Abstract: A radiator module includes a heat pipe and a terminal. The heat pipe includes a first plate and a second plate between which a refrigerant channel is defined, and a support member extending from the first plate to the second plate. The terminal is joined to a connection body of the first plate and the support member from outside of the heat pipe. The support member is located within a range that overlaps a joint portion of the terminal and the connection body when viewed in a thickness direction of the first plate.

Abstract: A heat pipe comprises a flat tube and a wick structure. The flat tube includes a hollow chamber and has a front and a rear sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the flat tube. The wick structure is divided into a front, a middle and a rear sections sequentially along the axial direction. The front section is near the front sealed end, the rear section is near the rear sealed end. The front, middle and rear sections have a maximum length parallel to the width direction, respectively. The maximum length of the front section is greater than that of the middle section, and the maximum length of the middle section is greater than that of the rear section.

Abstract: A heat dissipation device includes: a rigid tube, including a first cavity; a first capillary structure, at least a portion of the first capillary structure being positioned within the first cavity; a flexible tube, including a second cavity, the flexible tube being more flexible than the rigid tube; and a second capillary structure, at least a portion of the second capillary structure being positioned within the second cavity, wherein the heat dissipation device is deformable via the flexible tube.

Abstract: The present disclosure is an evaporation device for cooling. In an evaporation space 12 formed inside a housing 10, a wick 16 allows a working fluid to move by capillary force. As the working fluid moves from a lower portion of the evaporation space 12 to an upper portion thereof, that is, from the working fluid inlet pipe 26 to the vapor outlet pipe 28 by the wick 16, the working fluid is evaporated by heat generated from the heat source to become vapor. A partition wall 20 is provided in the evaporation space 12 to control the flow of vapor. The working fluid transferred into the evaporation space 12 is uniformly mixed with the existing working fluid in the lower portion of the evaporation space 12 by a distributor 30.

Abstract: A device for transferring heat between a second module, for example an optical transceiver module, and a first module, for example a heat sink. The device comprises a holder for holding the second module, a first unit configured to be thermally coupled to the first module, and a second unit which is urged against the second module placed in the holder by a biasing apparatus. The first unit and the second unit are thermally coupled to one another through a heat-transferring apparatus such that an improved heat transfer can be provided between the first and second units, and hence between the second module and the first module. Furthermore, the disclosure also relates to an arrangement, including the device, and a network access node for a wireless communication system including any one of the device and the arrangement.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: A cooling module includes: a fan having a fan housing with an intake port and an exhaust port; a fin that faces the exhaust port of the fan; a heat pipe connected to a surface of the fin; and a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin to be parallel with the heat pipe, so that the one edge is disposed between the heat pipe and the fin.

Abstract: The vapor chamber includes a container having a cavity formed of one plate-shaped body to which a heating element is thermally connected and another plate-shaped body facing the one plate-shaped body, a working fluid enclosed in the cavity, and a wick structure that is enclosed in the cavity and separated from the container. The container includes a support part protruding from an inner surface of the other plate-shaped body toward the one plate-shaped body, the support part being formed of a recessed part provided to an outer surface of the other plate-shaped body. At the rising base portion of the support part from the inner surface of the other plate-shaped body, the defined angle between the support part and the inner surface of the other plate-shaped body is an obtuse angle.

Abstract: A bionic sweat gland and a bionic skin include a shell and a porous medium. A heat dissipation pipe is arranged inside the shell, that is filled with porous media. The pores formed by the porous medium in the heat dissipation pipe gradually decrease along the evaporation flow direction and the gap of the porous medium is filled with evaporation liquid. The shell is a permeable structure, which is used to absorb evaporation liquid from the environment. The top of the shell is provided with a number of through holes connected with the heat dissipation pipe for discharging evaporation liquid to the outside. The bionic sweat gland and the bionic skin can adapt to the effect of tensile and shear forces generated on the surface of flexible materials such as electronic skin during use.

Abstract: A heat dissipating device that includes a first plate and a second plate opposite the first plate and connected to the first plate by two opposite sidewalls. The first plate and the second plate are connected to each other at longitudinally opposite ends thereof, longitudinally extending ends of the first plate and the second plate are connected to each other by sidewalls, and the first plate, the second plate and the sidewalls enclosing an internal space of the heat dissipating device. The heat dissipating device also includes a first wick structure disposed in the internal space and contacting inner surfaces of at least one of the first plate and the second plate. The first wick structure extends longitudinally between the longitudinally opposite ends of the first plate and the second plate, and the first wick structure at least partially defines a first vapor flow channel of the heat dissipating device.

