INTEGRATED CIRCUIT PROBING APPARATUS HAVING A TEMPERATURE-ADJUSTING MECHANISM
A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.
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This present application is a divisional application of U.S. patent application Ser. No. 12/046,818, filed on Mar. 12, 2008, which is a divisional application of U.S. patent application Ser. No. 11/609,558, filed on Dec. 12, 2006. The contents of both of those applications are incorporated herein by reference in their entirety.
BACKGROUND OF THE INVENTION(A) Field of the Invention
The present invention relates to an integrated circuit probing apparatus having a temperature-adjusting mechanism, and more particularly, to an integrated circuit probing apparatus having a temperature-adjusting mechanism to transfer heat into or out of the testing environment by pressurized fluid.
(B) Description of the Related Art
Referring to
One aspect of the present invention provides an integrated circuit probing apparatus having a temperature-adjusting mechanism to transfer heat into or out of the testing environment by pressurized fluid.
An integrated circuit probing apparatus according to this aspect of the present invention comprises a probe card having a circuit board, a holder configured to support the probe card, a test head and a temperature-adjusting mechanism. The probe card includes at least one probe positioned on the circuit board, the probe can form an electrical connection with an integrated circuit device facing a first surface of the circuit board, and the temperature-adjusting mechanism can be optionally positioned on a second surface of the circuit board. In addition, the temperature-adjusting mechanism can also be optionally positioned inside the circuit board, inside the holder or on the holder. The test head includes a plurality of pins capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board and test instruments or circuitry within the test head for performing the measurements of electrical properties of the device under tests. The temperature-adjusting mechanism can be optionally positioned inside the test head or on the test head. The temperature-adjusting mechanism includes at least one flow line having at least one fluid inlet and a plurality of fluid outlets, the fluid inlet can be positioned on the second surface of the circuit board, and the fluid is gas, liquid or the combination thereof.
Compared to the prior art, the present invention allows the flow of the pressurized fluid in the flow line to adjust the temperature of the test environment. Consequently, the temperature of the test environment where the integrated circuit probing apparatus is positioned can be kept within the range in which the material of the integrated circuit probing apparatus can optimally perform. In addition, variations in the physical or material properties of the test and measurement units, parts and mechanisms of the integrated circuit probing apparatus can be reduced to a minimum by controlling the temperature of the pressurized fluid and the flow rate of the pressurized fluid to decrease the temperature variation of the test environment.
The objectives and advantages of the present invention will become apparent upon reading the following description and upon reference to the accompanying drawings in which:
The temperature-adjusting mechanism 66 comprises a support 52 such as a cover positioned on the second surface 12B of the circuit board 12 and a flow line 54 positioned on the supporter 52. Preferably, the flow line can be a guiding tube having at least one fluid inlet and a plurality of fluid outlets facing the outer edge of the circuit board 12. The flow line permits a fluid to flow therein, and the fluid can be gas, liquid or the combination thereof. For example, the fluid can be cooled dry air, nitrogen or the combination of cooled dry air and nitrogen for cooling the test environment. In addition, the fluid can be heated air for increasing the temperature of cold temperature environment to prevent condensation on the test head 60 and pogo pins 62.
The temperature-adjusting mechanism 66 permits a pressurized fluid to flow therein via the fluid inlet 58 in a controlled manner such that the temperature of the test environment can be kept within a predetermined range in which the material of the integrated circuit probing apparatus 50 can optimally perform. Variations in the physical or material properties of the integrated circuit probing apparatus 50 can be reduced to a minimum by controlling the temperature of the pressurized fluid and the flow rate of the pressurized fluid in order to decrease the temperature variation of the test environment.
The accuracy of the test data of the integrated circuit are determined by the test equipment operating under pre-specified range of working temperature. The temperature-adjusting mechanism 66 is also used to ensure that the test head 60 and pogo pins 62 are performing the electrical measurements of integrated circuit under the specified operation temperature.
Compared to the prior art, the present invention allows the flowing of the pressurized fluid in the flow line to adjust the temperature of the test environment. Consequently, the temperature of the test environment where the integrated circuit probing apparatus is positioned can be kept within the range in which the material of the integrated circuit probing apparatus and the test units of test head can optimally perform. In addition, variations in the physical or material properties of the integrated circuit probing apparatus can be reduced to the minimum by controlling the temperature of the pressurized fluid and the flow rate of the pressurized fluid to decrease the temperature variation of the test environment.
The above-described embodiments of the present invention are intended to be illustrative only. Numerous alternative embodiments may be devised by those skilled in the art without departing from the scope of the following claims.
Claims
1. An integrated circuit probing apparatus, comprising:
- a circuit board having a first surface and a second surface;
- at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit device facing the first surface; and
- a temperature-adjusting mechanism positioned on the second surface, the temperature-adjusting mechanism including at least one flow line positioned on the second surface of the circuit board, and the flow line includes at least one fluid inlet and a plurality of fluid outlets.
2. The integrated circuit probing apparatus of claim 1, wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof.
3. The integrated circuit probing apparatus of claim 1, wherein the flow line is a guiding tube.
4. An integrated circuit probing apparatus, comprising:
- a circuit board having a first surface and a second surface;
- at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit device facing the first surface;
- a holder configured to support the circuit board; and
- a temperature-adjusting mechanism positioned in the holder or on the holder.
5. The integrated circuit probing apparatus of claim 4, wherein the temperature-adjusting mechanism is a flow line positioned in the holder.
6. The integrated circuit probing apparatus of claim 5, wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof.
7. The integrated circuit probing apparatus of claim 5, wherein the flow line includes at least one fluid inlet and a plurality of fluid outlets.
8. The integrated circuit probing apparatus of claim 5, wherein the temperature-adjusting mechanism is a guiding tube positioned on the holder, and the guiding tube includes at least one fluid inlet and a plurality of fluid outlets.
9. An integrated circuit probing apparatus, comprising:
- a circuit board having a first surface and a second surface;
- at least one probe positioned on the circuit board, the probe being able to electrically contact an integrated circuit device facing the first surface;
- a test head positioned above the second surface; and
- a temperature-adjusting mechanism positioned in the test head or on the test head.
10. The integrated circuit probing apparatus of claim 9, wherein the test head includes a plurality of pins capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board.
11. The integrated circuit probing apparatus of claim 9, wherein the temperature-adjusting mechanism is a flow line having at least one fluid inlet and a plurality of fluid outlets.
12. The integrated circuit probing apparatus of claim 11, wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof.
13. The integrated circuit probing apparatus of claim 11, wherein the flow line is a guiding tube.
14. The integrated circuit probing apparatus of claim 9, wherein the test head includes a test interface or test measurement unit capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board.
Type: Application
Filed: Sep 26, 2008
Publication Date: Jan 15, 2009
Applicant: STAR TECHNOLOGIES INC. (HSINCHU COUNTY)
Inventors: CHOON LEONG LOU (HSINCHU COUNTY), LI MIN WANG (HSINCHU COUNTY)
Application Number: 12/239,060
International Classification: G01R 1/073 (20060101);