Abstract: A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.

Abstract: A proportional valve includes a casing and a valve trim. The casing has at least one fluid inlet, a fluid outlet, at least one first connection passageway, at least one second connection passageway and an accommodating space. The first connection passageway is connected with the fluid inlet. The second connection passageway is connected with the fluid outlet. The valve trim is located in the accommodating space, including a flow splitter an adjusting rotor. The flow splitter has at least one third connection passageway and at least one fourth connection passageway. The third connection passageway is connected with the first connection passageway. The fourth connection passageway is connected with the second connection passageway. The adjusting rotor has a channel and at least one blocking portion. The adjusting rotor is rotatably disposed on the flow splitter so that the blocking portion blocks a part of the third connection passageway.

Abstract: This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.

Abstract: A heat dissipation device includes a plurality of fins, at least one first heat pipe and at least one second heat pipe. Each of the fins includes a main body and two first deflectors. The main body has an inflow side, an outflow side and two first communication openings. The first communication openings are located between the inflow side and the outflow side. The first deflectors are arranged obliquely relative to the main body and respectively located on sides of the first communication openings. Air flowing out of the first communication openings is guided by the first deflectors to flow into an area between the first deflectors. The first heat pipe is located between the first deflectors. The second heat pipe is located on one side of one of the first deflectors located relatively far away from the other one of the first deflectors.

Abstract: This disclosure relates to a method for fabricating a vapor chamber. The method includes positioning a capillary structure on a first cover, forming an accommodation space, a flow channel, and a plurality of posts on a first surface of a second cover, covering the first cover with the second cover, positioning the first cover and the second cover such that the plurality of posts are spaced apart from the capillary structure by a distance, and pressure welding the first cover and the second cover so as to form a chamber between the first cover and second cover and a passage connected to the chamber and to pressure weld the plurality of posts with the capillary structure.

Abstract: A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.

Abstract: A liquid cooling device includes a thermally conductive base, a cover, and a metallic partition. The thermally conductive base has a fluid chamber and a plurality of fins. The fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber. Every two of the fins located adjacent to each other define a channel therebetween. Distal ends of at least part of the fins located away from the inner surface together form a covering structure partially coving the channels. The metallic partition is located between and welded to the covering structure and the cover.

Abstract: A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.

Abstract: A pulsating vapor chamber has an inner board, a first outer board, a second outer board, an asymmetric loop, and a working fluid. The inner board has a first surface and a second surface. The first and second outer boards are mounted on the first surface and the second surface of the inner board respectively. The asymmetric loop is located between the first and second outer boards and has multiple channels communicating with each other in sequence. A part of the channels are formed between the first outer board and the inner board, and the remaining channels are formed between the second outer board and the inner board. With the asymmetric loop, even if the vapor chamber is disposed horizontally, pressure may be changed by different amount in the channels so that the working fluid is still able to oscillate or circulate.

Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.

Abstract: A thinned pump includes a casing, a rotor assembly and a stator assembly. The casing includes a base and a cover. The cover covers the base so as to form a fluid chamber together, the cover has an inlet channel and an outlet channel, and the inlet channel and the outlet channel are in fluid communication with the fluid chamber. The rotor assembly includes an impeller and a magnetic component. The impeller is rotatably disposed in the casing, and the magnetic component is embedded into the impeller. The stator assembly includes a plurality of magnetically conductive pillars and a plurality of coils. The magnetically conductive pillars are mounted at one side of the base located opposite to the fluid chamber, and the coils are respectively disposed on the magnetically conductive pillars.

Abstract: A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.

Abstract: A liquid cooling multi-pumping unit comprising a main body and first and second pumps arranged in series is provided. During operation, cooling fluid is sucked via a cooling fluid inlet into a first fluid chamber and then into a first central chamber opening to a plurality of curved blades of a first impeller assembled in a first pump chamber. From there, the cooling fluid travels and is sucked through a fluid distribution channel into a second fluid chamber and then into a second central chamber opening to a plurality of curved blades of a second impeller assembled in a second pump chamber, before exiting through a fluid outlet. The series arrangement of the first and second pumps increases head pressure, and provides sufficient liquid flow in the case where one liquid cooling pump fails. Additionally, lower energy consumption is achieved due to the lower operating speeds required.

Abstract: A water cooling assembly is configured to be mounted at an electrical connector of a circuit board. The water cooling assembly includes a mounting plate and a water cooling radiator. The mounting plate includes a mounting portion and a plugging portion. The plugging portion is connected to a side of the mounting portion, and the plugging portion is configured to be inserted into the electrical connector of the circuit board. The water cooling radiator is fastened to the mounting portion of the mounting plate.

Abstract: A liquid cooling heat exchange apparatus comprising a water block set and pump unit is provided. The water block set has a water block cover having an inlet port, cover diversion channel, cover diversion opening, cover outlet through hole and outlet port, surge directing plate having a plate cover end, and water block. The pump unit has a rotor housing having an impeller cavity comprising an inlet and outlet. The inlet and outlet ports and the cover diversion opening is at a same side, the cover outlet through hole is at an opposite side. During operation, working fluid is sucked via the inlet port, pass the cover diversion channel covered by the plate cover end, through the cover diversion opening and impeller cavity inlet, through the impeller cavity, and outlet, and cover outlet through hole, and through the water block, before exiting through the outlet port.

Abstract: A liquid cooling heat exchange apparatus for memory modules comprising a thermal conduction assembly, fastening assembly, and first and second working fluid splitters is provided. The thermal conduction assembly, mounted on the memory nodules via the fastening assembly, comprises a pair of flat flexible conduits, each having at least one fluid passageway communicating with the first and second working fluid splitters, and a pair of cooling spreaders. The pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first and second working fluid splitters together for transferring heat from the heat producing chips. The pair of cooling spreaders is in thermal contact with the pair of flat flexible conduits for transferring heat from the heat producing chips to the thermal conduction assembly. Each of the at least one fluid passageway is expandable.

Abstract: This disclosure relates to a liquid-cooling device that includes a liquid block and a radiator. The liquid block is in thermal contact with an interface card. The radiator includes a first tank, a second tank, and a heat dissipation channel structure. The first tank and the second tank respectively have a first chamber and a second chamber. The heat dissipation channel structure includes a plurality of liquid transmission components. The first chamber and the second chamber are respectively connected to two opposite sides of the heat dissipation channel structure. Each of the liquid transmission components has an end in fluid communication with the first chamber of the first tank and another end in fluid communication with the second chamber of the second tank. The first chamber and the second chamber are in fluid communication with the liquid block to form a cooling cycle.

Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.

Abstract: The disclosure provides a control valve which includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.