Abstract: An example of a computer-readable medium storing machine-readable instructions. The instructions may cause the processor to receive thermal data for a device and apply anomaly models to the thermal data to produce grades. Grades for a device may be combined into a system thermal grade and corrective actions identified to improve the system thermal grade.

Abstract: Provided is an outdoor unit for a refrigeration apparatus, the outdoor unit being capable of suppressing decrease in reliability. An outdoor unit (10) includes: a compressor (12); an outdoor fan (18) configured to provide outdoor air flows (AF), the outdoor fan (18) being higher in heightwise position than the compressor (12); a high-heat generating electric component (65) configured to control the compressor (12); a fan controlling electric component (66) configured to control the outdoor fan (18); a board unit (75) including a compressor controlling electric component mount portion (75a) and a fan controlling electric component mount portion (75b); a first cooling unit (80); and an outdoor unit casing (40). The outdoor air flows (AF) flow from below upward in the outdoor unit casing (40), and flow out of the outdoor unit casing (40) through a blow-out port (402).

Abstract: There is provided a semiconductor device including a substrate whose surface is made of an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat sink bonded to the semiconductor chip via a thermal interface material and fixed to the substrate outside the semiconductor chip, in which the heat sink has a protrusion part protruding toward the substrate and bonded to the substrate via a conductive resin between a part bonded to semiconductor chip and a part fixed to the substrate and the heat sink has a stress absorbing part. According to the present invention, the protrusion part of the heat sink is prevented from being peeled off from the substrate at the part where the protrusion part of the heat sink is bonded to the substrate.

Abstract: Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device defining a fluid chamber, wherein at least a portion of the first integrated circuit device and at least a portion of the second integrated circuit device are exposed to the fluid chamber. In further embodiments, at least one channel may be formed in an underfill material between the first integrated circuit device and the second integrated circuit device, between the first integrated circuit device and the substrate, and/or between the second integrated circuit device and the substrate, wherein the at least one channel is open to the fluid chamber.

Abstract: A thermal module assembly, comprising: a computing expansion card; a thermal interface material (TIM) positioned on a surface of the computing expansion card; a thermal plate; and a carrier configured to hold the computing expansion card with the TIM positioned on the surface of the computing expansion card, the carrier include a first end positioned opposite to a second end, wherein the thermal plate is removably coupled to the carrier at the first end and the second end to provide an uniform pressure between the thermal plate, the TIM material, and the computing expansion card.

Abstract: A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

Abstract: A compact electronic device for wireless communication is disclosed. The compact electronic device includes a main printed circuit board, one or more antennas, at least one conductor, and a shell. The one or more antennas are configured for wireless communication. The at least one conductor being configured to provide at least one of control signals and power to a fan. The shell mounts the fan relative to the main printed circuit board. The shell includes walls forming a cavity. The walls encapsulate the conductor in the cavity.

Abstract: A connector assembly comprising a shielding shell, a heat dissipating module and a clip. The shielding shell comprises a top wall and two side walls. The heat dissipating module comprises a thermal conducting plate which is provided to a top wall of the shielding shell. Side edges of the thermal conducting plate comprise rearward stopped portions toward the rear. The clip comprises an elastic pressing portion which presses against a top surface of the thermal conducting plate and outer side plates which are assembled to the corresponding side walls of the shielding shell. The outer side plate comprises a rearward displace limiting portion. The rearward displace limiting portion cooperates with the corresponding rearward stopped portion of the thermal conducting plate so as to limit relative displacement of the thermal conducting plate relative to the shielding shell toward the rear. Therefore, it may prevent the thermal conducting plate from disengaging.

Abstract: The present embodiments relate to data center outage detection and alert generation. An outage detection service as described herein can process near real-time data from various sources in a datacenter and process the data using a model to determine one or more projected sources of a detected outage. The model as described herein can include one or more machine learning models incorporating a series of rules to process near-real time data and offline data and determine one or more projected sources of an outage. An alert message can be generated to provide the projected sources of the outage and other data relevant to the outage.

Abstract: A cooling/warming device according to one embodiment of the present invention provides a cooling/warming device including a case including a lower case and an upper case coupled to the lower case, a fan which is accommodated in the case and circulates air introduced into the case, a thermoelectric device which is accommodated in the case, is disposed on a side surface of the fan, cools some air generated by the fan, and heats the remaining air, and a controller which is connected to the thermoelectric device and the fan and controls operation of the thermoelectric device and the fan. The thermoelectric device includes a first heat transmission member disposed at a side of the lower case, a second heat transmission member disposed at a side of the upper case, and a thermoelectric element disposed between the first heat transmission member and the second heat transmission member.

