Utilizing Capillary Attraction Patents (Class 165/104.26)
  • Patent number: 10962215
    Abstract: The present application relates to an active radiator with omnidirectional air convection and a stage lighting fixture using the same. The active radiator includes a radiator body provided with heat dissipation channels and a heat transfer assembly which is at least partially transversely arranged inside the radiator body and in form of an integrity therewith. The present application of simple structure and convenient in use can achieve efficient heat dissipation through omnidirectional active heat dissipation of the stage lighting fixture, and can also reduce overall costs and is easy to install.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: March 30, 2021
    Inventor: Weikai Jiang
  • Patent number: 10950603
    Abstract: A process for manufacturing a semiconductor device and the resulting structure are presented. In an embodiment a source/drain region is grown. Once grown, the source/drain region is reshaped in order to remove facets. The reshaping may be performed using an etching process whereby a lateral etch rate of the source/drain region is larger than a vertical etch rate of the source/drain region.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: March 16, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Chieh Chang, Cheng-Han Lee, Yi-Min Huang
  • Patent number: 10948238
    Abstract: Methods, systems, and device for two-phase thermal management are provided in accordance with various embodiments. For example, some embodiments include a two-phase thermal management device that may include: a liquid chamber; one or more inlets configured to deliver a liquid to the liquid chamber; an evaporator chamber; a capillary layer positioned within the evaporator chamber and configured to spread the liquid from the liquid chamber; a liquid manifold configured to deliver the liquid from the liquid chamber to at least the capillary layer or the evaporator chamber; and/or one or more outlets configured to remove at least a vapor or a portion of the liquid from the evaporator chamber. Some embodiments that may include a two-phase thermal management device coupled with at least: a heat exchanger, a pump, a heat recuperator, a pre-heater, and/or a variable volume reservoir. Some embodiments include a two-phase thermal management method.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: March 16, 2021
    Assignee: Roccor, LLC
    Inventors: Michael Hulse, Steven Isaacs, Mark Lake, Greg Shoukas, Diego Arias, Mario Saldana
  • Patent number: 10944123
    Abstract: Described herein are systems and methods for the generation of electric current and/or electric potential utilizing micro- or nano-channels and capillary flow, including fluidic or microfluidic batteries and electrochemical cells. The provided systems and methods use capillary force to promote fluid flow through micro- and nano-fluidic channels by evaporating fluid at one terminus of the channel, and the resulting fluid flow generates electric potential and or current. Advantageously, the described systems and methods remove the need for pressurized vessels or external pumps, increasing net energy generation and decreasing complexity and size of potential fluidic batteries.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: March 9, 2021
    Assignee: UNIVERSITY OF WYOMING
    Inventor: Debashis Dutta
  • Patent number: 10935326
    Abstract: A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: March 2, 2021
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Te-Hsuan Chin, Lei-Lei Liu
  • Patent number: 10935325
    Abstract: A vapor-chamber that includes a porous microstructure sheet with varying surface energy across different regions to optimize utilization of a working fluid. Modulating the surface energy of the porous microstructure sheet can minimize the amount of the working fluid that becomes trapped in the condenser region(s) and maximize an aggregate thin-film evaporation area of the working fluid in the evaporator region(s). The condenser region of the vapor-chamber is treated so that the internal surfaces have low surface energy. For example, the treatment may cause the condenser region to become hydrophobic to minimize the amount of fluid that becomes trapped in the condenser. The evaporator region is treated so that the internal surfaces have high surface energy. For example, the treatment may cause the evaporator region to become hydrophilic to induce the formation of large numbers of robust (e.g., dry-out resistant) thin-film evaporation sites.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: March 2, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Shahar Ben-Menahem, Tzu-Yuan Lin, Michael Nikkhoo
  • Patent number: 10921063
    Abstract: A heat dissipation unit includes a main body and a mesh body. The main body has an upper plate and a lower plate. The upper and lower plates are correspondingly overlapped and mated with each other to together define an airtight chamber. A working fluid is contained in the airtight chamber. One face of the lower plate, which faces the airtight chamber, is formed with a capillary structure by means of laser processing. The mesh body is attached to the face of the lower plate with the capillary structure. By means of the mesh body, the liquid working fluid backflow efficiency of the capillary structure can be enhanced and the water content of the internal evaporation section of the heat dissipation unit can be increased to avoid dry burn.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: February 16, 2021
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Yu-Min Lin
  • Patent number: 10917994
    Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: February 9, 2021
