Utilizing Capillary Attraction Patents (Class 165/104.26)
  • Patent number: 10472984
    Abstract: Apparatus for insertion into a cavity of an object, the apparatus comprising: a first tube comprising a first end, a second end and a first cavity extending between the first end and the second; a member positioned within the first cavity of the first tube and configured to enable an action to be performed; a heat pipe including a first end, a second end, and a second cavity extending between the first end and the second end, the first tube being positioned within the second cavity of the heat pipe; and an actuator configured to move the first tube relative to the heat pipe.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: November 12, 2019
    Assignee: ROLLS-ROYCE plc
    Inventors: Andrew D Norton, Amir Rabani, States Chiwanga
  • Patent number: 10471841
    Abstract: The invention relates to a device for the thermal management of a battery of electric accumulator cells assembled within a rigid casing, said device comprising thermal storage means incorporated into said battery comprising a chamber containing a phase-change material and having a volume for exchange of heat with said accumulator cells which is delimited by at least part of said casing, the melting of the phase-change material being able to store heat, and the solidification of the phase-change material being able to release the heat previously stored. According to the invention, said chamber is equipped at its distal end with an expansion vessel able to absorb the expansions of said phase-change material as it changes phase.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: November 12, 2019
    Assignee: RENAULT s.a.s.
    Inventors: Rany Choufany, Fahri Keretli, Amin El Bakkali, Igor Jovet
  • Patent number: 10458834
    Abstract: A detector probe, for detecting ionizing radiation and which is suitable for use in a nucleonic instrument usable in locations having a high ambient temperature, includes an array of radiation detectors mounted on a support and a heat pipe for cooling the detector probe. The nucleonic instrument incorporating such a detector probe is also described.
    Type: Grant
    Filed: September 5, 2013
    Date of Patent: October 29, 2019
    Assignee: Johnson Matthey Public Limited Company
    Inventors: Paul David Featonby, Timothy Hough, Geoffrey Stuart Howe
  • Patent number: 10458720
    Abstract: A heat transfer device includes a heat pipe in which working fluid is enclosed, a heat receiving plate provided on one end side of the heat pipe and a heat radiating fin provided on the other end side of the heat pipe, a first wick and a second wick that transfer working fluid provided on an inner wall surface of the heat pipe, a bent section bent between the one end side and the other end side, and a boundary section between the first wick and the second wick disposed in a lower part in the gravity direction of the bent section of the heat pipe or the heat transfer device. The heat transfer device can improve heat transfer characteristics with a simple configuration.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: October 29, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tatsuro Miura, Yoshikatsu Inagaki, Hiroshi Okada
  • Patent number: 10458718
    Abstract: An airtight penetration structure for heat dissipation device includes a first plate member, a second plate member, and a plurality of hollow shaft members. The first and the second plate member are closed to each other to together define a closed chamber between them. The hollow shaft members are respectively provided at two free ends with a first and a second flange. The hollow shaft members are correspondingly extended through fastening holes provided on the first and the second plate member with the first and the second flanges attached to and flush with outer surfaces of the first and the second plate member to seal around the fastening holes, so that the closed chamber between the first and the second plate member is in an airtight state.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: October 29, 2019
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Ching-Hang Shen, Fu-Kuei Chang
  • Patent number: 10458719
    Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The intermediate substrate may form narrow channels within the wicking structure, providing high capillary forces to support large pressure differences between the liquid and vapor phases, while minimizing viscous losses of the liquid flowing in the wicking structure.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: October 29, 2019
    Assignee: PiMEMS, Inc.