Abstract: In an electric power steering apparatus, a motor housing includes an axial end part opposite to an output part of an electric motor. An electronic control section is arranged at the axial end part of the motor housing. The electronic control section includes a control circuit part, a power supply circuit part, and a power conversion circuit part. The axial end part of the motor housing includes a power conversion part thermal radiation region and a power supply part thermal radiation region. The power conversion circuit part is mounted to the power conversion part thermal radiation region to allow heat to be transferred from the power conversion circuit part to the motor housing. The power supply circuit part is mounted to the power supply part thermal radiation region to allow heat to be transferred from the power supply circuit part to the motor housing.

Abstract: There is disclosed a device for cooling a server rack within a server room having a first chamber and a second chamber, the device comprising: a main chilling unit; a heat exchanging unit operatively coupled to the main chilling unit; the main chilling unit including a housing for housing: an evaporator; a first airlock device to removably secure the main chilling unit to the server rack from a side of the first chamber; a first fan configured to force air from the first chamber to the second chamber; the heat exchanging unit including a housing for housing: a condenser in fluid communication with the evaporator, the condenser being configured to transmit heat from the liquid coolant to air surrounding the condenser; a second airlock device configured to removably secure the heat exchanging unit to the second chamber; a second fan configured to blow the heated air into the second chamber.

Abstract: A circuit interrupter including a current sensor having a normal sensor output and an over current detection output, a solid state switch module structured to have a closed state to allow current to flow through the circuit interrupter and an open state to interrupt current flowing through the circuit interrupter, a gate driver structured to control the solid state switch module including a desaturation function output, wherein the gate driver is structured to cause the solid state switch module to interrupt current flowing through the circuit interrupter when the DESAT function output changes to the on state, and an electronic trip circuit structured to output a tri when the normal sensor output reaches a first threshold level or the overcurrent detection output changes to the on state.

Abstract: This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing.

Abstract: Methods and systems for supporting similar thermal devices may involve collecting, by a thermal module on a management controller of an information handling system, device information about an add-in card, determining whether the add-in card was previously defined by matching the device against a table, searching the table based on the determination that the add-in card was not previously defined, determining whether the add-in card is supported by finding a match in the table, and applying a thermal tier associated with the match in the table based on the determination that the add-in card is supported. The device information collected may involve at least two of a reseller part number, description, device identifier, sub device identifier, vendor identifier, sub vendor identifier, slot identifier, lane width, and auxiliary power indicator. The search of the table may involve at least one of the description, lane width, and sub vendor identifier.

Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, where the second housing includes a fan, an inlet, and actuators, and a hinge, where the hinge rotatably couples the first housing to the second housing. When the first housing is rotated over the inlet, the actuators lower the inlet to create a gap between the inlet and the first housing. In some examples, the inlet includes slats and when the first housing is rotated over the inlet, a distance between each of the slats increases from a first distance to a second distance.

Abstract: An air duct assembly for an axial flow fan including an air inlet shroud and an air outlet shroud. The air inlet shroud includes a plurality of mutually angled air inlet surfaces, and a ratio of an area of the air inlet surfaces of the air inlet shroud to that of air outlet surfaces of the air outlet shroud is 1.1 to 1.35. The air inlet shroud is provided to have mutually angled air inlet surfaces to increase the ratio of the area of the air inlet surfaces of the air inlet shroud to that of the air outlet surfaces of the air outlet shroud, obtaining a higher wind speed with fairly little noise.

Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.

Abstract: An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

Abstract: A semiconductor device includes: a semiconductor substrate; a power device formed in the semiconductor substrate; a metal bilayer formed over the semiconductor substrate, the metal bilayer including a discontinuous metal layer formed on and in contact with a continuous base metal layer; and one or more contact pads formed in the metal bilayer or in a metallization layer above the metal bilayer. The discontinuous metal layer includes a plurality of metal blocks which are laterally spaced apart from one another and which form a heat sink structure over the power device. The continuous base metal layer is configured to laterally spread heat energy from the power device to the plurality of metal blocks. Methods of producing the semiconductor device are also described.