    Assignee: Intel Corporation
    Inventors: Sumita Basu, Shantanu D. Kulkarni, Prosenjit Ghosh, Konstantin I. Kouliachev
  • Patent number: 10890382
    Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: January 12, 2021
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Kuei-Feng Chiang, Chih-Yeh Lin
  • Patent number: 10883769
    Abstract: A heat pipe (10) for cooling an electronic device, especially a component carrier (100), that comprises a central section (13) with a cavity (12) filled with a heat transfer fluid (20). In longitudinal direction (11) of the heat pipe (10) directly connected with the central section (13) are a first end section (14) on a first end of the central section and a second end section (15) on the opposite second end of the central section, wherein the first end section and the second end section each comprise a landing structure (17) with a surface length (SL, SL1, SL2) and a surface width (SW, SW1, SW2) and wherein each landing structure is thermoconductively coupled with the central section of the heat pipe. A component carrier comprising at least one heat pipe for cooling it, and a method for producing the component carrier are also provided.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: January 5, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Jonathan Silvano de Sousa, Bernhard Reitmaier, Michael Polic, Gerhard Maringer
  • Patent number: 10882761
    Abstract: An apparatus, system and method to remove purified vapor from a contaminated fluid using energy. The apparatus comprises an inlet wherein contaminated fluid flows in the apparatus through the inlet; at least two outlets wherein a first outlet exits purified vapor and a second outlet wherein contaminated fluid with a portion removed as purified vapor exits the apparatus; an energy source that causes the contaminated fluid to heat to a temperature wherein at least a portion of the contaminated fluid is converted to purified vapor; at least two different flow paths from at least one inlet to the first outlet and second outlet, the first and second flow paths flow through at least a portion of the apparatus wherein differences causes the lighter purified vapor to take a different path than the heavier contaminated with the purified vapor exiting the first outlet and the contaminated fluid exiting the second outlet.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: January 5, 2021
    Assignee: Katz Water Tech, LLC
    Inventor: Gary P. Katz
  • Patent number: 10876798
    Abstract: A heat pipe device includes an outer pipe and at least one first capillary structure. The outer pipe is a hollow pipe and has a defined lengthwise direction, and the first capillary structure is accommodated along the lengthwise direction and positioned in the outer pipe, and at least one steam channel is formed between the first capillary structure and the outer pipe. Even if the heat pipe device is upside down, the heat pipe still can resist gravity and work normally to achieve the effect of using the heat pipe without being limited by the using direction.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: December 29, 2020
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Tzu-Wei Gu
  • Patent number: 10875170
    Abstract: In an electric power tool 1 including a motor 20, a cooling fan 24 for cooling the motor 20, a plurality of intake ports 11a through which outside air is introduced by use of said cooling fan 24, and a heating element 50 That generates heat, a heat sink 40 is disposed between the motor 20 and the intake port 11a. The heating element 50 is connected to the heat sink 40 through a heat pipe 30.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: December 29, 2020
    Assignee: MAKITA CORPORATION
    Inventor: Fumitoshi Numata
  • Patent number: 10879053
    Abstract: A baseplate for a temperature controlled substrate support assembly in a vacuum chamber includes a single cavity in an upper surface of the base plate. A cylindrical wall extends upward around an outer perimeter of the base plate to define the cavity. A cover plate arranged on the base plate above the cavity is in thermal contact with the cylindrical wall of the base plate. A plurality of thermoelectric modules is arranged within the cavity in the upper surface of the base plate in thermal contact with the cover plate and the base plate and is sealed from the vacuum chamber and maintained at atmospheric pressure. A plurality of fluid channels is arranged within the base plate below the cavity. A plurality of heat transfer pipes extends downward toward the fluid channels from an upper surface of the base plate within the cavity.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: December 29, 2020
    Assignee: Lam Research Corporation
    Inventors: Anthony Ricci, Henry Povolny
  • Patent number: 10859323
    Abstract: A vapor chamber has upper and lower casings and a wick structure therebetween. The upper and lower casings have upper and lower heat exchange chamber areas having multiple upper and lower surface features thereon, separated by multiple upper and lower vapor areas therebetween, respectively. The upper and lower heat exchange chamber areas are surrounded by walls, having flat rims, respectively. The height of the upper surface features is greater than the height of the lower surface features, whereby a top surface of the wick structure lies flush with the lower flat rim. The upper and lower heat exchange chamber areas form a vacuum chamber. An airtight sealed connection is formed at the flat rims of the surrounding walls of the upper and lower heat exchange chamber areas.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: December 8, 2020
    Assignee: Cooler Master Co., Ltd.
