Abstract: A heat transfer device, including a sealed container defining an internal chamber having a first internal surface positioned opposite to a second internal surface, the sealed container including a first end and a second end positioned opposite to the first end; internal fins extending from the first internal surface of the internal chamber towards the second internal surface of the internal chamber, the internal fins positioned at the second end of the sealed container; a wicking structure positioned along the internal surfaces, and positioned between adjacent fins along the first internal surface such that the internal fins are in thermal communication with the wicking structure; a remote heat exchanger positioned along an external surface of the sealed container at the second end of the sealed container, the remote heat exchanger adjacent to the internal fins such that the remote heat exchanger is in thermal communication with the internal fins.

Abstract: A vehicle is provided including a structure including a skin defining an outside surface exposed to ambient cooling flow and an inside surface. The structure includes a first structural member extending from the inside surface of the skin and a second structural member extending from the inside surface of the skin; and a thermal management system including a heat exchanger assembly positioned adjacent to, and in thermal communication with, the inside surface of the skin, the heat exchanger assembly positioned at least partially between the first and second structural members of the structure.

Abstract: The present disclosure provides a positive-pressure-withstanding high-power flat evaporator, processing methods thereof and a flat loop heat pipe including the evaporator. The evaporator includes a housing, and reinforcing ribs and a capillary wick which are positioned inside the housing, and the arrangement of the reinforcing ribs can ensure that the strength of the whole evaporator is capable of withstanding positive pressure. The capillary wick is composed of four parts, namely, an evaporating wick, a heat insulating wick, a sealing wick and a transfer wick. Through the large permeability of the transfer wick, liquid supply with low flow resistance can be realized, the heat transfer capability of the loop heat pipe is greatly improved, and the problems of long liquid supply path and large flow resistance caused by a large-area evaporator are solved.

Abstract: A vapor chamber and an assembly method thereof are provided. The vapor chamber includes a mesh structure including a main body and an extension part. The main body and the extension part have a capillary-wick structure, respectively. The extension part is extended outwardly from a side of the main body and folded along an intersection between the extension part and the main body. The extension part is stacked on the main body. An overlapping area is formed by stacking the extension part on the main body, and the overlapping area fails to contact with a support structure. The main body is disposed on a first concave of the lower case. The upper case covers the lower case and is assembled with the lower case. A second concave of the upper case and the first concave collaboratively form a space. The mesh structure is accommodated within the space.

Abstract: An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Abstract: A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

Abstract: A heat pipe comprises a tube and a wick structure. The tube includes a hollow chamber and has two sealed ends along an axial direction. The wick structure is disposed in the hollow chamber and extended along the axial direction of the tube. The wick structure has a first section near one of the sealed ends, a third section near the other of the sealed ends, and a second section between the first and third sections. The wick structure is composed of the first, the second and the third sections, and cross-sections of the first section, the second section and the third section in the axial direction are rectangles, respectively. A cross-sectional area of the first section is greater than that of the second and that of third section. The edge of each of the sections of the wick structure has a smooth form without the sectional difference.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix disposed about an outer casing of the first battery cell.

Abstract: A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.

Abstract: A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

Abstract: A system for thermal management and structural containment includes a first battery cell having first and second terminal ends, and a first capillary void matrix formed in an outer casing of the first battery cell.

Abstract: A liquid flow path portion of a vapor chamber according to this invention includes a first main flow groove, a second main flow groove and a third main flow groove. A first convex array including a plurality of first convex portions arranged via a first communicating groove is provided between the first main flow groove and the second main flow groove. A second convex array including a plurality of second convex portions arranged via a second communicating groove is provided between the second main flow groove and the third main flow groove. The main flow groove includes a first intersection at which at least a part of the first communicating groove faces each second convex portion and a second intersection at which at least a part of the second communicating groove faces each first convex portion.

Abstract: The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing and is in contact with the microchannel. A contact area between the wick and the microchannel is 5% to 40% with respect to an area of the internal space taken as a plane.

Abstract: The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing, and is in contact with the microchannel. The microchannel includes a plurality of convexes, and an area ratio of the plurality of convexes of the microchannel to an entire area of the microchannel is 5% to 40% in a plan view of the vapor chamber.