Abstract: A semiconductor arrangement and an inverter incorporating the semiconductor arrangement, in particular to an inverter for use with traction power units e.g. for on and off road vehicles and stationary power inversion, are described. In the arrangement, semiconductor devices are thermally and electrically coupled to a heatsink as a module. The heatsink is configured as a bus bar to electrically connect the one or more semiconductor devices together to transmit power between the one or more semiconductor devices. The semiconductor devices may be cooled using the structure to which they are attached, and also immersed in a cooling medium to further increase the cooling of the device.

Abstract: A device is disclosed that include a first component comprising a rigid assembly shot molded to a flexible assembly, a second component comprising a fan housing and wherein the first component is coupled to the second component and the flexible assembly is disposed between the rigid assembly and the second component.

Abstract: A compressor includes a casing having a cylindrical portion, a compression mechanism fixed to an inner peripheral surface of the cylindrical portion, an external portion, a weld nut, and a bolt. The external portion includes a temperature reaction portion that reacts to a temperature change of the cylindrical portion. The external portion is mounted on an outer peripheral surface of the cylindrical portion. The weld nut is welded to the outer peripheral surface of the cylindrical portion to mount the external portion on the outer peripheral surface of the cylindrical portion. The bolt fixes the external portion to the weld nut.

Abstract: An entertainment system including a removable seat-back display unit and a docking station. The seat-back display unit can include a rotating latch butterfly release mechanism that prevents unauthorized release of the display unit from the docking station. The system can include a three-point attachment system that provides additional protection against accidental detachment of the display unit, and provide safety in the event of partial dislodging. The system can include a current control pin system that ensures that current is not provided from the docking station to the display unit until the respective connectors have been properly engaged. The system can further include a floating pin connector dock that can allow for installation of the display unit even when the connectors of the display unit and docking station become misaligned. The system can also include a heat dissipation system that employs the docking station to share the heat dissipation load with the display unit.

Abstract: A portable electronic device including a body, a door, a carrier and at least one electronic module is provided. The door is movably mounted on the body. The carrier includes a first side and a second side opposite to each other, the first side is pivoted to the body, and the second side is movably pivoted to the door. The electronic module is disposed on the carrier. At least one opening is formed between the door and the body when the door moves away from the body, and the door drives the carrier to rotate relative to the body, such that the electronic module is tilted with respect to the body along with the movement of the door, and the electronic module is exposed to an external environment via the opening for heat dissipation.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable a segmented heatsink. The electronic device can include a printed circuit board, a substrate, where the substrate is over the printed circuit board, at least two heat sources over the substrate, and a segmented heatsink secured to the printed circuit board, where the segmented heatsink has at least two independent heatsink segments, where each heatsink segment corresponds to at least one heat source and is configured to draw heat from the corresponding heat source. In an example, the heat sources are at a different height.

Abstract: A semiconductor memory system having a plurality of semiconductor memory modules that are spaced apart from each other by a gap. The system includes a heat dissipation assembly having a thermally conductive base portion configured to transfer heat away from the memory devices. The heat dissipation assembly including at least one cooling unit extending from the base portion. The at least one cooling unit having a wall with an exterior surface and a cavity. The cooling unit is configured to fit in the gap between adjacent memory modules such that a portion of the exterior surface on a first side of the cooling unit is coupled to one of the first memory devices and another portion of the exterior surface on a second side of the cooling unit is coupled to one of the second memory devices across the gap.

Abstract: In one aspect, luminaires are described herein having sensor modules integrated therein. In one aspect, a luminaire described herein comprises a light emitting face including a LED assembly. A sensor module is integrated into the luminaire at a position at least partially overlapping the light emitting face. In another aspect, a luminaire described herein comprises a LED assembly and a driver assembly. A sensor module is integrated into the luminaire along or more convective air current pathways cooling the LED assembly or driver assembly.

Abstract: A heat radiating member and an electrical junction box are provided that have a simple configuration and are capable of quickly radiating heat generated by a semiconductor device. A support member, which receives heat from a substrate portion having a mounting face on which a semiconductor device is mounted, via an opposing plate portion opposing the mounting face, and radiates the received heat, includes a recessed portion formed in the opposing plate portion, at a position corresponding to the semiconductor device. The recessed portion has a wall thickness that is greater than that of another portion of the opposing plate portion.