    Inventor: Jen-Chih Cheng
  • Patent number: 10859319
    Abstract: A loop heat pipe includes an evaporator to vaporize a working fluid, a condenser to liquefy the working fluid, a liquid pipe to connect the evaporator and the condenser, a porous body provided inside a flow passage in which the working fluid or vapor thereof flows, and a vapor pipe to connect the evaporator and the condenser and form a loop-shaped passage together with the liquid pipe. The porous body includes a metal layer including a first bottomed hole that caves in from a first surface thereof, a second bottomed hole that caves in from a second surface thereof, opposite to the first surface, and a pore formed by and partially communicating the first and second bottomed holes. An inner wall surface of each of the first and second bottomed holes formed in the porous body has a concave shape formed by a curved surface.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 8, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 10845127
    Abstract: A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: November 24, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
    Inventors: Kensuke Aoki, Takuya Hongo
  • Patent number: 10837712
    Abstract: A heat pipe device comprising at least two of the following: an axially grooved bore for thermal transport, the axially grooved bore having an axial groove wick; a phase change material bore for thermal storage, the phase change material bore having internal fins to enhance heat transfer, the internal fins extend along the axis of the phase change material bore; and a porous media bore for accepting high heat fluxes, the porous media bore having a porous media wick in areas of high heat flux.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: November 17, 2020
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Michael Dechristopher, William G. Anderson, Jens E. Weyant, Calin Tarau, Andrew J. Slippey
  • Patent number: 10820454
    Abstract: A vapor chamber heat spreader includes a condenser arranged at a top end of the vapor chamber heat spreader, an evaporator arranged at an opposite end to the condenser; and multi-level wick structures. The multi-level structures include a first planar wick arranged adjacent to the condenser, a second planar wick arranged adjacent to the evaporator, a plurality of condenser posts for supplying liquid condensed by the condenser, a plurality of evaporator posts for supply the liquid towards the evaporator, and a mesh layer. The mesh layer is arranged between the condenser posts and the evaporator posts and configured to separate the condenser posts from the evaporator posts. The mesh layer includes a plurality of vent holes. The mesh layer is a porous layer having high permeability.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: October 27, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh N. Joshi, Feng Zhou
  • Patent number: 10813239
    Abstract: A cooling arrangement may include a fluid-tight housing in which a power electronics system and a dielectric fluid for cooling the power electronics system may be arranged. The dielectric fluid may be in heat-transferring contact with the power electronics system and may cool the power electronics system via a fluid movement. The fluid movement may be provided via acceleration forces acting on the cooling arrangement.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: October 20, 2020
    Assignee: MAHLE INTERNATIONAL GMBH
    Inventors: Matthias Ganz, Jessica Kansy, Thomas Kalmbach, Michael Trebbe
  • Patent number: 10813251
    Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: October 20, 2020
    Assignee: PiMEMS, Inc.