    Inventors: Payam Bozorgi, Carl Meinhart
  • Patent number: 10462935
    Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: October 29, 2019
    Assignee: Google LLC
    Inventors: Soheil Farshchian, Kenneth Dale Shaul
  • Patent number: 10443950
    Abstract: A method for transferring heat includes: heating an evaporator by a thermal energy source; providing a flow of a mixture of gaseous phases of a first and a second fluid over a steam line into a condenser; providing a flow of the condensed mixture over a liquid line into an accumulation tank; and providing a flow of the condensed mixture from the accumulation tank to the evaporator tank through non-return valves mounted on a return line. The method ensures transferring of a large quantity of thermal energy from a source to a receiver over considerable distances without application of porous capillary materials and additional processes for forced pumping of condensed fluid, regardless of the position of the source and the receiver in the gravity field.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: October 15, 2019
    Inventor: Alexandr Mikhailovich Derevyagin
  • Patent number: 10443951
    Abstract: To provide an evaporator capable of suppressing reduction in heat transport amount while also preventing an increase in the pressure loss of a working fluid. An evaporator comprising a container and a dividing layer adapted to divide the inside of the container into a liquid reservoir chamber and a vapor chamber, wherein the dividing layer includes a heat blocking layer on the liquid reservoir chamber side and a wick layer on the vapor chamber side, a gap is formed between the heat blocking layer and the wick layer, the liquid reservoir chamber and the gap are communicated with each other via a penetration path formed in the heat blocking layer, and a working fluid in the liquid reservoir chamber passes through the penetration path and penetrates into the gap and the wick layer by a capillary force.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: October 15, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuya Kusano, Hiroki Awano, Seiji Yamashita, Manabu Orihashi, Yu Hoshino
  • Patent number: 10448540
    Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: October 15, 2019
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.
    Inventors: Ning Hou, Cong Lei, Biao Li, Ming-Jaan Ho
  • Patent number: 10436520
    Abstract: The plate pulsating heat spreader according to the present disclosure may lower the degree of superheat to thereby allow nucleation to easily occur by including the cavities, thereby preventing a sudden temperature rise of an evaporator and having improved thermal performance. The pulsating heat spreader includes fluid channels and cavities.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: October 8, 2019
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Sung Jin Kim, Wookyoung Kim
  • Patent number: 10429908
    Abstract: Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a housing. The housing includes an inner surface. A portion of the inner surface of the housing has a first emissivity. The computing device also includes a thermal management device positioned within the housing, at a distance from the portion of the inner surface of the housing. The thermal management device includes an outer surface. The outer surface of the thermal management device includes a first portion and a second portion. The first portion of the outer surface of the thermal management device has a second emissivity, and the second portion of the outer surface of the thermal management device has a third emissivity. The second emissivity is greater than the third emissivity, and the first emissivity is substantially the same as the second emissivity.
    Type: Grant
    Filed: March 28, 2016
    Date of Patent: October 1, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Andrew Douglas Delano, Aaron Albert Oro, Kanth Kurumaddali
  • Patent number: 10422300
    Abstract: A radiant heat recovery heater includes U-shaped heat transfer tubes each including a first path and a second path arranged on a mounting section. The U-shaped heat transfer tubes are housed in a container fixed to the mounting section. The first paths and the second paths of the U-shaped heat transfer tubes are arranged on the mounting section at equal intervals with a pitch angle ?. The first paths are each arranged on the mounting section at a position offset from the pitch angle ? for the associated second path by a predetermined angle ?, so as not to completely overlap a projection of that second path, the projection extending from the container toward the center C of the container.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: September 24, 2019
    Assignee: YANMAR CO., LTD.
    Inventor: Jiro Fukudome
  • Patent number: 10423200
    Abstract: Vapor chamber and impeller apparatus and systems for cooling information handling systems and which may be implemented to enable increase in system level airflow and to achieve increased cooling surface for cooling heat generating or heat source components of such systems. In one example, an integrated rotating radial impeller may be mounted to and supported by the vapor chamber, and the vapor chamber apparatus may be coupled to one or more heat pipe extensions and corresponding fin stacks.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: September 24, 2019
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Qinghong He, Timothy C. Shaw
  • Patent number: 10415890
    Abstract: A heat pipe having enhanced heat transport capacity that can be manufactured easily is provided. The heat pipe 1 comprises a sealed container 2 and a wick structure 10. The wick structure includes a first wick 11 formed of copper fibers 11a, and a second wick formed of carbon fibers 12a. The first wick 11 is sintered to be fixed to an inner face 21a of a flat wall 21 while holding the second wick 12 therein.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: September 17, 2019
    Assignee: FUJIKURA, LTD.
