Abstract: A connecting device includes a floating connector, a case, and an elastic sheet. The floating connector has a channel configured to let a liquid pass through it. The elastic sheet includes a first extending structure, a second extending structure, and a curved structure. The first extending structure is affixed to the case. The second extending structure is connected to the floating connector. The head end and the tail end of the curved structure are respectively connected to the first extending structure and the second extending structure.

Abstract: A computing system includes a rack having standard slots for computing devices and computing devices coupled to the rack. One or more of the computing devices includes a chassis, a circuit board assembly in a primarily horizontal orientation, and one or more processors coupled to the circuit board assembly. One or more stacks of hard disk drives are coupled to the chassis. The chassis has a width that is equal to or less than half of the width of one of the standard slots of the rack.

Abstract: A display device includes: a display panel including sub-pixels and a heat dissipation pad electrically connected to at least one of the sub-pixels; a heat dissipation sheet on the heat dissipation pad; and an insulating heat dissipation adhesive layer between the heat dissipation sheet and the heat dissipation pad to adhere the heat dissipation sheet and the heat dissipation pad.

Abstract: A rotary machine includes an electric motor, an impeller to be rotated by driving the electric motor and suck in and compress a gas, and a housing that houses the impeller and includes a suction port for the gas. The rotary machine further includes heat dissipation fins provided on the housing and disposed to be heat-exchangeable with the gas passing through the suction port, and an inverter connected to the housing and that controls the electric motor.

Abstract: A cryostat with improved accessibility for experiments includes a cooling device, a vacuum chamber and multiple cooling levels, heat shields and experimentation places. The cooling device is thermally coupled to cooling levels that have different temperatures. The experimentation places are at the temperatures of the cooling levels and are arranged side by side when viewed from above such that each experimentation place is accessible from above and from the side. Each cooling level has an associated heat shield that also encloses an experimentation place. The vacuum chamber encloses the cooling levels. The cold plate of a second cooling level is arranged above the cold plate of a first cooling level such that a portion of the first cold plate protrudes laterally from under the second cold plate. An experimentation place is disposed above the protruding portion of the first cold plate and is accessible from above and from the side.

Abstract: A thermal management device includes a fin pack and a plurality of channels. The fin pack has a hot side and a cold side, and the plurality of channels in the fin pack provide fluid communication from the hot side to the cold side. The channels have a transverse dimension and a longitudinal dimension, and the longitudinal dimension is at least 2.5 times the transverse dimension.

Abstract: A housing structure includes a first cover and a second cover. The first cover includes a first substrate and two first side plates. The second cover includes a second substrate and two second side plates. The two first side plates and the two second side plates are spliced between the first substrate and the second substrate, such that an accommodating space is formed between the first cover and the second cover.

Abstract: A windshield electronics module for a vehicular vision system includes a camera module configured to be mounted at an in-cabin side of a windshield of a vehicle, and a cover element that encloses the camera module at the windshield when the camera module and cover element are mounted at the in-cabin side of the windshield. The camera module includes a camera and circuitry including an image processor. A cooling fan assembly is attached at the camera housing and an air intake conduit is disposed between an air inlet of the cover element and an air inlet of the cooling fan assembly. The cooling fan assembly, when electrically powered, draws air from the interior cabin of the vehicle via the air intake conduit and directs the drawn air as airflow along and between heat dissipating fins of the camera housing.

Abstract: A radar sensor assembly includes a sensor printed circuit board (PCB) having a first side and a second side opposite the first side. A radar transceiver is disposed at the first side of the sensor PCB and includes a plurality of antennas configured for transmitting and receiving radio frequency (RF) radiation. A heat sink is disposed adjacent to the radar transceiver and is configured to dissipate heat from the radar transceiver. The radar transceiver is sandwiched between the heat sink and the sensor PCB. The heat sink is configured to allow the RF radiation to pass therethrough without guiding the RF radiation.

