Abstract: A heat sink includes a thermally conductive base. The thermally conductive base has a first surface, a second surface, a guiding surface and an accommodating recess. The second surface faces away from the first surface. The guiding surface are connected to the first surface and the second surface. The guiding surface is not perpendicular to the first surface and the second surface. The accommodating recess is located at the first surface. The thermally conductive base has an inner bottom surface and an inner annular side surface which surround and form the accommodating recess. The inner annular side surface is connected to the inner bottom surface. The accommodating recess accommodates a heat source. The inner bottom surface is thermally coupled to the heat source.

Abstract: A liquid pump unit includes a chassis with a tray box and a chassis box. The chassis box has a front opening, a back panel, and a bay for receiving the tray box. The back panel includes a chassis-outlet coupler, a chassis-inlet coupler, and at least one chassis-electrical connector. A pump assembly is mounted on the tray box and includes an outlet coupler, an inlet coupler, and at least one electrical connector, each removably connected to corresponding chassis couplers. A latch mechanism having a lever, bar, latch, and catch-pin secures the tray box within the chassis. The latch is rotatable to engage or release the catch-pin, allowing the latch mechanism to lock or release.

Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

Abstract: A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.

Abstract: A liquid cooling device includes a thermal conduction base, a thermal conduction cover and at least one piercing component. The thermal conduction base has a liquid storage space and a thermal contact surface. The thermal contact surface faces away from the liquid storage space. The thermal conduction cover is disposed on the thermal conduction base, and covers the liquid storage space. The at least one piercing component is located in the liquid storage space, and has a plurality of protrusions. The plurality of protrusions face the thermal contact surface.

Abstract: A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.

Abstract: A heat dissipating device includes a first casing coupled to a second casing that encloses an internal space of the heat dissipating device. The first casing includes a recessed portion that at least partially defines an evaporator section of the heat dissipating device. The heat dissipating device further includes a condenser section that surrounds the recessed portion, a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion to extend in parallel rows having a same length.

Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Abstract: A variable-part liquid cooling pumping unit, including a water block set, flow guiding plate, and water block cover of a water block unit, and a chamber body of a pump housing assembly of a pump unit is provided. The chamber body includes an impeller cavity inlet, flow adjusting disc, impeller cavity, and impeller cavity outlet opening. Inlet and outlet ports are positioned on a same side. More than one water block unit and pump unit are provided and interchangeable. During operation, working fluid is sucked via the inlet port through the impeller cavity inlet, pass the flow adjusting disc, into the impeller cavity, to a plurality of curved blades of an impeller of a rotor assembly unit. From there, the working fluid travels through the impeller cavity outlet opening, flow guiding plate, and water block set, before exiting through the flow guiding plate, and outlet port.

Abstract: A captive screw includes a sleeve and a screwing member. The sleeve includes a body portion and a positioning protrusion. The positioning protrusion protrudes from the body portion, and forms a channel. The screwing member includes a head portion, a neck portion and a threaded portion. The neck portion connects the head portion and the threaded portion. The neck portion passes through the channel. The head portion and the threaded portion are located on the positioning protrusion. The threaded portion includes a wider section and a narrower section. The wider section is connected to the neck portion. The narrower section is connected to the wider section. The diameter of the channel is less than a major diameter of the wider section. The diameter of the channel is greater than or equal to a major diameter of the narrower section and a minor diameter of the wider section.

Abstract: This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.

Abstract: A cooling apparatus includes a casing, pumping unit, and heat exchange unit. The pumping unit includes a body and housing. The body includes a wishbone-shaped indentation and lollipop shaped indentation separate from the wishbone-shaped indentation. The housing includes a wishbone-shaped flow path and lollipop-shaped flow path separate from the wishbone-shaped flow path. The body is coupled to the housing such that the wishbone-shaped indentation and the wishbone-shaped flow path define a first flow path and the lollipop-shaped indentation and the lollipop-shaped flow path define a second flow path. The pumping unit is coupled to the heat exchange chamber such that the first flow path and the second flow path is in fluid communication with the heat exchange chamber via a first end opening and second end opening, and third opening, respectively.

Abstract: A control valve includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.

Abstract: A storage assembly includes a heat dissipation device and a storage. The heat dissipation device includes a thermally conductive block, a heat sink and a plurality of heat pipes. An end of each of the heat pipes is thermally coupled with the thermally conductive block, and another end of each of the heat pipes is thermally coupled with the heat sink. The storage is thermally coupled with the thermally conductive block.

Abstract: This disclosure relates to a thin pump including a case, a rotor, and a stator. The case has a bottom surface, a lower chamber, an upper chamber, and an accommodation space. The upper chamber is located further away from the bottom surface than the lower chamber. The upper chamber has two opposite ends respectively in fluid communication with the lower chamber and the accommodation space. The rotor includes an impeller and a magnet. The impeller is rotatably disposed in the lower chamber of the case. The magnet is disposed on the impeller. The stator is disposed in the case. The stator corresponds to the magnet of the rotor so as to drive the rotor to rotate with respect to the case.

Abstract: A heat dissipating device that includes a first plate and a second plate opposite the first plate and connected to the first plate by two opposite sidewalls. The first plate and the second plate are connected to each other at longitudinally opposite ends thereof, longitudinally extending ends of the first plate and the second plate are connected to each other by sidewalls, and the first plate, the second plate and the sidewalls enclosing an internal space of the heat dissipating device. The heat dissipating device also includes a first wick structure disposed in the internal space and contacting inner surfaces of at least one of the first plate and the second plate.

Abstract: A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.

Abstract: A liquid cooling system is provided. The liquid cooling system comprises a radiator having first and second built-in fluid tank reservoirs, a multi-fan unit, at least one heat exchanger pump, and a plurality of fluid conduits. The radiator comprises at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins, whereby the multi-fan unit expels heat therefrom. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.

Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.