    Inventors: Mohammad Shahed Ahamed, Yuji Saito
  • Patent number: 10408447
    Abstract: An evaporator arrangement (1) for evaporating liquid fuel for a mobile fuel-operated heating device, comprising: an evaporator unit (5) for distributing and evaporating liquid fuel; and at least one fuel supply line (6) for delivering liquid fuel to the evaporator unit (5). The evaporator unit (5) has at least one first section (B1) made of a metal wire mesh (8).
    Type: Grant
    Filed: October 26, 2015
    Date of Patent: September 10, 2019
    Assignee: Webasto SE
    Inventors: Klaus Moesl, Bengt Meier, Volodymyr Ilchenko, Michael Poehner
  • Patent number: 10408547
    Abstract: The invention provides a flattened heat pipe whose vapor flowing passage is not clogged and which has an excellent capillary force. The flattened heat pipe has a closed container formed by flattening a tubular container, a plurality of wick structures arrayed within the container in a longitudinal direction so as to form an acute-angled portion where a capillary force is large at least partially within the container, a hollow portion formed of an outer peripheral surface of the wick structure and an inner wall surface of the container and a working fluid sealed into the container.
    Type: Grant
    Filed: October 9, 2015
    Date of Patent: September 10, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hideaki Kameoka, Masanobu Sugimura, Tatsuro Miura, Yasumi Sasaki, Hiroshi Okada, Shinichi Furumoto, Masaaki Yamamoto
  • Patent number: 10378828
    Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.
    Type: Grant
    Filed: February 11, 2017
    Date of Patent: August 13, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Tzu-Wei Gu
  • Patent number: 10371468
    Abstract: A microchannel heat pipe formed on a substrate surface using co-extruding a primary material and a secondary material such that the primary material forms side wall portions that are spaced apart by the secondary material, and an upper wall portion is formed across the upper ends of the side walls to form a composite structure. After the primary material hardens, the secondary material is removed, whereby the hardened primary material forms a pipe body having an elongated central channel defined between opposing end openings. A working fluid is then inserted into the elongated central channel, and sealing structures are then formed over both end openings to encapsulate the working fluid.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: August 6, 2019
    Assignee: Palo Alto Research Center Incorporated
    Inventors: David Eric Schwartz, Ranjeet Balakrishna Rao
  • Patent number: 10366937
    Abstract: A cooling device includes an aluminum heat sink and at least one nickel sheet segment. The nickel sheet segment is connected to the aluminum heat sink by a solder layer. The cooling device includes a securing surface for securing and for heat absorption. The securing surface being formed by that side of the nickel sheet segment which faces away from aluminum heat sink. The aluminum heat sink is formed from a plurality of aluminum sheets which are stacked one above another and are connected to one another. At least one aluminum sheet includes cutouts which form a cooling channel covered by at least one of the aluminum sheets. Furthermore, a method for producing a cooling device and also a power circuit comprising a heat sink as described here are presented.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: July 30, 2019
    Assignee: CPT Group GmbH
    Inventors: Arnoud Smit, Thomas Schmid, Lars Keller, Soeren Rittstieg
  • Patent number: 10365046
    Abstract: Embodiments of the present disclosure describe servers having thermal management features and thermal management systems for servers. These embodiments include heat sinks to be thermally coupled by one or more heat pipes to transfer heat from hotter downstream heat sinks to cooler upstream heat sinks in order to distribute thermal loading across multiple devices. In one embodiment a single heat pipe may be used to thermally couple two heat sinks, whereas in other embodiments a modular heat pipe arrangement may be used. Techniques for thermally coupling modular heat pipes to one another such that vapor sections of adjacent heat pipes overlap are also disclosed. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: July 30, 2019
    Assignee: Intel Corporation
    Inventors: Henry C. Bosak, Anthony K. Wong
  • Patent number: 10356945
    Abstract: In accordance with one aspect of the invention, a thermal management system for electronics includes a vapor chamber that at least partially envelops the electronics, a working fluid contained within the vapor chamber and used to dissipate heat from a part of a heated portion of the electronics and a precision sintered 3D wick structure independently created on some of the interior of the vapor chamber. The precision sintered 3D wick structure transports the working fluid by capillary action from at least one working fluid receptacle to a part of the heated portion of the electronics. In one embodiment of the invention, the 3D vapor chamber may be formed by the additive manufacturing processes. A further example includes precision sintered 3D support structures integrated into the closed 3D vapor chamber.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: July 16, 2019
