Protective cover

Abstract

A protective cover is used for protecting thermal conducting mediums on two heat sinks from being damaged simultaneously. The protective cover includes a plate body and two holding portions. The plate body has two opposite plate surfaces respectively covering the sides of the two heat sinks coated with a thermal conducting medium. The two holding portions are formed on the periphery of the two plate surfaces and surround the two plate surfaces to form an accommodation space respectively. The holding portions are engaged with the two heat sinks and cover the thermal conducting mediums in the accommodation space respectively.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 095220595 filed in Taiwan, R.O.C. on Nov. 22, 2006, the entire contents of which are hereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to a protective cover, and more particularly to a protective cover capable of simultaneously accommodating two heat sinks and the thermal conducting mediums thereon.

2. Related Art

With the rapid development of computer science and technology, the operating speed of electronic components is gradually increased, and the integrated circuits (IC) become highly integrated, so that a large amount of heat is generated during the operation of the electronic components. If the heat is not dissipated in time, the operation performance of computer devices will be seriously influenced.

In order to reduce the working temperature of the electronic components and maintain the operation performance, the heat sink must be put in close contact with the electronic components, so as to reduce the thermal contact resistance, and a layer of thermal conducting medium may be coated on the bottoms of the heat sink, thereby filling the clearance between the heat sink and the electronic component, and meanwhile enhancing the thermal conductivity.

Heat sink manufacturers often apply a paste, colloid, or a solid sheet-like thermal conducting medium on the bottom of the heat sink after the fabrication of the heat sink is completed. Therefore, when the heat sink is disposed on the heat source, the coating of the thermal conducting medium is not required, thus facilitating the user's convenience in use. However, during the transportation of the heat sinks, the thermal conducting medium is easily contaminated by the ambient environment or distorted by scratching or extrusion, resulting in the increase of the coating area of the thermal conducting medium and even the peeling off of the thermal conducting medium.

In order to prevent the thermal conducting medium coating from being damaged to lose the thermal conductivity during the transportation of the heat sinks, a protective cover must be covered on the bottom of a heat sink coated with the thermal conducting medium, thereby fully protecting the thermal conducting medium.

However, each heat sink must be covered with a protective cover, so as to entirely protect the thermal conducting medium coated on the bottom of the heat sink. Thus, when the manufacturers fabricate and deliver a large quantity of the heat sinks, more protective covers are required, which is inevitably a heavy burden of cost to the heat sink manufacturers.

Furthermore, when the heat sinks are delivered to the destination, and go through the packaging step, a large number of protective covers must be detached from the heat sinks. If the plastic protective covers are regarded as wastes and discarded, the ecological environment will be negatively impacted after a long time period. If the protective covers are recycled, the recycling cost is also an additional cost to the manufacturers.

Therefore, it becomes an important subject in urgent need of being solved how to reduce the amount of the plastic protective covers to reduce the manufacturing cost, and avoid destroying the natural ecological environment.

SUMMARY OF THE INVENTION

In view of the aforementioned problems, the present invention provides a protective cover, for solving the problems in the prior art that the heat sink coated with a thermal conducting medium will easily fall off under the external force in transportation, and the conventional protective cover can merely cover a single heat sink.

The present invention provides a protective cover used to protect thermal conducting mediums of two heat sinks simultaneously. The protective cover includes a plate body and two holding portions. The plate body has two opposite plate surfaces respectively covering the sides of the two heat sinks coated with a thermal conducting medium. The two holding portions are formed on the peripheries of the two plate surfaces and form an accommodation space respectively. The holding portions are engaged with the outer edges of the two heat sinks, so as to fix the two heat sinks on the plate body and cover the thermal conducting mediums in the accommodation space formed by the two plate surfaces.

The advantage of the present invention lies in that, the two heat sinks coated with the thermal conducting mediums are respectively fixed on the plate body, so that the thermal conducting mediums may be completely encapsulated in the accommodation space of the two opposite plate surfaces, thereby ensuring the integrity and the property of the thermal conductivity of the thermal conducting mediums. Meanwhile, as two heat sinks can be mounted on a single protective cover simultaneously, thus greatly saving the packaging materials used in transportation and reducing the manufacturing cost.

Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be further explained by the detailed description given herein below for illustration only, and thus are not limitative of the present invention, and wherein:

FIG. 1A is a top view of the first embodiment of the present invention;

FIG. 1B is a bottom view of the first embodiment of the present invention;

FIG. 1C is a top view of the first embodiment with heat sinks mounted thereon of the present invention;

FIG. 1D is a bottom view of the first embodiment with heat sinks mounted thereon of the present invention;

FIG. 1E is a side view of the first embodiment of the present invention;

FIG. 1F is a partial enlarged view of the first embodiment of the present invention;

FIG. 2A is a top view of the second embodiment of the present invention;

FIG. 2B is a bottom view of the second embodiment of the present invention;

FIG. 2C is a top view of the second embodiment with heat sinks mounted thereon of the present invention;

FIG. 2D is a bottom view of the second embodiment with heat sinks mounted thereon of the present invention;

FIG. 2E is a side view of the second embodiment of the present invention;

FIG. 2F is a partial enlarged view of the second embodiment of the present invention;

FIG. 3A is a top view of the third embodiment of the present invention;

FIG. 3B is a bottom view of the third embodiment of the present invention;

FIG. 3C is a top view of the third embodiment with heat sinks mounted thereon of the present invention;

FIG. 3D is a bottom view of the third embodiment with heat sinks mounted thereon of the present invention;

FIG. 3E is a side view of the third embodiment of the present invention;

FIG. 3F is a partial enlarged view of the third embodiment of the present invention; and

FIG. 3G is a partial enlarged view of the third embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIGS. 1A to 1F are schematic views of the first embodiment of the present invention. As shown in the figures, the protective cover 100 provided by the present invention may simultaneously protect the thermal conducting mediums 210 coated on the bottoms of two heat sinks 200, so as to protect the thermal conducting mediums 210 from being contaminated or peeling off. The protective cover 100 of the present invention includes a plate body 110 and two holding portions 120. The plate body 110 has two opposite plate surfaces 111 respectively covering the bottoms of the two heat sinks 200 coated with the thermal conducting medium 210. One side of the plate body 110 is designed to be a frame structure with an accommodation space, so a side wall extends vertically to the periphery of one plate surface 111, thereby forming a holding portion 120. A side wall is protruded from the edge of the other side of the plate body 110, so as to form another holding portion 120 at the side of the other plate surface 111. The side wall surrounds to form an accommodation space. In this manner, the two holding portions 120 may be respectively engaged with the outer edges of the two heat sinks 200, so as to fix the heat sinks 200 on the plate body 110, and cover the thermal conducting mediums 210 on the bottom in the accommodation space of the plate surfaces 111.

Please refer to FIGS. 1A to 1F, a protection cavity 112 is recessed on the two plate surfaces 111 respectively at the positions where the thermal conducting mediums 210 are coated. When the plate body 110 covers the bottoms of the heat sinks 200, the thermal conducting mediums 210 may be just accommodated in the protection cavities 112, and is separated from the plate surface 111 by a distance without contacting the plate surface 111. Furthermore, according to the specification and configuration of the heat sinks 200 mounted on the protective cover 100, an L-shaped recess portion 114 and a plurality of recess holes 115 corresponding to the heat sink 200 are designed on the plate surfaces 111 of the plate body 110, so that the protruding portions of one heat sink 200 may be just embedded in the recess portion 114 and the recess holes 115. A protruding portion 116 and protruding posts 117 corresponding to the recess portion 114 and the recess holes 115 on one plate surface 111 are formed on the plate surface 111 at the other side. The protruding portion 116 is engaged with the outer edge of the heat sink 200, and the protruding posts 117 rest on one side of the heat sink 200, so that the heat sink 200 may be fixed on the plate body 110 more stably.

In addition, the holding portions 120 to be engaged with the heat sinks 200 further include a plurality of ribs 121 and notches 122 corresponding to the shapes of the outer edges of the heat sinks 200. The distance between the holding portions 120 on the two sides of the plate body 110 is slightly smaller than the distance between the two opposite sides of the heat sinks 200. Therefore, when the two heat sinks 200 are mounted on the plate surfaces 111, the outer edges of the heat sinks 200 will be tightly engaged with the ribs 121 and the notches 122 of the holding portions 120 respectively. The ribs 121 further provide an inward compression force for fixing and protect the heat sinks 200 from falling off due to shaking or collision under the external force in transportation.

FIGS. 2A to 2F are schematic views of the second embodiment of the present invention. The plate body 110 of the present invention has two opposite plate surfaces having a plurality of columnar support members 113 protruding therefrom. When the plate body 110 covers the bottoms of the two heat sinks 200, the top ends of the support members 113 rest on the bottoms of the heat sinks 200, so that the thermal conducting medium 210 may be accommodated in the space between the support members 113 and the plate surface 111, and is separated from the plate surface 111 by a distance without contacting the plate surface 111.

