20 wherein the second side of the central piece includes at least a first notch adapted to allow a substrate to be rotated within the multi-piece chamber and to be transferred from the multi-piece chamber to a chamber coupled to the second side piece of the multi-piece chamber.
22. The multi-piece chamber of claim 1 wherein the first side piece and the second side piece have a first width, and the central piece has a second width that is approximately twice the first width or greater.
23. The multi-piece chamber of claim 1 wherein the first side piece comprises a substantially cylindrical side wall having a plurality of flat facets formed in the side wall.
24. The multi-piece chamber of claim 23 wherein the first side piece includes two facets, each having an opening sized to allow a substrate to pass through the opening.
25. The multi-piece chamber of claim 23 wherein the first side piece includes at least one fin structure adapted to reduce movement of the side wall of the first side piece.
26. The multi-piece chamber of claim 25 wherein the first side piece includes a plurality of fin structures adapted to reduce movement of the side wall of the first side piece.
27. The multi-piece chamber of claim 1 wherein the second side piece comprises a substantially cylindrical side wall having a plurality of flat facets formed in the side wall.
28. The multi-piece chamber of claim 1 further comprising a lid adapted to cover at least the central piece.
29. The multi-piece chamber of claim 28 wherein the lid comprises a flat portion and a plurality of support beams adapted to reduce movement of the flat portion in a vertical direction.
30. The multi-piece chamber of claim 29 wherein the flat portion has a thickness of about 0.75 to 1.0 inches or less.
31. The multi-piece chamber of claim 29 wherein the lid comprises at least one hatch adapted to provide access to an inner region of the multi-piece chamber without requiring the lid to be removed.
32. The multi-piece chamber of claim 31 wherein the lid comprises at least two hatches, each adapted to provide access to an inner region of the multi-piece chamber without requiring the lid to be removed.
33. A multi-piece chamber comprising:
- a central piece having: a first open side; a second open side opposite the first open side; a first facet between the first open side and the second open side, the first facet adapted to couple to a chamber and having an opening sized to allow a substrate to pass through the opening; and a second facet opposite the first facet and between the first open side and the second open side, the second facet adapted to couple to a chamber and having at least two vertically stacked openings each sized to allow a substrate to pass through the opening;
- a first side piece adapted to couple with the first open side of the central piece, the first side piece having at least a first facet with an opening sized to allow a substrate to pass through the opening; and
- a second side piece adapted to couple with the second open side of the central piece, the second side piece having at least a first facet with an opening sized to allow a substrate to pass through the opening;
- wherein the opening of the first facet of the first side piece, the opening of the first facet of the second side piece and a first opening of the second facet of the central piece are at substantially the same elevation when the first side piece, the second side piece and the central piece are coupled together, and
- wherein the first side piece includes a top portion having at least one opening.
34. The multi-piece chamber of claim 33 wherein the opening of the first facet of the central piece is at substantially the same elevation as the first opening of the second facet of the central piece.
35. The multi-piece chamber of claim 33 wherein the central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together.
36. The multi-piece chamber of claim 33 wherein the central piece includes a bottom having a domed portion.
37. The multi-piece chamber of claim 36 wherein the domed portion is adapted to couple to a vacuum robot.
38. The multi-piece chamber of claim 36 wherein the domed portion includes at least one support fin adapted to reduce movement of the domed portion in a vertical direction.
39. The multi-piece chamber of claim 36 wherein the bottom of the central piece includes a flat portion.
40. The multi-piece chamber of claim 39 wherein the flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness.
41. A multi-piece chamber comprising:
- a central piece having a first side, a second side and a bottom having a domed portion;
- a first side piece adapted to couple with the first side of the central piece and including an opening in a top portion of the first side piece; and
- a second side piece adapted to couple with the second side of the central piece.
42. The multi-piece chamber of claim 41 wherein the domed portion is adapted to accommodate a vacuum robot.
43. The multi-piece chamber of claim 41 wherein the domed portion includes at least one support fin adapted to reduce movement of the domed portion in a vertical direction.
44. The multi-piece chamber of claim 43 wherein the domed portion includes a plurality of support fins, each support fin adapted to reduce movement of the domed portion in a vertical direction.
45. The multi-piece chamber of claim 41 wherein the bottom of the central piece includes a flat portion.
46. The multi-piece chamber of claim 45 wherein the flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness.
47. The multi-piece chamber of claim 46 wherein the first thickness is about 0.75 to 1.0 inches or less and the second thickness is about 0.375 inches or less.
48. The multi-piece chamber of claim 41 wherein the first and second side pieces each include mounting surfaces adapted to facilitate coupling the first and second side pieces to the central piece, and
- wherein the mounting surfaces each have an area that is 35% or more of a total cross-sectional area of each of the first and second side pieces where the side pieces couple to the central piece.
49. The multi-piece chamber of claim 41 wherein the first side piece includes a first face,
- wherein the first face includes a first opening and a first mounting surface,
- wherein the first face has a first total surface area that includes an area of the first opening and an area of the first mounting surface,
- wherein the first mounting surface is adapted to facilitate coupling the first side piece to the central piece, and
- wherein the area of the first mounting surface is 35% or more of the first total surface area.
50. The multi-piece chamber of claim 49 wherein the second side piece includes a second face,
- wherein the second face includes a second opening and a second mounting surface,
- wherein the second face has a second total surface area that includes an area of the second opening and an area of the second mounting surface,
- wherein the second mounting surface is adapted to facilitate coupling the second side piece to the central piece,
- wherein the area of the second mounting surface is 35% or more of the second total surface area.
51. The multi-piece chamber of claim 41 wherein the first and second side pieces each include two openings in a top portion of each of the first and second side pieces.
52. The multi-piece chamber of claim 51 further including lids adapted to seal the openings in the first and second side pieces.
53. The multi-piece chamber of claim 41 wherein the first and second side pieces each include mounting surfaces adapted to facilitate coupling the first and second side pieces to the central piece, and
- wherein the mounting surfaces each have an area that is 40% or more of a total cross-sectional area of each of the first and second side pieces where the side pieces couple to the central piece.
54. The multi-piece chamber of claim 41 wherein the first side piece includes a first face,
- wherein the first face includes a first opening and a first mounting surface,
- wherein the first face has a first total surface area that includes an area of the first opening and an area of the first mounting surface,
- wherein the first mounting surface is adapted to facilitate coupling the first side piece to the central piece, and
- wherein the area of the first mounting surface is 40% or more of the first total surface area.
55. The multi-piece chamber of claim 54 wherein the second side piece includes a second face,
- wherein the second face includes a second opening and a second mounting surface,
- wherein the second face has a second total surface area that includes an area of the second opening and an area of the second mounting surface,
- wherein the second mounting surface is adapted to facilitate coupling the second side piece to the central piece,
- wherein the area of the second mounting surface is 40% or more of the second total surface area.
Type: Application
Filed: Mar 1, 2006
Publication Date: Sep 14, 2006
Inventors: Shinichi Kurita , Wendell Blonigan , Makoto Inagawa
Application Number: 11/366,831
International Classification: E04H 6/00 (20060101);