Abstract: Provided is a vapor-based heat transfer apparatus (e.g. a vapor chamber or a heat pipe), comprising: a hollow structure having a hollow chamber enclosed inside a sealed envelope or container made of a thermally conductive material, a wick structure in contact with one or a plurality of walls of the hollow structure, and a working liquid within the hollow structure and in contact with the wick structure, wherein the wick structure comprises a graphene material and the hollow structure walls comprise an evaporator wall having a first surface plane and a condenser wall having a second surface plane, wherein multiple sheets of the graphene material in the wick structure are aligned to be substantially parallel to one another and perpendicular to at least one of the first surface plane and the second surface plane. Also provided is a process for producing this apparatus.

Abstract: According to one embodiment, an electronic rack cooling system includes a liquid manifold and a vapor manifold. The system includes a cold plate configured to mount on a processor of a piece of information technology (IT) equipment for liquid cooling. The cooling device such as the cold plate is coupled to the liquid manifold to receive cooling liquid and is coupled to the vapor manifold that receives vapor produced by the cold plate when heat generated by the processor is transferred into the cooling liquid through the cold plate. The system also includes a heat exchanger coupled to the vapor manifold to receive the vapor and configured to condense the vapor back into cooling liquid. The system also includes a fluid control unit coupled between the liquid manifold and the heat exchanger to create a heat exchanging loop, and configured to circulate the cooling liquid within the heat exchanging loop. Multiple methods of implementing the proposed thermal system and the loop design on a rack and a data center.

Abstract: A cooling assembly includes walls extending around and defining an enclosed vapor chamber that holds a working fluid. An interior porous wick structure is disposed inside the chamber and lines interior surfaces of the walls. The wick structure includes pores that hold a liquid phase of the working fluid. The cooling assembly also includes an exterior porous wick structure lining exterior surfaces of the walls outside of the vapor chamber. The exterior wick structure includes pores that hold a liquid phase of a cooling fluid outside the vapor chamber. The interior wick structure holds the liquid working fluid until heat from an external heat source vaporizes the working fluid inside the vapor chamber. The exterior wick structure holds the liquid fluid outside the vapor chamber until heat from inside the vapor chamber vaporizes the liquid cooling fluid in the exterior wick structure for transferring heat away from the heat source.

Abstract: A vapor chamber that includes a housing defining an internal space, and a working medium and a wick structure in the internal space of the housing. As viewed in a plan view, the vapor chamber has a first region with a first thickness and a second region with a second thickness, the second thickness being smaller than the first thickness.

Abstract: An electronic device includes a first device housing coupled to a second device housing by a hinge. A heat spreader is coupled to the first device housing and the second device housing and spans the hinge. A flexible display coupled to the first device housing and the second device housing and spans the hinge. The heat spreader and the flexible display can be coupled to the first device housing and the second device housing, respectively, at different locations. Alternatively, the flexible display can be coupled to the heat spreader at a location that is collocated with the location at which the heat spreader is coupled to the first device housing and the second device housing, respectively.

Abstract: A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.

Abstract: A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser; a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe; and a porous body which is provided in the liquid pipe and configured to reserve liquid-phase working fluid. The liquid pipe includes an injection inlet through which the working fluid is injected. A first end of the porous body is located between the injection inlet and the evaporator. A second end of the porous body which is opposite to the first end is located between the injection inlet and the condenser. At least a portion of the porous body which is provided between the injection inlet and the evaporator fills the inside of the liquid pipe.

Abstract: A vapor-chamber that includes a porous microstructure sheet with varying surface energy across different regions to optimize utilization of a working fluid. Modulating the surface energy of the porous microstructure sheet can minimize the amount of the working fluid that becomes trapped in the condenser region(s) and maximize an aggregate thin-film evaporation area of the working fluid in the evaporator region(s). The condenser region of the vapor-chamber is treated so that the internal surfaces have low surface energy. For example, the treatment may cause the condenser region to become hydrophobic to minimize the amount of fluid that becomes trapped in the condenser. The evaporator region is treated so that the internal surfaces have high surface energy. For example, the treatment may cause the evaporator region to become hydrophilic to induce the formation of large numbers of robust (e.g., dry-out resistant) thin-film evaporation sites.

Abstract: A vapor chamber structure includes a main body having multiple internal independent chambers. A capillary structure is disposed in each of the independent chambers. A working fluid is contained in each of the independent chambers. The working fluids contained in the independent chambers have different physical or chemical properties. The independent chambers are respectively in contact with different heat sources with different properties to conduct the heat. Accordingly, one single vapor chamber structure can provide complex heat conduction effect for different heat sources.