    Assignee: General Electric Company
    Inventors: Brian Rush, James William Sears
  • Patent number: 10349556
    Abstract: A cooling device includes: a heat receiver configured to transfer heat from a heat generation body to a refrigerant, a heat radiator that is connected to the heat receiver via a heat radiation path, and a return path that connects the heat radiator and the heat receiver with each other, in which the refrigerant is to circulate in order of the heat receiver, the heat radiation path, the heat radiator, and the return path and cause a gas-liquid two-phase change and cool the heat generation body, and in which the heat receiver includes a heat receiving plate which is in contact with the heat generation body and is configured to absorb the heat, and a heat receiving cover which covers a surface of the heat receiving plate and defines a heat receiving space.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: July 9, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Kaoru Satou, Ayaka Suzuki
  • Patent number: 10340075
    Abstract: The present disclosure relates to a tank of a high-voltage generator including a tank body and a tank lid. There is an opening in the tank lid. The opening is connected to the bellows so as to counteract the volume change of the transformer oil and avoid generation of bubbles. The tank includes a positive transformer, a negative transformer, a bellows, and other components. The high-voltage winding is embedded in the PCBs. The outer insulating bushing is covered by the PCBs so as to improve the insulativity between the turns of the high-voltage winding. In addition, oil barriers may be placed between the positive and the negative transformers, or between the transformers and the ground so as to eliminate the bridge breakdown effect and make the electric field uniform. By means of said measures, the present disclosure improves the stability of the high-voltage generator.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: July 2, 2019
    Assignee: SHANGHAI UNITED IMAGING HEALTHCARE CO., LTD.
    Inventors: Yunhua Zhang, Jieyong Meng, Qingchang Chen, Yihong Liu, Shilin Shen
  • Patent number: 10329024
    Abstract: A heater of a piece of aeronautic equipment is intended to be arranged at the skin of an aircraft. The equipment includes a part intended to be arranged at the skin of the aircraft and elements for heating the part. The heating element include a thermodynamic loop including a closed circuit in which a heat transfer fluid circulates, the closed circuit including an evaporator and a zone in which a condensation of the heat transfer fluid can occur in the appendage to heat it. Outside the evaporator, the circuit in which the fluid circulates is formed by a tubular channel with an empty section. At least part of the equipment is made from a material with a low heat conductivity.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: June 25, 2019
    Assignee: THALES
    Inventors: Romain Hodot, Claude Sarno, Frederic Martin, Jean-Philippe Pineau
  • Patent number: 10330392
    Abstract: A three-dimensional heat transfer device includes a vapor chamber comprising a chamber body and a first capillary structure, and the first capillary structure being disposed in the chamber body; and a heat pipe comprising a pipe body and a second capillary structure, and the second capillary structure being disposed in the pipe body. The first capillary structure is connected to the second capillary structure by metallic bonding.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 25, 2019
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Lei-Lei Liu, Xiao-Min Zhang
  • Patent number: 10323884
    Abstract: A heat exchanger according to the present invention comprises: a plate-shaped body having an interior space in which a working fluid is vaporized or condensed and flows; and a wick located within the body, the wick comprising a plurality of needle-shaped particles between which the working fluid flows. By forming a wick comprising needle-shaped particles, the heat exchanger according to the embodiments of the present invention can improve the porosity of the wick compared to conventional groove or mesh-shaped or sintered wicks. Accordingly, the working fluid is capable of flowing inside the wick more smoothly than in the conventional wicks, thereby improving a heat exchange rate or heat exchange performance.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: June 18, 2019
    Assignees: LG ELECTRONICS INC., C3 CO., LTD.