Abstract: A heat exchanger (100) for an aircraft engine includes a core (1) and radiating fins (2). The radiating fins are configured such that a ratio y/Y of a height y from a surface (10) of the core to a formation position of a connecting portion (23) to a total height Y of each of the radiating fins (2) from the surface of the core satisfies a relationship of 0.34<y/Y<0.64.

Abstract: A backing plate assembly with jack screw for bare die device heat sink applications to ensure uniform loading. The jack screw is used to force a PCB support plate and mounting plate apart, and by doing so, compresses a plurality of springs and applies uniform pressure to the heat sink, which in turn applies pressure to the bare die of the BGA device. The single jack screw is essential to the design, as it creates a single point to apply torque and compress all the springs at the same time. A lock screw is meant to maintain the position of the PCB support plate and the mounting plate. Prior to assembly, the lock screw keeps the PCB support plate and mounting plate together to ease installation.

Abstract: An electric device (1) comprises a portion generating heat and a portion for dissipating said generated heat by heat exchange with a fluid, wherein said heat dissipating portion comprises means for generating a turbulent flow in the fluid.

Abstract: An electrohydrodynamic heat sink is provided which has a base electrode receiving heat from a heat source to be dissipated, the base electrode having a shape that converges with a cavity wherein a fluid is placed during use, and a corona electrode which is arranged in the cavity of the base electrode, the corona electrode being connected to an electric power source (P.S) in order to ionise the fluid of the base electrode and generate an ion wind (w) from the corona electrode to the base electrode, so as to generate a laminar current of the fluid in order to discharge the heat from the cavity.

Abstract: A cooling apparatus including a heat sink to which a heat generating body is joined, a main flow generation device configured to generate a main flow for cooling the heat sink, and an induced flow generation device configured to electrically generate an induced flow. The induced flow generation device is provided to a support member facing the heat sink.

Abstract: Methods and systems automatically protect radio network equipment in extreme weather conditions such as sand-storms or snow-storms. A pair of phase-shift material grids having different orientations is installed at an air intake of the radio network equipment. One of the grids is powered to open or close the air intake according to a current amount of air-carried particles entering the radio network equipment and a temperature inside the radio network equipment. The current amount of air-carried particles entering the radio network equipment may be detected by a piezoelectric sensor.

Abstract: A fan unit is detachably attached on a side face of a housing, a heating element is housed in the housing, and the fan unit includes a fan configured to be detachably attached to the fan unit. The fan unit is configured to detachably support the fan so that when the fan unit is attached to the housing, directions in which the fan is attached to and detached from the fan unit are made different from directions in which the fan unit is attached to and detached from the housing.

Abstract: A light source apparatus according to an embodiment of the present disclosure includes: a supporting substrate including a phosphor layer on one surface; a driver that causes the supporting substrate to be rotationally driven; a first supporting member that is opposed to another surface opposite to the one surface of the supporting substrate; a plurality of first heat dissipation members each having heat dissipation performance different from each other depending on a distance from the phosphor layer, the plurality of first heat dissipation members being provided concentrically on the other surface of the supporting substrate; and a plurality of second heat dissipation members provided concentrically on a surface, of the first supporting member, that is opposed to the supporting substrate, the plurality of second heat dissipation members being disposed alternately with the plurality of first heat dissipation members.

Abstract: A heat sink includes a first flange, a second flange, and an accordion-shaped medial portion continuous between the first flange and the second flange. The first flange and the second flange are configured to be attached to a circuit board. The accordion-shaped medial portion includes troughs on a proximal side of the accordion-shaped medial portion and crests on a distal side of the accordion-shaped medial portion such that the heat sink is configured to disperse heat away from the circuit board.

Abstract: The invention relates to a housing for an electrical apparatus, said housing including: a first chamber (117) intended for receiving first electronic components (300, 315); a second chamber (127) intended for receiving second electronic components; an interface separating the first chamber (117) from the second chamber (127); and a cooling circuit configured to receive a fluid intended for cooling said electrical apparatus, said cooling circuit being formed inside said housing interface, wherein said interface includes a blind hole extending from the first chamber (117) towards the second chamber (127), which is configured to form a cavity intended for receiving a first component (315).

Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

Abstract: An apparatus includes multiple thermal interface segments collectively forming a discontinuous thermal interface configured to contact a curved surface of an object. The discontinuous thermal interface is configured to transfer thermal energy to or receive thermal energy from the curved surface of the object. Each of the thermal interface segments includes a major surface that is curved. The curved major surface of each of the thermal interface segments is configured to register with the curved surface of the object and has a specified area that is based on a Hertzian contact area defined partially by the curved surface of the object. The apparatus can also include a thermal gap pad configured to be compressed between the thermal interface segments and the object.

Abstract: An air-conditioning unit includes an air-conditioning case including an opening through which air flows, a cooler disposed in the air-conditioning case to cool air flowing to the opening, a heater disposed in the air-conditioning case to heat air flowing to the opening, and an adjusting member disposed to cover the opening and adjusting airflow passing through the opening. The adjusting member is produced separately from the air-conditioning case and includes a first region and a second region. The second region includes a high resistance member giving higher resistance to the airflow than the first region. The first region includes a low resistance member giving lower resistance to the airflow than the second region. The low resistance member is a partition dividing the first region into plural air passing parts through which air flows. The high resistance member is a plate member including a part to interfere the airflow.

Abstract: An example of a computer-readable medium storing machine-readable instructions. The instructions may cause the processor to receive thermal data for a device and apply anomaly models to the thermal data to produce grades. Grades for a device may be combined into a system thermal grade and corrective actions identified to improve the system thermal grade.

Abstract: Provided is an outdoor unit for a refrigeration apparatus, the outdoor unit being capable of suppressing decrease in reliability. An outdoor unit (10) includes: a compressor (12); an outdoor fan (18) configured to provide outdoor air flows (AF), the outdoor fan (18) being higher in heightwise position than the compressor (12); a high-heat generating electric component (65) configured to control the compressor (12); a fan controlling electric component (66) configured to control the outdoor fan (18); a board unit (75) including a compressor controlling electric component mount portion (75a) and a fan controlling electric component mount portion (75b); a first cooling unit (80); and an outdoor unit casing (40). The outdoor air flows (AF) flow from below upward in the outdoor unit casing (40), and flow out of the outdoor unit casing (40) through a blow-out port (402).

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.

Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device defining a fluid chamber, wherein at least a portion of the first integrated circuit device and at least a portion of the second integrated circuit device are exposed to the fluid chamber. In further embodiments, at least one channel may be formed in an underfill material between the first integrated circuit device and the second integrated circuit device, between the first integrated circuit device and the substrate, and/or between the second integrated circuit device and the substrate, wherein the at least one channel is open to the fluid chamber.

Abstract: A thermal module assembly, comprising: a computing expansion card; a thermal interface material (TIM) positioned on a surface of the computing expansion card; a thermal plate; and a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier include a first end positioned opposite to a second end, wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide an uniform pressure between the thermal plate, the TIM material, and the computing expansion card.

Abstract: A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

Abstract: A compact electronic device for wireless communication is disclosed. The compact electronic device includes a main printed circuit board, one or more antennas, at least one conductor, and a shell. The one or more antennas are configured for wireless communication. The at least one conductor being configured to provide at least one of control signals and power to a fan. The shell mounts the fan relative to the main printed circuit board. The shell includes walls forming a cavity. The walls encapsulate the conductor in the cavity.

Abstract: A connector assembly comprising a shielding shell, a heat dissipating module and a clip. The shielding shell comprises a top wall and two side walls. The heat dissipating module comprises a thermal conducting plate which is provided to a top wall of the shielding shell. Side edges of the thermal conducting plate comprise rearward stopped portions toward the rear. The clip comprises an elastic pressing portion which presses against a top surface of the thermal conducting plate and outer side plates which are assembled to the corresponding side walls of the shielding shell. The outer side plate comprises a rearward displace limiting portion. The rearward displace limiting portion cooperates with the corresponding rearward stopped portion of the thermal conducting plate so as to limit relative displacement of the thermal conducting plate relative to the shielding shell toward the rear. Therefore, it may prevent the thermal conducting plate from disengaging.