    Inventor: Payam Bozorgi
  • Patent number: 10806051
    Abstract: A heat sink allowing a reduced thickness of an electronic device includes a housing, a wick structure, and a heat transfer fluid. The housing, comprising an upper housing and a lower housing, are opposite and form a sealed cavity. The wick structure and the heat transfer fluid are received in the cavity, the liquid absorbing heat and becoming gaseous upon reaching a certain temperature. The area of the upper housing is larger than the area of the lower housing. The upper housing forms a protrusion with respect to an edge of the lower housing. An electronic device using the heat sink is also provided.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: October 13, 2020
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventor: Yu-Wei Chang
  • Patent number: 10794635
    Abstract: A heat pipe has a flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container, wherein in at least one cross section of the flat container, the wick structure contacts both of the pair of flat inner surfaces of the flat container, and both side faces of the wick structure do not contact any of the inner surfaces of the flat container, wherein the wick structure has a first wick part and a second wick part, respectively disposed in the lengthwise direction of the flat container, the second wick part being directly or indirectly connected to the first wick part and having a maximum width that is wider than a maximum width of the first wick part, and wherein the second wick part is disposed in the heat receiving portion of the heat pipe.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: October 6, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Yasumi Sasaki
  • Patent number: 10792586
    Abstract: An apparatus and process doubles the number of trays in a single fractionation column. A dividing wall is used to isolate a first side from a second side and fractionation on trays on each side is independent of the other. A transition vapor stream is ducted from a top of a first side to the bottom of the second side, and a transition liquid stream is ducted from a bottom of the second side to the top of the first side.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: October 6, 2020
    Assignee: UOP LLC
    Inventors: Brian J. Nowak, Kevin J. Richardson
  • Patent number: 10792585
    Abstract: An apparatus and process doubles the number of trays in a single fractionation column. A dividing wall is used to isolate a first side from a second side and fractionation on trays on each side is independent of the other. A transition vapor stream is ducted from a top of a first side to the bottom of the second side, and a transition liquid stream is ducted from a bottom of the second side to the top of the first side.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: October 6, 2020
    Assignee: UOP LLC
    Inventors: Brian J. Nowak, Kevin J. Richardson
  • Patent number: 10788637
    Abstract: The disclosed apparatus may include (1) a plurality of individual heatsink bases designed to interface with a plurality of removable communication modules installed on a telecommunications device, (2) a plurality of heat pipes that are thermally coupled to the individual heatsink bases, and (3) a ganged heat exchanger that is (A) mechanically coupled to the telecommunications device and (B) thermally coupled to the heat pipes. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: September 29, 2020
    Assignee: Juniper Networks, Inc.
    Inventors: Nikola Ikonomov, Christopher Otte, Attila I. Aranyosi
  • Patent number: 10782076
    Abstract: A heat pipe has a heat receiving portion that is to be thermally connected to a heat generating member so as to absorb heat from the heat generating member. The heat pipe includes a sealed flat container; a wick structure housed inside the flat container; and a working fluid sealed inside the flat container. In at least one cross section of the flat container, the wick structure includes a first wick member and a second wick member disposed vertically, the wick structure also has a first wick part and a second wick part respectively disposed in the lengthwise direction of the flat container, the second wick part having a maximum width that is wider than a maximum width of the first wick part. The second wick part is disposed in the heat receiving portion of the heat pipe.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: September 22, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventor: Yasumi Sasaki
  • Patent number: 10760855
    Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: September 1, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
  • Patent number: 10750641
    Abstract: A phased array antenna in which a plurality of blocks each having a plurality of transmitter modules are arrayed, includes: a front plate that includes a plurality of flow paths of a refrigerant therein; and an element feeding layer that includes a plurality of antenna elements respectively connected to the transmitter modules and that is placed in close contact with one surface of the front plate. Each of the blocks includes a heat spreader that is placed in close contact with the other surface of the front plate. The transmitter modules are mounted on the heat spreader. Heat generated in the transmitter modules is transferred to the refrigerant via the heat spreader and the front plate.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: August 18, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Soma Egami, Hiroaki Matsuoka, Yukari Saito
  • Patent number: 10746478
    Abstract: A wicking structure comprising a biporous wick formed with a semiconductor (e.g., silicon), wherein the biporous wick comprises first pores and second pores formed by the semiconductor and the first pores are larger than the second pores.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: August 18, 2020
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Eric T. Sunada, Karl Y. Yee, Sean W. Reilly
  • Patent number: 10748835
    Abstract: A cooling device includes an aluminum heat sink and at least one nickel sheet segment. The nickel sheet segment is connected to the aluminum heat sink by a solder layer. The cooling device includes a securing surface for securing and for heat absorption. The securing surface being formed by that side of the nickel sheet segment which faces away from aluminum heat sink. The aluminum heat sink is formed from a plurality of aluminum sheets which are stacked one above another and are connected to one another. At least one aluminum sheet includes cutouts which form a cooling channel covered by at least one of the aluminum sheets. Furthermore, a method for producing a cooling device and also a power circuit comprising a heat sink as described here are presented.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: August 18, 2020