    Inventors: Youngjoo Yee, Kyungkyoo Chang, Heeseok Jung, Chungguk Lee
  • Patent number: 10317067
    Abstract: Provided is a heat radiating apparatus for radiating heat of a heat source in air. The heat radiating apparatus includes a support member in close contact with the heat source on a first principal surface side, a heat pipe supported by the support member, and a plurality of heat radiating fins in a space that faces a second principal surface to radiate the heat transferred by the heat pipe. The heat pipe has a first line part thermally joined with the support member, a second line part thermally joined with the heat radiating fins, and a connecting part. A plurality of heat radiating apparatuses can be connected such that the first principal surfaces are successive, and each of the plurality of heat radiating apparatuses has a receiving part for receiving the connecting parts of adjacent heat radiating apparatuses in the space that faces the second principal surface.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: June 11, 2019
    Assignee: HOYA CANDEO OPTRONICS CORPORATION
    Inventor: Hiroaki Watanabe
  • Patent number: 10321603
    Abstract: A system for two-phase immersion cooling includes an immersion tank, and a plurality of busbars, each busbar extending through a wall of the immersion tank. The system also includes a plurality of voltage converters mounted on a skid, on which the immersion tank can also be mounted. The system preferably includes means for preventing leakage of dielectric fluid around the busbars and means for connecting each busbar plate to the modular cases holding circuit boards that can be inserted into the immersion tank.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: June 11, 2019
    Inventors: Abhishek Banerjee, Jon Benson
  • Patent number: 10321605
    Abstract: A heat sink assembly is provided herein. The heat sink assembly includes at least two heat sinks, a mechanical support member, and a flexible heat pipe. Each of the at least two heat sinks are formed to mate with one of at least two processors. The mechanical support member are formed to mechanically engage with the at least two heat sinks. The flexible heat pipe connects to the at least two heat sinks to provide a thermal link therebetween.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: June 11, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventor: John Norton
  • Patent number: 10302367
    Abstract: A non-metallic vapor chamber includes a composite wick structure that fills a non-metallic housing. The composite wick structure provides mechanical strength and structural rigidity to the non-metallic vapor chamber. The composite wick structure includes a first hydrophilic wick portion and a second hydrophobic wick portion. A condensed working fluid flows through the first hydrophilic wick portion from a condensation region to a region proximate one or more thermal energy producing devices. A vaporized working fluid flows through the second hydrophobic wick portion from the region proximate one or more thermal energy producing devices to a condensation region where the vaporized working fluid is condensed for reuse.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: May 28, 2019
    Assignee: Intel Corporation
    Inventor: Mark MacDonald
  • Patent number: 10295270
    Abstract: A heat pipe includes one or more reservoirs of liquid that are closed at lower temperatures and open at higher temperatures. The opening of the reservoirs at higher temperatures caused by higher power levels dynamically increases the amount of liquid in the heat pipe, which increases performance of the heat pipe at higher power levels. As the heat pipe cools, the liquid condenses and flows back into the reservoirs. As the heat pipe continues to cool, the reservoirs close. The result is a heat pipe that is more efficient at lower power levels and still maintains high efficiency at higher power levels due to the demand-based charging of the liquid based on temperature.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: May 21, 2019
    Assignee: International Business Machines Corporation
    Inventors: William J. Anderl, Bret P. Elison, Phillip V. Mann, Arvind K. Sinha
  • Patent number: 10295269