Abstract: A vapor chamber structure includes a main body. The main body has a chamber. The chamber has a first side, a second side and a connection body. Two axial ends of the connection body are respectively connected with the first and second sides. A first capillary structure layer is disposed around the connection body along a periphery thereof. A working fluid is filled in the chamber. The connection body serves to prevent the main body from deforming when heated and enhance the heat conduction efficiency.

Abstract: A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase to a gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.

Abstract: A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

Abstract: A vapor chamber that includes a housing having a first sheet and a second sheet that oppose each other and are joined to each other in a peripheral region of the housing, a working liquid in an internal space of the housing, a wick structure on a principal surface of the first sheet that opposes the second sheet, and multiple pillars on a principal surface of the second sheet that opposes the first sheet. In the vapor chamber, the first sheet includes an inclined portion that is disposed along at least part of the peripheral region of the housing and is inclined in a height direction toward a joint portion with the second sheet. In addition, a first portion of the second sheet at the joint portion heightwise overlaps a second portion of the second sheet in a second region in contact with the pillars.

Abstract: Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Abstract: A representative cooling system for a nuclear reactor control rod drive mechanism (CRDM) includes an evaporation section located within or next to the CRDM and a condensation section fluidly coupled to the evaporation section. The cooling system includes a set of heat fins coupled to drive coils in the CRDM and heat pipes that extend through the drive coils and heat fins. A fluid evaporates while in the evaporation section of the heat pipes from heat generated by the CRDM and moves out of the evaporation section into the condensation section in the heat fins. The fluid cools and condensates while in the condensation section, recirculating back into the evaporation section. This passive natural circulation cooling system reduces or eliminates the number of water hoses, piping, and other water pumping equipment typically used for cooling a CRDM thereby increasing nuclear reactor reliability and simplifying nuclear reactor operation and maintenance.

Abstract: A vapor chamber that includes a housing; a pillar arranged in the housing; a working fluid sealed in the housing; and a wick arranged in the housing. The pillar has a first bottom surface and a second bottom surface, and pores therein. The first bottom surface is in contact with a first main interior surface of the housing and the second bottom surface is in contact with the wick. The first bottom surface has an area larger than an area of the second bottom surface. The pillar has a side surface connecting a periphery of the first bottom surface and a periphery of the second bottom surface. A cross-sectional area of the pillar decreases along a direction from the first bottom surface to the second bottom surface.

Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.

Abstract: A coil device is installed on an installation object. The coil device includes a housing accommodating at least a coil portion and a heat radiation member coming into thermal contact with the installation object. The heat radiation member includes a main body portion interposed in at least a part of a space between the housing and the installation object and a protrusion protruding from the main body portion toward the installation object.

Abstract: A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.

Abstract: A thin-profile composite heat dissipating structure for a heat-generating electronic device includes a heat sink and a heat pipe, the heat sink includes a first housing, a first heat dissipation liquid, and a gas. The first housing is sealed to form a first cavity, the first heat dissipation liquid and the gas are received in the first cavity. The heat pipe is connected to the first housing and a wick structure to allow the return of the condensed heat dissipation liquid by capillary action is disposed elsewhere. An electronic device using the structure is also provided.

Abstract: A cooling member includes refrigerant, an absorbing member absorbing the refrigerant, an enclosing member including flexible sheet members, that are connected to each other and enclosing the refrigerant and the absorbing member in a sealed state, and a heat releasing section configured to receive heat from the enclosing member and release the heat to an outside.

Abstract: A loop heat pipe includes: an evaporator configured to evaporate working fluid; a condenser configured to condense the working fluid; a liquid pipe which connects the evaporator and the condenser and has a first pipe wall and a second pipe wall which is opposed to the first pipe wall; a porous body which is provided in the liquid pipe and is configured to guide the working fluid condensed by the condenser to the evaporator; a flow channel which is a space that is formed in the liquid pipe and guides the working fluid condensed by the condenser to the evaporator; and a vapor pipe which connects the evaporator and the condenser and forms a loop together with the liquid pipe. The porous body is disposed to be in contact with the first pipe wall.