Abstract: The invention relates to a heat exchanger plate (A; B) comprising a central panel (A0; B0) with at least four sides (A1, A2, A3, A4; B1, B2, B3, B4), said central panel being preferably quadrilateral, or quadrilateral with truncated corners, said plate having: a first side (A1; B1) of the central panel which is inclined with respect to said central panel (A0; B0) and which forms a first joining panel (JA; JB), the opposite side (A3; B3) to said first side (A1; B1) which is flat.

Abstract: Systems and methods for thermal management using separable heat pipes and methods of manufacture thereof. Various embodiments provide a porous insert that can be used to join or connect heat pipes. Further embodiments provide thermal management systems that are modular, expandable, reparable, by allowing for joining of evaporators, condensers, and adiabatic sections via porous inserts. Various embodiments allow for two-phase thermal management systems, where liquid and gaseous phases can be transported simultaneously. Certain embodiments incorporate heat generating components with embedded evaporators and/or condensers. Many embodiments are additively manufactured, including via 3D printing.

Abstract: Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

Abstract: An electronic apparatus includes: a chassis; first and second heating elements in the chassis; and a cooling module absorbing the heat. The cooling module includes: a first vapor chamber connected to the first heating element; and a second vapor chamber connected to the second heating element. The first and second vapor chambers are placed adjacent to each other with a step therebetween. The first vapor chamber has a bridge that is a part of at least one of the two first metal plates, the bridge straddling the step and extending toward the second vapor chamber to be connected to a surface of the second vapor chamber. The bridge is not provided with the closed space.

Abstract: The invention relates to a fuel cell system (1) comprising an air compressor (5) which is used to compress an air mass flow (4) that is supplied to at least one fuel cell (3), and further comprising a cooling air path (19), via which a cooling air mass flow (7) is branched off from the compressed air mass flow (6). The cooling of the air compressor (5) in the fuel cell system (1) is further improved by an on-demand control (20) of the compressed cooling air mass flow (6).

Abstract: Some embodiments include a thermal ground plane comprising a first and second casing with folding and non-folding regions. The thermal ground plane may also include a vapor structure and a mesh. The mesh may be disposed on an interior surface of the second casing and the mesh include a plurality of arteries extending substantially parallel with a length of the thermal ground plane. The folding region of the first casing may have an out-of-plane wavy structure. The valleys and peaks of the out-of-plane wavy structure, for example, may extend across a width of the first active region substantially parallel with a width of the thermal ground plane.

Abstract: A universal firearm shield adapted to attach to a firearm suppressor. Suppressors fail to dampen all of the effects of firearm discharge, leaving behind residual effects that may be noticeable. The shield dampens the residual effects of firearm discharge that are not captured by the suppressor. The residual effects are captured by the shield and dispersed throughout one or more interior chambers. The shield easily, quickly, and securely couples to suppressors of varying geometries due to the slidably adjustable components of the shield. The shield is configured to surround the suppressor and axially align with the suppressor. As such, the muzzle of the firearm axially aligns with the shield, the suppressor, and the barrel for an unobstructed projectile path during discharge.

Abstract: A heat dissipation device includes a first casing and a second casing coupled to the first casing. The second casing includes a body having an inner surface and an outer surface opposite the inner surface, and a first portion and a second portion, each of the first and second portions having a different cross-sectional area. The heat dissipation device further includes a plurality of columns on the inner surface, and a first wick structure disposed on the inner surface and in the first portion and the second portion.

Abstract: The present invention provides a flexible wick structure and a deformable heat-dissipating unit using the same. The heat-dissipating unit comprises a heat-dissipating body and a flexible wick structure. The heat-dissipating body has an upper plate, a chamber, and a lower plate. The flexible wick structure is disposed in the chamber and has a wick body and plural extension portions being able to be elastically deformed under compression; the extension portions extend outwards from a side of the wick body to carry the wick body. In addition, the extension portions and the wick body together define an axial-displacement space; the wick body or the extension portions are in contact with an inner side of the upper plate or the low plate.

