REFRIGERATION APPARATUS

The whole of a refrigerant circuit in which a refrigeration cycle is performed is accommodated in a casing. A heat medium circuit is provided, which is connected to the refrigerant circuit through a utilization-side heat exchanger, and which supplies a heat medium exchanging heat with refrigerant in the heat exchanger, to a predetermined heat utilization target. As the refrigerant of the refrigerant circuit, refrigerant which is represented by a molecular formula C3HmFn (note that “m” and “n” are integers equal to or greater than 1 and equal to or less than 5, and a relationship represented by an expression m+n=6 is satisfied), and which has a single double bond in a molecular structure, or refrigerant mixture containing such refrigerant is used.

Skip to: Description  ·  Claims  · Patent History  ·  Patent History
Description
TECHNICAL FIELD

The present invention relates to a refrigeration apparatus including a refrigerant circuit in which a refrigeration cycle is performed.

BACKGROUND ART

Conventionally, a refrigeration apparatus including a refrigerant circuit in which a refrigeration cycle is performed has been broadly applied to air conditioners, hot-water supply systems, etc.

Patent Document 1 discloses the refrigeration apparatus of this type. The refrigeration apparatus includes a refrigerant circuit which is a closed circuit filled with refrigerant. A compressor, a condenser, an expansion valve, and an evaporator are connected to the refrigerant circuit. When operating the compressor, refrigerant compressed in the compressor is condensed by releasing heat to air in the condenser. The pressure of the refrigerant condensed in the condenser is reduced by the expansion valve, and then such refrigerant is evaporated in the evaporator. The evaporated refrigerant is sucked into the compressor to be compressed again.

In the refrigerant circuit of Patent Document 1, refrigerant is used, which is represented by a molecular formula C3HmFn (note that “m” and “n” are integers equal to or greater than 1 and equal to or less than 5, and a relationship represented by an expression m+n=6 is satisfied); and which has a single double bond in a molecular structure. The refrigerant has excellent properties as refrigerant of the refrigeration cycle, and a coefficient of performance (COP) of the refrigeration apparatus has been improved. In addition, it has been known that the refrigerant does not contain chlorine atoms, bromine atoms, etc., and does not contribute to destruction of the ozone layer. Further, Patent Document 1 discloses refrigerant mixture (zeotropic refrigerant mixture) of the refrigerant which is represented by the above-described molecular formula, and which has the single double bond in the molecular structure, and other refrigerant (R-22, R-32, etc.).

CITATION LIST Patent Document

PATENT DOCUMENT 1: Japanese Patent Application No. 04-110388

SUMMARY OF THE INVENTION Technical Problem

As described above, the refrigerant disclosed in Patent Document 1 has properties including the relatively-high theoretical COP and low global warming potential (GWP).

Thus, the refrigerant is used in the refrigeration cycle, thereby providing an environment-friendly refrigeration apparatus with high operational efficiency. However, the refrigerant is so-called “low-pressure refrigerant” with a relatively-high boiling point, and has properties which tend to increase an influence of a pressure loss of refrigerant in a refrigerant pipe. Thus, by using the refrigerant, input etc. of the compressor increase due to the influence of the pressure loss in the refrigerant pipe, and therefore there is a possibility that an actual operational efficiency is rather degraded. In particular, if a refrigerant pipe between the compressor and other heat exchanger is relatively long, the influence of the pressure loss is markedly increased, thereby further degrading the operational efficiency.

The present invention has been made in view of foregoing, and it is an object of the present invention to provide a refrigeration apparatus with high operational efficiency.

Solution to the Problem

A first aspect of the invention is intended for a refrigeration apparatus, and the refrigeration apparatus includes a refrigerant circuit (11) in which a compressor (12), a heat-source-side heat exchanger (13), an expansion mechanism (15), and a utilization-side heat exchanger (14) are connected together, and a refrigeration cycle is performed by circulating refrigerant; and a casing (10a) in which the whole of the refrigerant circuit (11) is accommodated. Refrigerant of the refrigerant circuit (11) is refrigerant which is represented by a molecular formula C3HmFn (note that “m” and “n” are integers equal to or greater than 1 and equal to or less than 5, and a relationship represented by an expression m+n=6 is satisfied), and which has a single double bond in a molecular structure, or refrigerant mixture containing the refrigerant.