Abstract: A converter comprises: a housing; a plurality of heat generating elements arranged at one surface of the housing; and a fluid channel arranged at the other surface of the housing, wherein the fluid channel includes an inlet and an outlet which connect and pass through an outside and an inside of the housing, is formed by a single line from the inlet to the outlet, has a constant cross-sectional area, and is arranged at a position where the fluid channel overlaps the plurality of heat generating elements in a vertical direction.

Abstract: Embodiments described herein disclose a vapor chamber including a thermally-conductive evaporator wall, a thermally-conductive condenser wall and a volume therebetween defining a vapor core for transporting a vapor of a working fluid from the evaporator wall to the condenser wall. The outer surfaces of the evaporator wall and the condenser wall are configured to be in thermal contact with a plurality of heat sources and a heat sink respectively. The vapor chamber further includes a porous wick structure for holding and pumping the working fluid towards the plurality of heat sources. The wick structure comprises an evaporator-feeding wick having an inner surface in thermal contact with an inner surface of the evaporator wall. The evaporator-feeding wick comprises a first region having a higher permeability than at least a second region to form a permeability gradient, such that the working fluid has a uniform flow to the plurality of heat sources.

Abstract: An action camera includes an external housing and a main chip disposed inside the external housing. The action camera also includes a heat dissipation assembly configured to dissipate heat from at least one heat generating component of the action camera. The at least one heat generating component includes the main chip. The heat dissipation assembly includes a heat tube and a first heat dissipation panel. An evaporation end and a condensation end of the heat tube are both in thermal contact with the first heat dissipation panel. The condensation end of the heat tube is disposed farther away from the main chip relative to the evaporation end of the heat tube. The first heat dissipation panel is configured to be in thermal contact with the main chip and the external housing.

Abstract: An electric motor (1) is provided, preferably an internal rotor motor, having a housing (3) which is enclosed on all sides, except for a bushing for a drive shaft (2). A stator (5) is arranged in the housing, and is connected to a wall (3a) of the housing (3) in a thermally-conductive manner, wherein, externally to the wall (3a), a plurality of projections (6) are provided, which are oriented essentially parallel to the drive shaft (2), and wherein, externally to the housing (3), a fan wheel (8) is arranged on the drive shaft (2), the vanes (8a) of which, upon a rotation of the drive shaft (2), considered longitudinally to said drive shaft (2), pass over at least one region, in which region the projections (6) are arranged, such that a cooling air stream (KLS) is generated along the projections (6).

Abstract: A loop-type heat pipe includes: an evaporator; a condenser; a liquid pipe; and a vapor pipe. The evaporator is formed by layered metal layers that include: a first outermost metal layer; a second outermost metal layer; and an inner layer. The inner layer includes: a first metal layer adjacent to the first outermost metal layer; and a second metal layer adjacent to the second outermost metal layer. At least one space and a porous member are provided in the inner layer. The first metal layer is formed with a first bottomed groove. The second metal layer is formed with a second bottomed groove. One end of the space corresponds to a portion of the first metal layer where the first bottomed groove is formed. The other end of the space corresponds to a portion of the second metal layer where the second bottomed groove is formed.

Abstract: The present disclosure provides a heatsink that can improve heat radiation efficiency of a heat radiating fin and equalize a heat input in a heat receiving portion while securing sufficient volumes of the heat receiving portion, a heat insulating portion, and a heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a width direction of the heatsink is limited.

Abstract: A heat conductive device includes a heat conductive unit, a wick structure, a heat transferring unit, and a heat conductive fluid. The heat conductive unit has a closed chamber. The wick structure is disposed on the inner side surface of the closed chamber. The heat transferring unit includes a plurality of heat conductive elements agglomerated into islands and separated from each other. The heat conductive elements are disposed on the partial surface of the wick structure. The heat conductive fluid is disposed in the closed chamber. An electronic device including the heat conductive device is also provided. The heat conductive device has a good heat conductive efficiency.

Abstract: A vapor chamber that includes a housing defining an internal space, a first pillar arranged in the internal space of the housing to support the housing from the internal space, a working medium enclosed in the internal space of the housing, and a wick arranged in the internal space of the housing, the wick having a portion of a first main surface thereof supported by the first pillar so as to be spaced from the housing, and a thickness of the wick is partially different along a cross-section thereof.

Abstract: A heat-insulation device and an electronic product, the heat-insulation device is of a closed hollow structure, and includes a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body.

Abstract: A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.

Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

Abstract: An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.