AIR CONDUCTING DEVICE

Abstract

An air conducting device includes a body, a baffle and a plurality of tongues. The body defines an airflow passageway therein. The baffle extends from the body to divide the airflow passageway into a first passageway and a second passageway. The first passageway is capable of receiving at least one first heat generating component therein. The second passageway is capable of receiving at least one second heat generating component therein. The first heat generating component is located in one of a plurality a slots. A plurality of tongues are located in the first passageway. Each tongue corresponds to the location of the plurality of slots. A guide channel is defined between every two adjacent tongues.

Description

BACKGROUND

1. Technical Field

The present disclosure relates to air conduction, and particularly to an air conducting device in a computer.

2. Description of Related Art

Air conducting devices are often used in computers coupled with fans for dissipating heat from electronic components. A computer often includes a plurality of different heat generating components, such as CPUs, memories, and others. An airduct covers the heat generating components, and a fan is installed on or near the inlet to generate airflow to dissipate heat from the heat generating components within the airduct. However, different heat generating components may work at different temperatures, such that one with higher temperature may elevate the overall temperature in the airduct and affect the other components therein. In this way, the temperature of the affected heat generating components may exceed the temperature limit, and may be thereby damaged. In addition, when fewer heat generating components are installed, generated airflow exceeds the cooling requirements, translating to wasted energy and hardware.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded, isometric view of an air conducting device, the air conducting device including a first chamber and a second chamber.

FIG. 2 is an assembled view of FIG. 1.

DETAILED DESCRIPTION

Referring to FIG. 1, an air conducting device 50 is configured to assist the removal of heat from a plurality of first heat generating components, such as memories 20 and a plurality of second heat generating components, such as central processing units (CPUs) 14 by directing airflow flowing therethrough. The memories 20 are installed in a plurality of parallel slots 12 of a motherboard 10. The memories 20 are optionally installed in the slots 12. The heat generating components 14 are installed on the motherboard 10 adjacent to the slots 12. The CPUs 14 may create more heat than the memories 20.

The air conducting device 50 includes a body, baffle 55, and a plurality of tongues 572. The body includes a top wall 51 and two parallel sidewalls 53 extending downwardly therefrom. The top wall 51 is parallel to the motherboard 10. An airflow passageway is defined by the air conducting device 50 for directing the airflow therethrough. The baffle 55 is parallel to the sidewalls 53 and extends downward from the top wall 51 to divide the airflow passageway into a first passageway 57 and a second passageway 58. The first passageway 57 is capable of receiving the memories 20 therein, and the second passageway 58 is capable of receiving the CPUs 14 therein.

The tongues 572 perpendicularly extend from the top wall 51 towards the slots 12 in the first passageway 57. Each tongue 572 is rectangular. Each tongue 572 corresponds to each slot 12. A distal end of each tongue 572 is flush with a top surface of each slot 12. Each tongue 572 is placed adjacent to one end of each slot 12. The tongue 572 has a width that is greater than the memories 20 configured to be located in the plurality of slots 12. A guide channel 574 is defined between two adjacent tongues 572 for steadily directing the airflow to remove heat from the memories 20.

Referring to FIG. 2, the air conducting device 50 is mounted on the motherboard 10 to dissipate heat from two memories 20 and two CPUs 14. Each tongue 572 is positioned corresponding to the location of each slot 12. As an example, two slots 12 here are not allocated with memories 20. Airflow 100 moves into the airflow passageway. Part of the airflow travels through the guide channel 574 in the first passageway 57, such that the airflow is regularly directed by the tongues 572 regardless of the number of unused memories 20. When one or more memories 20 is added or removed, heat dissipation efficiency in the first passageway 57 remains unaffected. The other part of the airflow through the second passageway 58 dissipates heat from the CPUs 14. Accordingly, the air conducting device experiences steady heat dissipation efficiency, with no affect from the number of components deployed or the individual operating temperatures thereof.

It is to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of preferred embodiments, together with details of the structures and functions of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. An air conducting device comprising:

a body defining an airflow passageway therein;

a baffle extending from the body to divide the airflow passageway into a first passageway and a second passageway, the first passageway being capable of receiving at least one first heat generating component therein, and the second passageway being capable of receiving at least one second heat generating component therein, the first heat generating component located in one of a plurality a slots; and

a plurality of tongues located in the first passageway, each tongue corresponding to the location of the plurality of slots, and a guide channel being defined between every two adjacent tongues.

2. The air conducting device of claim 1, wherein the tongues extend perpendicularly from the body.

3. The air conducting device of claim 1, wherein the body comprises a top wall and two parallel sidewalls extending down from the top wall, wherein the baffle is parallel to the sidewalls.

4. The air conducting device of claim 1, wherein the tongues have a width that is greater than the first heating components configured to be located in the plurality of slots.

5. The air conducting device of claim 1, wherein each tongue is rectangular.

6. An air conducting assembly comprising:

a motherboard defining a plurality of slots capable of receiving at least one first heat generating component;

a body defining an airflow passageway therein; and

a plurality of tongues extending in the passageway toward a top surface of each slot, each tongue being placed adjacent to one end of each slot, and a guide channel defined between every two adjacent tongues.

7. The air conducting assembly of claim 6, wherein the tongues extend perpendicularly from the body.

8. The air conducting assembly of claim 6, wherein the body comprises a top wall and two parallel sidewalls extending down from the top wall, wherein the baffle is parallel to the sidewalls.

9. The air conducting assembly of claim 6, wherein the tongues have a width that is greater than the first heating component configured to be located in the slot.

10. The air conducting assembly of claim 6, wherein each tongue is rectangular.