    Abstract: A flat heat pipe with a two-phase liquid-vapor working fluid, includes a first plate receiving thermal energy from a heat source, a second plate transferring thermal energy to a cold source, an edge to form a hermetically sealed enclosed internal space, a capillary structure interposed between the first and second plates, vaporization channels adjacent to the first plate, condensation channels adjacent to the second plate, a transfer passage placing the evaporation channels in communication with the condensation channels for the transport of vapor, and a collection channel forming a reservoir, in fluid communication with each condensation channel. The collection channel is adjacent to the second plate, such that the collection channel can pump and store the excess liquid phase.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: May 21, 2019
    Assignee: EURO HEAT PIPES
    Inventors: Mikael Mohaupt, Stéphane Van Oost
  • Patent number: 10281807
    Abstract: A projector includes a casing, an optical engine module, and a heat dissipation module. The optical engine module is disposed in the casing. The heat dissipation module is disposed in the casing and includes a heat dissipation fin set. The heat dissipation fin set includes at least one heat dissipation fin and at least one turbulent structure. The heat dissipation fin has a surface. The surface includes a first turbulent region and a second turbulent region. The first turbulent region is adjacent to the second turbulent region. The turbulent structure is disposed at least one of the first turbulent region and the second turbulent region, and the turbulent structure protrudes from the surface. An opening is formed between a top end of the turbulent structure and the surface.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: May 7, 2019
    Assignee: Coretronic Corporation
    Inventors: Chi-Chuan Wang, Yung-Ming Li, Tsung-Ching Lin, Jhih-Hao Chen, Wei-Chi Liu, Shi-Wen Lin
  • Patent number: 10275002
    Abstract: A thermal transfer system includes an enclosure, optional thermal insulation inside the enclosure, a dielectric fluid inside the enclosure, and a porous medium inside the enclosure. The porous medium can be at least partially immersed in the dielectric fluid. A cooling device can have a first surface contacting an interior surface of the enclosure and a second surface contacting the dielectric fluid, the porous medium, or both. The porous medium can include a cutout or cavity configured to support an electrical or electronic device immersed in the dielectric fluid. A port can be in a wall of the enclosure and a set of electrical conductors can run through the port and the electrical or electronic device immersed in the dielectric fluid.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: April 30, 2019
    Assignee: Prepared for Flight LLC
    Inventor: Edward Wyrwas
  • Patent number: 10264707
    Abstract: Disclosed is a flat plate pulsating heat pipe (FP-PHP) serving as a power-free high efficiency heat transfer system for small electronic devices such as mobile phones and laptop computers. The FP-PHP is manufactured using MEMS technology and configured to have a single-turn loop or a multi-turn loop, each having a single diameter channel or a dual diameter channel. Further, since a working fluid used in a flat plate pulsating heat pipe exhibits different characteristics according to the main working temperature, provided is a flat plate pulsating heat pipe which includes a working fluid having optimum efficiency in the main working temperature.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: April 16, 2019
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Sung Jin Kim, Gi Hwan Kwon
  • Patent number: 10264703
    Abstract: A heat dissipating structure generally utilized in a telecommunication product includes a plurality of PCB modules, a metal framework, a top lid, and a perforated panel. The heat dissipating structure is generally utilized in a telecommunication product. The plurality of PCB modules are coupled in series and configured to form a chassis. The metal framework is housed within the chassis and forms an internal chamber. The top lid is disposed at a top side of the heat dissipating structure. The perforated panel is disposed below the top lid and over the internal chamber. The perforated panel includes a plurality of ventilation holes. The internal chamber cooperates with the plurality of ventilation holes to dissipate heat.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: April 16, 2019
    Assignee: Hitron Technologies Inc.
