HEAT DISSIPATION ASSEMBLY
A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a bottom surface of a heat sink. The heat sink includes a base and a plurality of fins extending from the base. The base defines two elongated grooves at two opposite lateral sides thereof, respectively. The containment apparatus includes a plate located below the thermal interface material and an annular frame extending upwardly from edges of the plate and attached to a periphery of the base of the heat sink. The frame defines two inserting ribs projecting inwardly from inner walls thereof and correspondingly inserting into the grooves of the base.
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1. Field of the Invention
The disclosure relates generally to a heat dissipation, and particularly to a heat dissipation assembly having a containment apparatus for containing a thermal interface material.
2. Description of Related Art
Electronic devices such as central processing units (CPUs) generate considerable heat during normal operation, which, if not properly dissipated, can deteriorate operational stability and damage associated electronic devices. A heat sink is often directly attached to a top surface of an electronic device to remove heat therefrom. Gaps formed between the heat sink and the electronic devices reduce heat transfer efficiency. To ensure consistent and effective contact between the electronic device and the heat sink, a thermal interface material such as thermal grease is often applied to a surface of the heat sink. Conventionally, the thermal grease is spread onto the heat sink just prior to attachment of the heat sink to the CPU, since its semi-fluid state at ambient temperature promotes easy removal and contamination by dust or foreign particles before the heat sink is assembled to the CPU. This operation extends the time needed for said attachment. To overcome the above problem, various containment apparatuses have been developed. By using the containment apparatus, the thermal grease can be applied to the heat sink in advance, thereby simplifying the process of attachment of the heat sink to the CPU. However, the containment apparatus is attached to the heat sink by applying an adhesive strap to thereby preventing detaching therefrom. The adhesive must be cleaned from the heat sink before the heat sink is attached to the CPU. This is unduly inconvenient.
What is needed, therefore, is a heat dissipation assembly providing a containment apparatus which can reliably engage with the heat sink and prevent the thermal grease from unwanted migration to surrounding areas or contamination by dust or foreign particles.
SUMMARY OF THE INVENTIONA heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a bottom surface of a heat sink. The heat sink includes a base and a plurality of fins extending from the base. The base defines two elongated grooves at two opposite lateral sides thereof, respectively. The containment apparatus includes a plate located below the thermal interface material and an annular frame extending upwardly from edges of the plate and attached to a periphery of the base of the heat sink. The frame defines two inserting ribs projecting inwardly from inner walls thereof and correspondingly inserting into the grooves of the base. The thermal interface material is applied on a bottom of the base. The containment apparatus cooperates with the base to form a space for securely enclosing the thermal interface material therein.
Other advantages and novel features of the disclosure will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
Many aspects of the present device can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present device. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
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It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims
1. A heat dissipation assembly, comprising:
- a heat sink comprising a base and a plurality of fins extending from the base, the base defining two elongated grooves at two opposite lateral sides thereof, respectively;
- a thermal interface material applied on a bottom surface of the base of the heat sink; and
- a containment apparatus mounted on a bottom of the heat sink, comprising a plate located below the bottom surface of the base and a frame extending upwardly from edges of the plate and having two inserting ribs protruding inwardly from inner walls thereof,
- wherein the frame is attached to a periphery of the base and the two inserting ribs are engagingly received in the grooves of the base.
2. The heat dissipation assembly as claimed in claim 1, wherein the inserting ribs are elongated and parallel to the plate.
3. The heat dissipation assembly as claimed in claim 1, wherein the plate has a shape the same as that of the base, and is parallel to the bottom surface of the base.
4. The heat dissipation assembly as claimed in claim 1, wherein the frame consists of a plurality of elongated sidewalls interconnected together and respectively extending upwardly from corresponding edges of the plate.
5. The heat dissipation assembly as claimed in claim 4, wherein the two inserting ribs respectively projects from two parallel, opposite ones of the sidewalls.
6. The heat dissipation assembly as claimed in claim 5, wherein the frame further defines a plurality of spaced protruding ribs projecting inwardly from other sidewalls.
7. The heat dissipation assembly as claimed in claim 6, wherein the protruding ribs are perpendicular to the plate.
8. The heat dissipation assembly as claimed in claim 1, wherein the grooves are parallel to the bottom surface of the base.
9. The heat dissipation assembly as claimed in claim 1, wherein the heat sink has two horizontal arms respectively extending outwardly from two opposite sides of the base, and two slantwise arms extending upwardly and outwardly extending from a top side of the base.
10. The heat dissipation assembly as claimed in claim 1, wherein the frame further comprises an annular flange extending outwardly from a top end thereof, the flange abutting the bottom of the heat sink around the base.
11. A heat dissipation assembly comprising:
- a heat sink comprising a base and a plurality of fins extending from the base, the base having a plurality of lateral sides wherein two opposite ones of the lateral sides define two elongated grooves therein, respectively;
- a thermal interface material applied on a bottom surface of the base of the heat sink;
- a containment apparatus attached to a bottom of the heat sink, comprising a plate and a frame extending upwardly from edges of the plate;
- wherein the frame consists of a plurality of sidewalls correspondingly attached to the lateral sides of the base, two elongated inserting ribs respectively project inwardly from two opposite ones of the sidewalls of the frame and correspondingly inserting into the two grooves of the base, and a plurality of protruding ribs project inwardly from other ones of the sidewalls of the frame and abutting against corresponding lateral sides of the base of the heat sink.
12. The heat dissipation assembly as claimed in claim 11, wherein the base has a shape the same as that of the plate.
13. The heat dissipation assembly as claimed in claim 11, wherein the protruding ribs are perpendicular to the plate.
14. The heat dissipation assembly as claimed in claim 11, wherein the grooves are parallel to the bottom surface of the base.
15. The heat dissipation assembly as claimed in claim 11, wherein the inserting ribs are parallel to the plate.
Type: Application
Filed: Oct 30, 2008
Publication Date: Dec 31, 2009
Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. (Shenzhen City), Foxconn Technology Co., Ltd. (Tu-Cheng)
Inventors: Jian Liu (Shenzhen City), Jing Zhang (Shenzhen City)
Application Number: 12/261,048
International Classification: F28F 7/00 (20060101);