Referring to FIGS. 2A to 2F, a plurality of recess holes 115 corresponding to the support members 113 on one plate surface 111 is formed on the plate surface 111 on the other side. Moreover, an L-shaped recess portion 114 corresponding to the size of the heat sinks 200 is formed on the plate surfaces 111 respectively, so that the protruding portions of the heat sinks 200 may be engaged with the recess portion 114 and the recess holes 115. On the plate surface 111 on the other side, a protruding portion 116 corresponding to the recess portion 114 is formed to be engaged with the outer edge of the heat sink 200, so that the heat sink 200 may be fixed in the plate body 110 more stably. The holding portions 120 disposed on both sides of the plate body 110, and the holding portions 120 having a plurality of ribs 121 and notches 122 are tightly engaged with the outer edges of the heat sinks 200 respectively, so as to protect the heat sinks 200 from dropping off due to shaking or collision under the external force in transportation.

FIGS. 3A to 3G are schematic views of the third embodiment of the present invention. A protection cavity 112 corresponding to the thermal conducting medium 210 is recessed on one of the two opposite plate surfaces 111 of the plate body 110, and a plurality of columnar support members 113 are formed on the other plate surface 111. When the plate body 110 covers the bottom of the heat sink 200, the thermal conducting medium 210 may be just accommodated in the protection cavity 112. Or, the bottom of the heat sink 200 rest on the top ends of the support members 113, so that the thermal conducting medium 210 is separated from the plate surface 111 by a distance without contacting the plate surface 111.

As shown in FIGS. 3A to 3G, a plurality of recess holes 115 corresponding to the support members 113 formed on one plate surface 111 is formed on the plate surface 111 at the other side. Furthermore, an L-shaped recess portion 114 corresponding to the size of the heat sink 200 is respectively formed on the plate surface 111, so that the protruding portions of the heat sinks 200 may be just engaged with the recess portion 114 and the recess holes 115. A protruding portion 116 and protruding posts 117 respectively corresponding to the recess portion 114 and the recess holes 115 are formed on the plate surface 111 at the other side. The protruding portion 116 is engaged with the outer edge of the heat sink 200, and the protruding posts 117 rest on one side of the heat sink 200, so that the heat sink 200 may be fixed in the plate body 110 more stably. Furthermore, the holding portions 120 having a plurality of ribs 121 and notches 122 are disposed at both sides of the plate body 110 and are tightly engaged with the outer edges of the heat sinks 200 respectively, so as to protect the heat sinks 200 from dropping off due to shaking or collision under the external force in transportation.

Compared with the conventional art, the protective cover of the present invention may simultaneously cover the two heat sinks coated with the thermal conducting medium on its two opposite plate surfaces respectively. In this way, the thermal conducting mediums on the bottoms of the two heat sinks may be completely covered, so as to ensure the integrity and thermal conductivity of the shape of the thermal conducting mediums, and the consumption of the packaging materials are greatly saved, so as to alleviate the damage of plastic wastes to the ecological environment and save the overall cost.

The invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.

Claims

1. A protective cover, used to protect thermal conducting mediums of two heat sinks, comprising:

a plate body, having two opposite plate surfaces respectively covering the sides of the two heat sinks coated with the thermal conducting medium; and

two holding portions, respectively formed on the periphery of the two plate surfaces, wherein the two holding portions are engaged with outer edges of the two heat sinks, so as to fix the two heat sinks respectively on the two plate surfaces of the plate body.

2. The protective cover as claimed in claim 1, wherein the two plate surfaces are recessed to form a protection cavity respectively, and the plate body covering the heat sinks, the thermal conducting medium is covered inside the protection cavity, and the thermal conducting medium is separated from the plate surface by a distance.

3. The protective cover as claimed in claim 1, wherein the two plate surfaces are protruding at least one support member respectively, and the plate body covering the heat sinks, the thermal conducting medium is separated from the plate surface by a distance by the support member.

4. The protective cover as claimed in claim 1, wherein one of the two plate surfaces is recessed to form a protection cavity, and the other plate surface protruding at least one support member, and the plate body covering the heat sinks, the thermal conducting medium is covered inside the protection cavity, or is separated from the plate surface by a distance by the support member.

5. The protective cover as claimed in claim 1, wherein the two plate surfaces further comprise a recess portion and at least one recess hole, and a protruding portion and at least one protruding post corresponding to the recess portion and the at least one recess hole are formed on the plate surface on the other side, so that the heat sinks are engaged with the plate body.

6. The protective cover as claimed in claim 1, wherein the holding portion comprises at least one rib and a notch corresponding to the outer edges of the heat sink, and is engaged with the heat sink.

7. The protective cover as claimed in claim 1, wherein one of the holding portions is extending from the edge of one plate surface, and the other holding portion is protruding from the edge of the other plate surface.