    Inventor: Hui-Liang Chen
  • Patent number: 10253832
    Abstract: Brake disks with integrated heat sink are provided. Brake disk includes a fiber-reinforced composite material and an encapsulated heat sink material impregnated into the fiber-reinforced composite material. The encapsulated heat sink material comprises a heat sink material encapsulated within a silicon-containing encapsulation layer. Methods for manufacturing the brake disk with integrated heat sink and methods for producing the encapsulated heat sink material are also provided.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: April 9, 2019
    Assignee: GOODRICH CORPORATION
    Inventors: Susanne M. Opalka, Georgios S. Zafiris, Weina Li
  • Patent number: 10247489
    Abstract: A heat sink structure is provided having fins mechanically altered dynamically to change and optimize the heat sink's performance based on certain environmental conditions. Specifically, the shape of fins of the heat sink structure is dynamically altered in response to environmental conditions that indicate the need for increased thermal performance by spreading the fins through a mechanical device dynamically, or by collapsing the fins to reduce pressure drop across a region when increased thermal performance is not needed.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: April 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Bjorn J. Ahbel, Wiren D. Becker, Marc H. Coq, Milnes P. David, Ryan N. Elsasser, Syed F. Hossain
  • Patent number: 10247485
    Abstract: A pipe member is provided that is capable of configuring a heat pipe that can be installed with a high flexibility in accordance with the state of the installation place. A heat pipe configured by using such a pipe member, and a cooling device are also provided. The pipe member includes: an arbitrarily bendable pipe main body whose both ends are closed when used for the heat pipe; a partition wall extended in an axial direction of the pipe main body to partition the inside of the pipe main body into four passages each being utilized as a flow path of the working fluid; and connection paths which allow neighboring passages to communicate with each other out of the four passages.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: April 2, 2019
    Assignee: Marusan Electronics Co., Ltd.
    Inventor: Takahiro Koda
  • Patent number: 10225959
    Abstract: A thermosiphon system includes a condenser and an evaporator fluidly coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: March 5, 2019
    Assignee: Google LLC
    Inventors: Jeremy Rice, Bill Dailey, Jeffrey S. Spaulding
  • Patent number: 10215501
    Abstract: A thermally actuated heat pipe control valve which includes a housing having a first opening for receiving a condenser portion of a heat pipe therein, a second opening for receiving an evaporator portion of the heat pipe therein and a passage extending through the housing from the first opening to the second opening. The passage is configured to receive working fluid from the heat pipe therein. A passage closing member is positioned in the housing proximate to or in the passage. The passage closing member having a surface which cooperates with a wall of the passage. At a specific temperature, the passage closing member moves into the passage to a closed position, preventing the flow of the working fluid, thereby preventing heat transfer between the condenser portion and the evaporator portion when the design temperature is reached or exceeded.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: February 26, 2019
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Daniel T. Reist, Greg Troszak, Peter Dussinger
  • Patent number: 10211125
    Abstract: Various embodiments of the disclosure are directed to vapor chambers with a structure that permits configurable mounting holes. Such vapor chambers may have a top plate with apertures and a bottom plate with apertures. Spacers are inserted into the apertures and disposed between the top plate and the bottom plate. Each spacer may have their own aperture that extends throughout the spacer which acts as the mounting hole in the assembled vapor chamber. The various dimensions of the spacers can be configured and selected in order to accommodate varying dimensions of the apertures in the top plate and the bottom plate. These spacers can be used to provide mounting holes of a desired size and provide additional structure support to the vapor chamber. The spacers also lie flush with the top and bottom plates which increases the surface area of the vapor chamber and improves the mounting of the vapor chamber to other structures.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: February 19, 2019
    Assignee: HEATSCAPE.COM, INC.