Abstract: A method for performance determination of a heat pipe with an arbitrary liquid flow area and prescribed geometric dimensions, an external and internal structure, a heat pipe material and a working fluid, heating and cooling surface areas, and condenser cooling conditions is provided to obtain operating and performance parameters, wherein the operating and performance parameters are temperature distribution within the heat pipe, a heat transferred via a phase change and a conduction, an axial variation of a radius of curvature of a liquid-vapor interface along the heat pipe, a vapor temperature and pressure of the working fluid, by simulating a flow and an energy transfer inside.

Abstract: The present invention relates, inter alia, to vegetative plant parts, such as from a Sorghum sp. and/or a Zea mays plant, which comprise a total fatty acid (TFA) content which comprises fatty acids esterified in the form of triacylglycerols (TAG) and fatty acids in the form of lipids other than TAG, wherein the vegetative plant parts comprise greatly increased levels of TFA, for example a TFA content of about 5% (w/w dry weight). The present invention also relates to the use of the vegetative plant parts as a feedstuff, and/or to produce a feedstuff, for animal consumption.

Abstract: A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.

Abstract: The disclosure relates to a thin vapor-chamber structure including a first cover and a second cover. The first cover has a first surface and a first clustered pattern. The first clustered pattern is disposed on the first surface, and has a plurality of first protruding stripes spaced apart from each other and extended along a first direction. The second cover has a second surface and a second clustered pattern. The first surface faces the second surface. The second clustered pattern is disposed on the second surface, and has a plurality of second protruding stripes spaced apart from each other and extended along a second direction. The first clustered pattern and the second clustered pattern are partially contacted with each other to form a wick. The lateral walls of the first protruding stripes and the second protruding stripes form a micro-channel meandering between the first surface and the second surface.

Abstract: A floating heat pipe assembly includes a floating heat pipe and a clamp collar used with the floating heat pipe. The floating heat pipe has a flattened section that has a flattened pipe size smaller than a pipe size of any other section of the floating heat pipe, so that the floating heat pipe is adjustable at the thinner flattened section for other sections of the floating heat pipe located at two opposite ends of the flattened section to displace to two positions having a height difference between them. The clamp collar is fitted on around the flattened section and includes two symmetrically arranged elastic clamping sections that elastically clamp on two opposite outer sides of the flattened section to hold the same in place, so that the sections of the floating heat pipe located at different heights do not deform to cause reduced or failed capillary action efficiency.

Abstract: An integrated vapor chamber includes an outer shell and a plurality of composite capillary structures. The outer shell includes a flat casing and a plurality of partitions integrally formed. The flat shell includes a chamber, and the partitions are disposed in the chamber to separate the chamber into a plurality of flow channels. Each composite capillary structure is extended along each flow channel and distributed in the chamber. The composite capillary structure includes a metal mesh and a plurality of sintered powder uniformly sintered in the metal mesh. Furthermore, this disclosure also discloses a manufacturing method of the integrated vapor chamber. Therefore, the manufacturing method of the thin vapor chamber is simplified to improve the yield rate.

Abstract: A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to condense the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. Each of the evaporator, the condenser, the liquid pipe and the vapor pipe includes: a pair of outer metal layers; an intermediate metal layer provided between the pair of outer metal layers; and a flow channel defined by the pair of outer metal layers and the intermediate metal layer. At least one of the evaporator, the condenser, the liquid pipe and the vapor pipe further includes a reinforcing member that is built in at least one of the pair of outer metal layers and that is higher in rigidity than the pair of outer metal layers.

Abstract: A method for manufacturing a heat exchanger includes: providing a porous material that has a porosity of about 30% to about 80%; forming an oxide layer on a surface of the porous material by heat treating the porous material at a temperature in a range of 600° C. to 900° C. for a time period in a range of 8 hours to 12 hours in air; and integrating the porous material into a cold side flow passage of the heat exchanger.

Abstract: A heat transfer device, including a sealed container defining an internal chamber having a first internal surface positioned opposite to a second internal surface, the sealed container including a first end and a second end positioned opposite to the first end; internal fins extending from the first internal surface of the internal chamber towards the second internal surface of the internal chamber, the internal fins positioned at the second end of the sealed container; a wicking structure positioned along the internal surfaces, and positioned between adjacent fins along the first internal surface such that the internal fins are in thermal communication with the wicking structure; a remote heat exchanger positioned along an external surface of the sealed container at the second end of the sealed container, the remote heat exchanger adjacent to the internal fins such that the remote heat exchanger is in thermal communication with the internal fins.