    Assignee: CPT Group GmbH
    Inventors: Arnoud Smit, Thomas Schmid, Lars Keller, Soeren Rittstieg
  • Patent number: 10746475
    Abstract: Multi-phase thermal control systems, evaporators, variable porous wick elements, heat transfer structures, and methods for their production are provided. Two-phase evaporators for use in such multi-phase thermal control systems are also provided. Two-phase evaporators incorporate a vapor plate body having there three major layers: a vapor channel network, a wick, and a liquid channel. The vapor channel network comprises a plurality of extrusions (e.g., vapor pillars) and associated channels (e.g., vapor channels) configured to allow a vapor to flow therethrough. The wick comprises a porous body configured to be disposed between the vapor channel network of and the liquid flow reservoir.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: August 18, 2020
    Assignee: California Institute of Technology
    Inventors: Scott N. Roberts, Arthur J. Mastropietro, Benjamin I. Furst, Eric T. Sunada, Jordan Mizerak, Hiroki Nagai, Stefano Cappucci
  • Patent number: 10739082
    Abstract: An anti-pressure structure of heat dissipation device includes a main body. The main body has a chamber and a bent section. The chamber has a top side and a bottom side. An anti-pressure member is disposed in the chamber at the bent section. A capillary structure is disposed on the bottom side of the chamber. Two sides of the anti-pressure member respectively abut against the top side of the chamber and a surface of the capillary structure. A working fluid is filled in the chamber. By means of the anti-pressure member, the internal vapor chamber with a bending R angle in the main body is prevented from deformation, contraction or damage due to bending.
    Type: Grant
    Filed: January 3, 2018
    Date of Patent: August 11, 2020
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Jian Zhang, Xiao-Xiang Zhou, Han-Min Liu
  • Patent number: 10731925
    Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member configured to enclose a working fluid; a second planar substrate member configured to enclose the working fluid; a plurality of wicking structures disposed on the first planar substrate; and one or more planar spacers disposed on the second planar substrate. The first planar substrate and the second planar substrate are may be hermetically sealed.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: August 4, 2020
    Assignee: THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
    Inventors: Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu, Ronggui Yang, Yung-Cheng Lee
  • Patent number: 10724803
    Abstract: A heat pipe is provided, including a capillary body. The capillary body has a condensation portion, an evaporation portion, and a connecting portion connecting the condensation portion with the evaporation portion. The capillary body is formed by metal weaving. A cross-section of the evaporation portion is larger than that of the condensation portion.
    Type: Grant
    Filed: January 3, 2017
    Date of Patent: July 28, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Lin Huang, Chiu-Kung Chen, Ti-Jun Wang, Quan Zhang
  • Patent number: 10718572
    Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: July 21, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
  • Patent number: 10704838
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: July 7, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Patent number: 10697710
    Abstract: A manufacturing method of a three-dimensional heat conducting structure, comprising: providing a vapor chamber having at least one insert hole; providing a heat pipe having an open end, and inserting the open end into the insert hole; providing a support ring, and sheathing the support ring on either the heat pipe or the vapor chamber, wherein the supporting ring extends along an axial direction of the heat pipe and has a contact surface facing toward an outer surface of the vapor chamber, and the contact surface is in contact with the outer surface of the vapor chamber; and providing a soldering means, and applying the soldering means between the support ring and the heat pipe to combine the heat pipe onto the vapor chamber.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 30, 2020
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Lei-Lei Liu
  • Patent number: 10685900
    Abstract: A semiconductor device comprises a generally planar semiconductor chip. The semiconductor chip comprises a first side and second side opposite the first side. The first side is associated with a source conductive pad. The second side is associated with a drain conductive pad. A gate pad overlies a portion of the first side. A source terminal comprises a metallic strip assembly with a series of pocket chambers spaced apart from each other and partially filled with a phase-change material filling. A drain terminal is spaced apart from the source terminal by a dielectric layer. The source terminal is bonded to the source conductive pad via a bonding interface material.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: June 16, 2020
    Assignee: DEERE & COMPANY
    Inventor: Brij N. Singh
  • Patent number: 10677534
    Abstract: The present disclosure is to provide a heat sink capable of improving cooling efficiency of a heat radiation fin and exhibiting excellent cooling performance with respect to a cooling target regardless of an installation posture of the heat sink, and capable of being installed even in a narrow space.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: June 9, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yosuke Watanabe, Tatsuro Miura, Toshiaki Nakamura, Kenya Kawabata, Yoshikatsu Inagaki
  • Patent number: 10677535
    Abstract: An object of the present disclosure is to provide a heat sink that can equalize heat input in a heat receiving portion and increase a volume of the heat receiving portion, prevent an increase in heat resistance in the heat receiving portion even when a heat generation amount from a heat-generating element increases, and exhibit excellent cooling performance with respect to a cooling target.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: June 9, 2020
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kenya Kawabata, Yasumi Sasaki, Yosuke Watanabe
  • Patent number: 10670352
    Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: June 2, 2020
    Assignee: PiMEMS, Inc.