    Inventors: Ali Mira, Yashar Mira, Michael Mira
  • Patent number: 10200187
    Abstract: In an optical communications system, the thermal pathway for dissipating heat generated by clock and data recovery (CDR) circuitry of an optical communications module is a separate from the thermal pathway that is used to dissipate heat generated by other components of the module. The CDR circuitry is external to the module and is provided with its own heat dissipation device. Keeping the CDR circuitry external to the module and providing it with its own heat dissipation device decouples the thermal pathway for dissipating heat generated by the CDR circuitry from the thermal pathways used for dissipating heat generated by other components of the module. This results in more effective heat dissipation and better component performance.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: February 5, 2019
    Assignee: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
    Inventors: Hui Xu, Sanjeev Gupta, Bob Ritter
  • Patent number: 10184729
    Abstract: A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: January 22, 2019
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yoshikatsu Inagaki, Kenya Kawabata, Tatsuro Miura, Tomoki Yanagida
  • Patent number: 10151542
    Abstract: According to an embodiment of the disclosure, an encapsulated phase change material (PCM) heat sink is provided. The encapsulated PCM heat sink includes a lower shell, an upper shell, an encapsulated phase change material, and an internal matrix. The internal matrix includes a space that is configured to receive the encapsulated phase change material. Thermal energy is transferrable between the encapsulated phase change material and at least one of the lower shell and the upper shell. For a particular embodiment, the upper shell is coupled to the lower shell at room temperature and room pressure.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: December 11, 2018
    Assignee: Raytheon Company
    Inventor: Adam C. Wood
  • Patent number: 10149408
    Abstract: A liquid immersion bath for an electronic device includes: a bath body that is capable of housing the electronic device, is coupled to a circulation path through which a liquid coolant which cools the electronic device immersed in the liquid coolant circulates, and includes a gas phase portion corresponding to a space free from the liquid coolant; and a container that is disposed in the gas phase portion and has a volume which changes in accordance with a pressure of the gas phase portion, wherein an inside of the container is coupled to an outside of the bath body.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: December 4, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Shinnosuke Fujiwara, Hideo Kubo
  • Patent number: 10144534
    Abstract: Disclosed is a spacecraft including:—a housing defining an inner space and an outer space, the housing having a first surface and a second surface opposite the first surface; a first radiator and a second radiator supported by the first surface and the second surface, respectively, the first radiator and the second radiator each having a main inner surface, a main outer surface opposite the main inner surface and side surfaces. The spacecraft further includes a first auxiliary radiator and a first auxiliary heat-transfer device thermally connecting the first auxiliary radiator to the main inner surface of the second radiator, the first auxiliary radiator being arranged in a first portion of the outer space, the first portion being defined by the main outer surface of the first radiator and by the first planes containing the side surfaces of the first radiator.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: December 4, 2018
    Assignee: AIRBUS DEFENCE AND SPACE SAS
    Inventor: Fabrice Mena
  • Patent number: 10119767
    Abstract: A thermal management loop system may include an accumulator, an evaporator in fluid receiving communication with the accumulator, a condenser in fluid receiving communication with the evaporator, and a membrane separator in fluid receiving communication with the condenser. Gas exiting the membrane separator may recirculate back to the condenser and liquid exiting the membrane separator may flow to the accumulator. The thermal management loop system may be a dual-mode system and thus may be operable in a powered-pump mode or a passive-capillary mode.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: November 6, 2018
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Gary A. Adamson, Wei-Lin Cho
  • Patent number: 10107558
    Abstract: A thermal module includes a housing having multiple independent compartments not in communication with each other. Each compartment communicates with an open end of at least one heat pipe. The open end communicates with a heat pipe chamber in the heat pipe, whereby the independent compartments communicate with the heat pipe chambers.
    Type: Grant
    Filed: September 2, 2013
    Date of Patent: October 23, 2018
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Hsiu-Wei Yang