HEAT-RADIATING BASE PLATE AND HEAT SINK USING THE SAME
A heat-radiating base plate includes an aluminum-made upper base plate, a copper-made lower base plate, and a heat pipe unit. The upper base plate has a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face. The heat pipe unit is set in the slotted pattern, and has a thickness equal to a depth of the slotted pattern. The heat pipe unit has a first and a second heat-conducting flat face flush with the first and the second face of the upper base plate, respectively. The second face and the second heat-conducting face are attached to the lower base plate, which has another flat face in contact with a heat-producing unit. A radiating fin assembly can be mounted to a top of the heat-radiating base plate to provide a heat sink.
The present invention relates to a heat-radiating base plate, and more particularly to a weight-reduced heat-radiating base plate including an aluminum-made upper base plate formed of a slotted pattern for a heat pipe unit to set therein, and a copper-made lower base plate corresponding to and attached to the upper base plate without losing its flatness. The present invention also relates to a heat sink including a radiating fin assembly mounted to a top of the heat-radiating base plate.
BACKGROUND OF THE INVENTIONWith the rapidly developed information, communication, and photoelectric industries, various highly advanced, lightweight and compact electronic products have been introduced into the market. Due to the demands for high operating speed and miniaturized volume, the electronic elements in the various electronic products produce more heat during the operation thereof to thereby have constantly increased heat density. Therefore, heat dissipation efficiency has become a critical factor in determining the stable operation of the electronic products. Due to the high-efficient heat conducting property thereof, heat pipes and heat spreaders have been widely applied in various electronic products as heat conducting elements. Either the heat pipe or the heat spreader is a closed and vacuumed hollow copper member with a capillary layer sintered on inner wall surfaces thereof. A working fluid is filled in the hollow member. The working fluid at a vaporizing end of the heat pipe or heat spreader absorbs heat produced by a heat-producing source, such as a CPU, and is vaporized. The vapor formed at the heated end is cooled by, for example, radiating fins and cooling fan to condense into liquid at a condensing end. The liquid then flows back to the vaporizing end due to an effect of the capillary force of the capillary layer. Thus, the working fluid continuously circulates in the closed heat pipe or heat spreader.
Taiwanese Patent Application No. 097202791 discloses a heat sink 1 as shown in
In the prior art, when forming the S-shaped channel 111 and the U-shaped channel 112 on the base 11, it is uneasy to control the depth of the S-shaped channel 111 and the U-shaped channel 112 and therefore frequently results in the problem of error in size. Moreover, when machining the first face of the base 11 to form the S-shaped channel 111 and the U-shaped channel 112, stress released therefrom will lead to poor levelness at the second face of the base 11, especially at areas right behind the S-shaped channel 111 and the U-shaped channel 112. As a result, areas on the first face and the second face of the base 11 corresponding to the S-shaped and U-shaped channels 111, 112 fail to flatly bear on the radiating fins 13 and the heat-producing unit, respectively. Furthermore, since a large quantity of copper material is used to manufacture the base 11, the base 11 is usually overweight.
In conclusion, the above-described conventional heat sink 1 has the following shortcomings: (1) being too heavy; (2) consuming too much copper material; (3) having size errors in the channels formed thereon; and (4) having poor levelness at areas immediately behind the formed channels.
It is therefore tried by the inventor to develop an improved heat-radiating base plate to overcome the drawbacks in the conventional heat-radiating base for a heat sink.
SUMMARY OF THE INVENTIONA primary object of the present invention is to provide a heat-radiating base plate that can be more easily manufactured without detriment to the flatness behind areas having been machined to form needed slotted pattern and can therefore ensure good contact of heat pipes set on the heat-radiating base plate with a heat-producing unit and radiating fins.
Another object of the present invention is to provide a heat-radiating base plate that includes an upper base plate made of an aluminum material to reduce an overall weight of the heat-radiating base plate and the use of copper material in forming the heat-radiating base plate.
A further object of the present invention is to provide a heat sink being formed by mounting a radiating fin assembly to a top of the heat-radiating base plate provided by the present invention, so as to enable good heat dissipation.