Abstract: The present embodiments relate to data center outage detection and alert generation. An outage detection service as described herein can process near real-time data from various sources in a datacenter and process the data using a model to determine one or more projected sources of a detected outage. The model as described herein can include one or more machine learning models incorporating a series of rules to process near-real time data and offline data and determine one or more projected sources of an outage. An alert message can be generated to provide the projected sources of the outage and other data relevant to the outage.

Abstract: A cooling/warming device according to one embodiment of the present invention provides a cooling/warming device including a case including a lower case and an upper case coupled to the lower case, a fan which is accommodated in the case and circulates air introduced into the case, a thermoelectric device which is accommodated in the case, is disposed on a side surface of the fan, cools some air generated by the fan, and heats the remaining air, and a controller which is connected to the thermoelectric device and the fan and controls operation of the thermoelectric device and the fan. The thermoelectric device includes a first heat transmission member disposed at a side of the lower case, a second heat transmission member disposed at a side of the upper case, and a thermoelectric element disposed between the first heat transmission member and the second heat transmission member.

Abstract: In an electric power steering apparatus, a motor housing includes an axial end part opposite to an output part of an electric motor. An electronic control section is arranged at the axial end part of the motor housing. The electronic control section includes a control circuit part, a power supply circuit part, and a power conversion circuit part. The axial end part of the motor housing includes a power conversion part thermal radiation region and a power supply part thermal radiation region. The power conversion circuit part is mounted to the power conversion part thermal radiation region to allow heat to be transferred from the power conversion circuit part to the motor housing. The power supply circuit part is mounted to the power supply part thermal radiation region to allow heat to be transferred from the power supply circuit part to the motor housing.

Abstract: There is disclosed a device for cooling a server rack within a server room having a first chamber and a second chamber, the device comprising: a main chilling unit; a heat exchanging unit operatively coupled to the main chilling unit; the main chilling unit including a housing for housing: an evaporator; a first airlock device to removably secure the main chilling unit to the server rack from a side of the first chamber; a first fan configured to force air from the first chamber to the second chamber; the heat exchanging unit including a housing for housing: a condenser in fluid communication with the evaporator, the condenser being configured to transmit heat from the liquid coolant to air surrounding the condenser; a second airlock device configured to removably secure the heat exchanging unit to the second chamber; a second fan configured to blow the heated air into the second chamber.

Abstract: A circuit interrupter including a current sensor having a normal sensor output and an over current detection output, a solid state switch module structured to have a closed state to allow current to flow through the circuit interrupter and an open state to interrupt current flowing through the circuit interrupter, a gate driver structured to control the solid state switch module including a desaturation function output, wherein the gate driver is structured to cause the solid state switch module to interrupt current flowing through the circuit interrupter when the DESAT function output changes to the on state, and an electronic trip circuit structured to output a tri when the normal sensor output reaches a first threshold level or the overcurrent detection output changes to the on state.

Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.

Abstract: Methods and systems for supporting similar thermal devices may involve collecting, by a thermal module on a management controller of an information handling system, device information about an add-in card, determining whether the add-in card was previously defined by matching the device against a table, searching the table based on the determination that the add-in card was not previously defined, determining whether the add-in card is supported by finding a match in the table, and applying a thermal tier associated with the match in the table based on the determination that the add-in card is supported. The device information collected may involve at least two of a reseller part number, description, device identifier, sub device identifier, vendor identifier, sub vendor identifier, slot identifier, lane width, and auxiliary power indicator. The search of the table may involve at least one of the description, lane width, and sub vendor identifier.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: An air duct assembly for an axial flow fan including an air inlet shroud and an air outlet shroud. The air inlet shroud includes a plurality of mutually angled air inlet surfaces, and a ratio of an area of the air inlet surfaces of the air inlet shroud to that of air outlet surfaces of the air outlet shroud is 1.1 to 1.35. The air inlet shroud is provided to have mutually angled air inlet surfaces to increase the ratio of the area of the air inlet surfaces of the air inlet shroud to that of the air outlet surfaces of the air outlet shroud, obtaining a higher wind speed with fairly little noise.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