Abstract: A vehicle is provided including a structure including a skin defining an outside surface exposed to ambient cooling flow and an inside surface. The structure includes a first structural member extending from the inside surface of the skin and a second structural member extending from the inside surface of the skin; and a thermal management system including a heat exchanger assembly positioned adjacent to, and in thermal communication with, the inside surface of the skin, the heat exchanger assembly positioned at least partially between the first and second structural members of the structure.

Abstract: The present disclosure provides a positive-pressure-withstanding high-power flat evaporator, processing methods thereof and a flat loop heat pipe including the evaporator. The evaporator includes a housing, and reinforcing ribs and a capillary wick which are positioned inside the housing, and the arrangement of the reinforcing ribs can ensure that the strength of the whole evaporator is capable of withstanding positive pressure. The capillary wick is composed of four parts, namely, an evaporating wick, a heat insulating wick, a sealing wick and a transfer wick. Through the large permeability of the transfer wick, liquid supply with low flow resistance can be realized, the heat transfer capability of the loop heat pipe is greatly improved, and the problems of long liquid supply path and large flow resistance caused by a large-area evaporator are solved.

Abstract: A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.

Abstract: An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

Abstract: A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The wick structure is composed of the first, the second and the third sections, and cross-sections of the first section, the second section and the third section in the axial direction are rectangles, respectively. A cross-sectional area of the first section is greater than that of the second and that of third section. The edge of each of the sections of the wick structure has a smooth form without the sectional difference.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix disposed about an outer casing of the first battery cell.

Abstract: A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.

Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix formed in an outer casing of the first battery cell.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing, and is in contact with the microchannel. The microchannel includes a plurality of convexes, and an area ratio of the plurality of convexes of the microchannel to an entire area of the microchannel is 5% to 40% in a plan view of the vapor chamber.

Abstract: The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing and is in contact with the microchannel. A contact area between the wick and the microchannel is 5% to 40% with respect to an area of the internal space taken as a plane.

Abstract: Provided is a vapor-based heat transfer apparatus (e.g. a vapor chamber or a heat pipe), comprising: a hollow structure having a hollow chamber enclosed inside a sealed envelope or container made of a thermally conductive material, a wick structure in contact with one or a plurality of walls of the hollow structure, and a working liquid within the hollow structure and in contact with the wick structure, wherein the wick structure comprises a graphene material and the hollow structure walls comprise an evaporator wall having a first surface plane and a condenser wall having a second surface plane, wherein multiple sheets of the graphene material in the wick structure are aligned to be substantially parallel to one another and perpendicular to at least one of the first surface plane and the second surface plane. Also provided is a process for producing this apparatus.

Abstract: According to one embodiment, an electronic rack cooling system includes a liquid manifold and a vapor manifold. The system includes a cold plate configured to mount on a processor of a piece of information technology (IT) equipment for liquid cooling. The cooling device such as the cold plate is coupled to the liquid manifold to receive cooling liquid and is coupled to the vapor manifold that receives vapor produced by the cold plate when heat generated by the processor is transferred into the cooling liquid through the cold plate. The system also includes a heat exchanger coupled to the vapor manifold to receive the vapor and configured to condense the vapor back into cooling liquid. The system also includes a fluid control unit coupled between the liquid manifold and the heat exchanger to create a heat exchanging loop, and configured to circulate the cooling liquid within the heat exchanging loop. Multiple methods of implementing the proposed thermal system and the loop design on a rack and a data center.

Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

Abstract: A vapor chamber that includes a housing defining an internal space, and a working medium and a wick structure in the internal space of the housing. As viewed in a plan view, the vapor chamber has a first region with a first thickness and a second region with a second thickness, the second thickness being smaller than the first thickness.

Abstract: An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Abstract: A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.

Abstract: A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser; a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe; and a porous body which is provided in the liquid pipe and configured to reserve liquid-phase working fluid. The liquid pipe includes an injection inlet through which the working fluid is injected. A first end of the porous body is located between the injection inlet and the evaporator. A second end of the porous body which is opposite to the first end is located between the injection inlet and the condenser. At least a portion of the porous body which is provided between the injection inlet and the evaporator fills the inside of the liquid pipe.