Abstract: An apparatus to cool electronics in an autonomous vehicle, where the autonomous vehicle includes significant computing power to receive data from on-board sensor, cellular data and user interactions and to navigate an environment to a predetermined location. The cooling system includes a radiator, fan, pump and cold plate. The cold plate is formed from two plates with extended surfaces that are mated together so that the cavities around the extended surfaces form a flow passage. The electronics processing the data and navigating are mounted on the outside surface of the cold plate.

Abstract: The invention relates to an assembly including: at least one electrical device comprising a first face for being pressed against a surface, at least one pressing member positioned on a second face of the electrical device opposite to the first face, said pressing member being intended to participate in pressing said electrical device on said surface, at least one holding part which holds said pressing member on the second face of said electrical device by being attached around the pressing member on a peripheral portion of the electrical device.

Abstract: A living room convergence device includes a case, a mainboard, a central processor, and a thermal solution. The case includes a bottom portion that includes air intake holes and a top portion that includes air exhaust holes. The thermal solution includes a heatsink sitting atop the mainboard of the living room convergence device, the heatsink to dissipate heat from the central processor. The thermal solution also includes a fan assembly including rotating fan blades and a motor that drives the rotating fan blades, creating a bottom-to-up swirling airflow starting from the air intake holes and exiting through the air exhaust holes.

Abstract: The controlling method uses a control specification. In the method, at least part of the progression of the controlling process is monitored, and at least one quality criterion characterizing the quality of the control method is determined, (e.g., ascertained), in accordance with the progression. The control specification is adjusted in accordance with the quality criterion.

Abstract: A cooling system is provided for power conversion circuitry. An intake section of a cooling air channeling element is arranged to direct cooling air through an enclosure, and through or around system components to circuit board-mounted circuitry to be cooled. The element has internal structures, such as deflectors that create local pockets of lower velocity and/or higher pressure air to trap airborne particles that can be evacuated through apertures (e.g., in adjacent plates or mounting structures). The intake section leads to a distribution section that is positioned adjacent to the circuit components to be cooled. The element may have an open bottom that cooperates with surrounding structures to channel the cooling air, facilitating molding of a single-piece element that can be easily mounted during system assembly.

Abstract: A modular multipurpose telecommunications enclosure has a plurality of walls, to which are removably affixed a plurality of mounting bulkheads. Each mounting bulkhead has a plurality of mounting holes arranged into a specified hole pattern that is configured to receive and mount cameras or other electronics units from various different equipment manufacturers which employ different hole patterns in their mounting kits. The enclosure is made of a high thermal conductivity material such as aluminum to promote convection cooling and employs one or more airflow vents to keep any internal electronics from reaching undesirably high temperatures during operation. The enclosure also features antenna mounting holes to accommodate various wireless communication antennas, as well as a mounting bracket to allow easy installation of the enclosure in a desired location. The enclosure is rugged and durable against the elements to facilitate purposes such as video monitoring of an outdoor area.

Abstract: The present disclosure relates to a power electronic device for a vehicle. The power electronic device includes at least one intermediate unit having at least one fluid duct system fluidically connected to a fluid inlet and a fluid outlet, at least one power electronic unit arranged at least at a surface of the at least one intermediate unit, and at least one heating device arranged at least at a surface of the at least one intermediate unit.

Abstract: An electronic assembly includes a PCB disposed on an end-face of a motor proximate to a first surface thereof and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on the first surface. The TMA includes a cooling jacket disposed around a circumference of the motor, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path therethrough. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.

Abstract: Systems, methods, and computer-readable media are disclosed. An example coolant system can be configured in an autonomous vehicle. The system can include a first coolant loop configured with a first series of coolant hoses to communicate a first volume of coolant fluid between a first reservoir, a first coolant pump, a three-way heat exchanger, and a computer system heat exchanger and a second coolant loop configured with a second series of coolant hoses to communicate a second volume of coolant fluid between a second reservoir, a second coolant pump, the three way heat exchanger, and the computer system heat exchanger. The system can further include a third coolant loop configured with a third series of coolant hoses to communicate third volume of coolant fluid between the three-way heat exchanger and an engine heat exchanger of the vehicle.