Abstract: A semiconductor device includes: a semiconductor substrate; a power device formed in the semiconductor substrate; a metal bilayer formed over the semiconductor substrate, the metal bilayer including a discontinuous metal layer formed on and in contact with a continuous base metal layer; and one or more contact pads formed in the metal bilayer or in a metallization layer above the metal bilayer. The discontinuous metal layer includes a plurality of metal blocks which are laterally spaced apart from one another and which form a heat sink structure over the power device. The continuous base metal layer is configured to laterally spread heat energy from the power device to the plurality of metal blocks. Methods of producing the semiconductor device are also described.

Abstract: A semiconductor arrangement and an inverter incorporating the semiconductor arrangement, in particular to an inverter for use with traction power units e.g. for on and off road vehicles and stationary power inversion, are described. In the arrangement, semiconductor devices are thermally and electrically coupled to a heatsink as a module. The heatsink is configured as a bus bar to electrically connect the one or more semiconductor devices together to transmit power between the one or more semiconductor devices. The semiconductor devices may be cooled using the structure to which they are attached, and also immersed in a cooling medium to further increase the cooling of the device.

Abstract: A device is disclosed that include a first component comprising a rigid assembly shot molded to a flexible assembly, a second component comprising a fan housing and wherein the first component is coupled to the second component and the flexible assembly is disposed between the rigid assembly and the second component.

Abstract: An entertainment system including a removable seat-back display unit and a docking station. The seat-back display unit can include a rotating latch butterfly release mechanism that prevents unauthorized release of the display unit from the docking station. The system can include a three-point attachment system that provides additional protection against accidental detachment of the display unit, and provide safety in the event of partial dislodging. The system can include a current control pin system that ensures that current is not provided from the docking station to the display unit until the respective connectors have been properly engaged. The system can further include a floating pin connector dock that can allow for installation of the display unit even when the connectors of the display unit and docking station become misaligned. The system can also include a heat dissipation system that employs the docking station to share the heat dissipation load with the display unit.

Abstract: A compressor includes a casing having a cylindrical portion, a compression mechanism fixed to an inner peripheral surface of the cylindrical portion, an external portion, a weld nut, and a bolt. The external portion includes a temperature reaction portion that reacts to a temperature change of the cylindrical portion. The external portion is mounted on an outer peripheral surface of the cylindrical portion. The weld nut is welded to the outer peripheral surface of the cylindrical portion to mount the external portion on the outer peripheral surface of the cylindrical portion. The bolt fixes the external portion to the weld nut.

Abstract: A portable electronic device including a body, a door, a carrier and at least one electronic module is provided. The door is movably mounted on the body. The carrier includes a first side and a second side opposite to each other, the first side is pivoted to the body, and the second side is movably pivoted to the door. The electronic module is disposed on the carrier. At least one opening is formed between the door and the body when the door moves away from the body, and the door drives the carrier to rotate relative to the body, such that the electronic module is tilted with respect to the body along with the movement of the door, and the electronic module is exposed to an external environment via the opening for heat dissipation.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable a segmented heatsink. The electronic device can include a printed circuit board, a substrate, where the substrate is over the printed circuit board, at least two heat sources over the substrate, and a segmented heatsink secured to the printed circuit board, where the segmented heatsink has at least two independent heatsink segments, where each heatsink segment corresponds to at least one heat source and is configured to draw heat from the corresponding heat source. In an example, the heat sources are at a different height.