To achieve the above and other objects, the heat-radiating base plate according to the present invention includes a copper-made lower base plate, at least one aluminum-made upper base plate, and a heat pipe unit. The upper base plate has a first face, a second face opposite to the first face, and at least one slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face. The heat pipe unit is set in the slotted pattern, and has a first heat-conducting face and a second heat-conducting face corresponding to and flush with the first and the second face of the upper base plate, respectively. Preferably, the first and second heat-conducting faces are flat faces.
And, the heat sink according to the present invention includes a radiating fin assembly mounted to a top of the first face of the heat-radiating base plate of the present invention. The radiating fin assembly includes a plurality of stacked and spaced radiating fins. With the heat pipe unit set in the slotted pattern, the first face of the aluminum-made upper base plate attached to the radiating fin assembly, and the second face of the upper base plate attached to the copper-made lower base plate, the heat sink of the present invention can provide enhanced heat dissipation effect.
In brief, with the above arrangements, the present invention has the following advantages: (1) less copper material is used to manufacture the heat-radiating base plate; (2) the problem of overweight heat-radiating base plate caused by using too much copper material is solved; (3) no second-time machining is needed in forming the slotted pattern; and (4) flatness at areas of the lower base plate behind the slotted pattern can be maintained.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
Please refer to
The radiating fin assembly 24 is formed from a plurality of stacked and spaced radiating fins and mounted to the first face 211 of the upper base plate 21 and the first heat-conducting face 231 of the heat pipe unit 23. The second face 212 of the upper base plate 21 and the second heat-conducting face 232 of the heat pipe unit 23 are attached to the heat-transferring face 222 of the lower base plate 22. The contact face 221 of the lower base plate 22 is in contact with the heat-producing unit (not shown).
A plurality of different designs is available for the slotted pattern 213 extended through the upper base plate 21 in the thickness direction to communicate the first face 211 with the second face 212. For example, the slotted pattern 213 can include a plurality of straightly extended and parallelly spaced slots as shown in
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims
1. A heat-radiating base plate, comprising:
- a lower base plate;
- at least one upper base plate being corresponding to and attached to the lower base plate, the upper base plate having a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second faces; and
- a heat pipe unit having at least one heat pipe and being set in the slotted pattern on the upper base plate.
2. The heat-radiating base plate as claimed in claim 1, wherein the heat pipe unit has a first heat-conducting face and a second heat-conducting face corresponding to and flush with the first face and the second face of the upper base plate, respectively.
3. The heat-radiating base plate as claimed in claim 1, wherein the first and the second heat-conducting face of the heat pipe unit are flat faces.
4. The heat-radiating base plate as claimed in claim 1, wherein the slotted pattern is selected from the group consisting of a plurality of straightly extended and parallelly spaced slots, a plurality of obliquely extended and parallelly spaced slots, and a plurality of curved and spaced slots.
5. The heat-radiating base plate as claimed in claim 1, wherein the lower base plate has a contact face for bearing on a heat-producing unit.
6. A heat sink with heat-radiating base plate, comprising:
- a heat-radiating base plate including: a lower base plate; at least one upper base plate being corresponding to and attached to the lower base plate, the upper base plate having a first face, an opposite second face, and a slotted pattern extended through the upper base plate in a thickness direction to communicate the first face with the second face; and a heat pipe unit having at least one heat pipe and being set in the slotted pattern; and
- a radiating fin assembly formed from a plurality of stacked and spaced radiating fins, and the radiating fin assembly being mounted to the first face of the upper base plate.
7. The heat sink with heat-radiating base plate as claimed in claim 6, wherein the heat pipe unit has a first heat-conducting face and a second heat-conducting face, which are corresponding to and flush with the first face and the second face of the upper base plate, respectively.
8. The heat sink with heat-radiating base plate as claimed in claim 6, wherein the slotted pattern is selected from the group consisting of a plurality of straightly extended and parallelly spaced slots, a plurality of obliquely extended and parallelly spaced slots, and a plurality of curved and spaced slots.
9. The heat sink with heat-radiating base plate as claimed in claim 6, wherein the lower base plate has a contact face for bearing on a heat-producing unit.
Type: Application
Filed: Nov 24, 2008
Publication Date: May 27, 2010
Inventor: Li-Ling Chen (Sinjhuang City)
Application Number: 12/276,636
International Classification: F28D 15/00 (20060101);