Abstract: A method comprises providing a least one semiconductor component, wherein each of the at least one semiconductor component comprises: a semiconductor chip, wherein the semiconductor chip comprises a first main surface and a second main surface opposite the first main surface, and a sacrificial layer arranged above the opposite second main surface of the semiconductor chip. The method further comprises encapsulating the at least one semiconductor component with an encapsulation material. The method further comprises removing the sacrificial material, wherein above each of the at least one semiconductor chip a cutout is formed in the encapsulation material. The method further comprises arranging at least one lid above the at least one cutout, wherein a closed cavity is formed by the at least one cutout and the at least one lid above each of the at least one semiconductor chip.

Abstract: The present disclosure presents a heat exchange plate with slotted airfoil fins for a printed circuit heat exchanger. In the present disclosure, a herringbone streamlined slot is arranged on a fin so that a part of the heat exchange fluid can flow through a channel of the slot and flow out from the tail of the fin. In such a way, the perpendicular hitting on the fin can be prevented, thereby prevent forming of the stagnation area, mitigating phenomenon of substantial flow resistance in this area and, in turn, reducing the pressure drop of channel. Meanwhile, the slotted area could substantially increase the heat exchanging area and thus improve the heat exchanging performance.

Abstract: There are provided an apparatus for heat exchange by using a braided fabric woven from a thermally conductive wire material and a light emitting diode (LED) lighting device. The apparatus comprises a braided fabric (1) woven from a thermally conductive wire material, and a heat dissipating or absorbing object (2) is fixed with the braided fabric (1) by using methods such as welding, adhering with a thermally conductive adhesive and casting, so as to ensure that heat energy is effectively conducted between the heat dissipating or absorbing object (2) and the thermally conductive wire of the braided fabric (1), and heat is dissipated to air or absorbed from air by means of a heat dissipating surface of the thermally conductive wire of the braided fabric (1).

Abstract: The present application provides a heat sink, including: a heat dissipation plate and at least one heat dissipation tube, the heat dissipation tube further including a first tube section. The bent part and a second tube section, with the first tube section of the heat dissipation tube is at least partially embedded in the heat dissipation plate and the second tube section is arranged outside the heat dissipation plate. The first tube section and the second tube section are parallel to each other and connected via the bent part. The heat dissipation tube is provided with at least one cooling fin extending outwards from an outer wall of the heat dissipation tube. In addition, a frequency converter employs the heat sink in an embodiment. The heat sink of at least one embodiment has high heat dissipation efficiency and a small volume.

Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.

Abstract: The present disclosure envisages an arrangement (100) for dissipating heat of a power supply unit (105) in a housing (110). The arrangement (100) comprises at least one packing member (120). The packing member (120) is disposed between the power supply unit (105) and an operative inner wall of the housing (110) to increase conductive thermal contact between inner walls of the housing (110) and the power supply unit (105). The arrangement (100) facilitates maximum surface contact between a power supply unit and inner walls of a housing.

Abstract: An example air management system includes laterally spaced apart rows of electrical equipment that each provide a flow path between two convection regions on opposing sides of the row. A plurality of supply aisles and a plurality of return aisles are interposed between each other. Each supply and return aisle has a respective room portion that includes a respective one of the convection regions, a respective ceiling portion disposed above the room portion, and a vented barrier portion therebetween. Each supply aisle provides airflow downwards from its ceiling portion to its convection region, and each return aisle provides airflow flow upwards from its convection region to its ceiling portion. A plurality of air handling units are located external to the plurality of rows and are configured to utilize the ceiling portions of the supply aisles as supply ducts, and utilize the ceiling portions of the return aisles as return ducts.

Abstract: An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.

Abstract: Systems and methods for controlling air distribution to electronic components are disclosed. According to an aspect, a system includes fans configured to distribute air to a plurality of electronic components. The system also includes a fan controller configured to control the fans based on a form factor and/or a quantity of the electronic components.

Abstract: According to one embodiment, an electronic device according to an embodiment includes, for example, a board, a first electronic component, and a heat dissipation member. The board includes a first face. The heat dissipation member is disposed at a side opposite to the first face of the first electronic component. The heat dissipation member is thermally connected to the first electronic component. The heat dissipation member includes a first extending portion, a second extending portion, and a plurality of third extending portions. The first extending portion extends along the first face. The second extending portion is positioned away, in a direction that intersects the first face, from the first extending portion by a space. The second extending portion extends along the first face. The plurality of the third extending portions are connected to the first extending portion and the second extending portion. The plurality of the third extending portions are positioned away from each other by a space.