    Inventor: Payam Bozorgi
  • Patent number: 10667330
    Abstract: An aerodynamic measurement probe comprises a part to be sited in the region of the skin of an aircraft and means for heating the part. The heating means comprise a thermodynamic loop comprising a closed circuit in which a heat-transfer fluid circulates, the closed circuit comprising an evaporator and a zone in which the heat-transfer fluid can be condensed in the appendage in order to heat it. Outside the evaporator, the circuit in which the fluid circulates is formed by a tubular duct of open cross section.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: May 26, 2020
    Assignee: THALES
    Inventors: Claude Sarno, Romain Hodot
  • Patent number: 10667378
    Abstract: An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.
    Type: Grant
    Filed: January 14, 2019
    Date of Patent: May 26, 2020
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventor: Jason Thompson
  • Patent number: 10667428
    Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 26, 2020
    Assignee: HTC Corporation
    Inventors: Chih-Yao Kuo, Chin-Kai Sun, Chun-Lung Chu, Wei-Cheng Liu
  • Patent number: 10653035
    Abstract: Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel width and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. A width of the second channel increases along a flow direction of the coolant fluid that flows between the inlet port and the outlet port.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: May 12, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy Joseph Chainer, Pritish Ranjan Parida, Fanghao Yang
  • Patent number: 10633993
    Abstract: Apparatus for insertion into a cavity of an object, the apparatus comprising: a first tube comprising a first end, a second end, a first cavity extending between the first end and the second end, and an aperture at the second end; a member positioned within the first cavity of the first tube and adjacent the aperture of the first tube, the member being configured to enable an action to be performed; a plug coupled to the second end of the first tube; and an actuator configured to move the first tube relative to the object between a first position in which the plug seals the member from the cavity of the object, and a second position in which the member is exposed to the cavity of the object.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: April 28, 2020
    Assignee: ROLLS-ROYCE plc
    Inventors: Andrew D. Norton, James Kell, Adam G A Rushworth, Amir Rabani
  • Patent number: 10638639
    Abstract: A cooling unit positioned between a first gas stream and a second gas stream, the first gas stream and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: April 28, 2020
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Scott D. Garner, Peter Dussinger, Jon Zuo, Daniel T. Reist
  • Patent number: 10605540
    Abstract: A vapor chamber includes a first panel defining an evaporation region, a thermal insulation region and a condensation region, a second panel joined to the first panel to define an enclosed accommodation space therebetween, a capillary material disposed in the accommodation space, and a working fluid. The first panel has a plurality of first bumps disposed within the accommodation space and distributed in the evaporation region, the thermal insulation region and the condensation region and abutted against the capillary material. The capillary material has a hollow portion located in the thermal insulation region to expose a part of the first bumps. The second panel has a plurality of second bumps abutted against the first bumps in the hollow portion.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: March 31, 2020
    Assignee: TAI-SOL ELECTRONICS CO., LTD.
    Inventors: Chuan-Chi Tseng, Wen-Ching Liao, Ming-Quan Cui
  • Patent number: 10598442
    Abstract: The instant disclosure relates to a flat heat pipe structure, which includes a flat tubing and a support member. The flat tubing has two opposed main walls and two opposed connecting walls connected thereto. The main and connecting walls cooperatively define an internal space. The inner surfaces of the flat tubing are covered with a capillary structure. The support member is disposed in the internal space of the flat tubing and has at least one support arm. The support arm extends in the longitudinal direction of the flat tubing. The support arm has two opposed surfaces abutting to the capillary structure of the main walls.
    Type: Grant
    Filed: March 12, 2012
    Date of Patent: March 24, 2020
    Assignee: Cooler Master Development Corporation
    Inventors: Leilei Liu, Xuemei Wang