In the refrigerant circuit (11) of the first aspect of the invention, the refrigeration cycle is performed by circulating the refrigerant. In such a state, as the refrigerant of the refrigerant circuit (11), the refrigerant (single component refrigerant) which is represented by the molecular formula C3HmFn (note that m=1 to 5, n=1 to 5, and m+n=6), and which has the single double bond in the molecular structure, or the refrigerant mixture containing such refrigerant is used. The refrigerant has a relatively-high theoretical COP, and therefore a refrigeration cycle with a high COP can be performed in the refrigerant circuit (11) of the present invention. Further, the refrigerant has properties including relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing an environment-friendly refrigeration apparatus. On the other hand, the refrigerant is so-called “low-pressure refrigerant,” and therefore is susceptible to an influence of a pressure loss in a refrigerant pipe of the refrigerant circuit (11).

In the present invention, the whole of the refrigerant circuit (11) is accommodated in the casing (10a). This shortens the length of the refrigerant pipe from the compressor (12) to other heat exchanger (the heat-source-side exchanger (13) or the utilization-side heat exchanger (14)) in the casing (10a). Consequently, the influence of the pressure loss in the refrigerant circuit (11) can be minimized, thereby maximizing an actual operational efficiency upon the refrigeration cycle.

A second aspect of the invention is intended for the refrigeration apparatus of the first aspect of the invention, which further includes a heat medium circuit (20, 30, 51) which is connected to the refrigerant circuit (11) through the utilization-side heat exchanger (14), and which supplies a heat medium exchanging heat with refrigerant in the utilization-side heat exchanger (14), to a predetermined heat utilization target (3, 4, 5, 6).

In the second aspect of the invention, the refrigerant circuit (11) is connected to the heat medium circuit (20, 30, 51) through the utilization-side heat exchanger (14). In the refrigerant circuit (11), the refrigeration cycle is performed by circulating the refrigerant.

Consequently, in the utilization-side heat exchanger (14), the refrigerant releases heat to the heat medium of the heat medium circuit (20, 30, 51), or absorbs heat from the heat medium of the heat medium circuit (20, 30, 51). That is, in the utilization-side heat exchanger (14), heat is exchanged between the refrigerant of the refrigerant circuit (11) and the heat medium of the heat medium circuit (20, 30, 51). The heat medium cooled or heated in the utilization-side heat exchanger (14) is supplied to the predetermined heat utilization target (3, 4, 5, 6).

As described above, in the present invention, the refrigerant circuit (11) is provided separately from the heat medium circuit (20, 30, 51), and the heat medium of the heat medium circuit (20, 30, 51) is sent to the predetermined heat utilization target (3, 4, 5, 6). Thus, the length of the pipe of the refrigerant circuit (11) can be shortened while controlling the temperature of the predetermined heat utilization target (3, 4, 5, 6). Consequently, the influence of the pressure loss in the refrigerant circuit (11) can be minimized, thereby further improving the actual operational efficiency upon the refrigeration cycle.

A third aspect of the invention is intended for the refrigeration apparatus of the second aspect of the invention, in which the heat exchanger (14) serves as a heating heat exchanger (14) for heating the heat medium of the heat medium circuit (20, 30, 51) by the refrigerant of the refrigerant circuit (11).

In the heat exchanger (14) of the third aspect of the invention, the heat medium of the heat medium circuit (20, 30, 51) is heated by the refrigerant of the refrigerant circuit (11). The heated heat medium is supplied to the predetermined heat utilization target (3, 4, 5, 6), and then is used for heating the heat utilization target (3, 4, 5, 6).

A fourth aspect of the invention is intended for the refrigeration apparatus of the third aspect of the invention, in which the heat utilization target is a hot-water generator (3, 4) for generating hot water.

In the fourth aspect of the invention, the heat medium heated in the heating heat exchanger (14) is supplied to the hot-water generator (3, 4), and then is used for generating hot water.

A fifth aspect of the invention is intended for the refrigeration apparatus of the third aspect of the invention, in which the heat utilization target is a floor heater (5) for heating a floor surface.

In the fifth aspect of the invention, the heat medium heated in the heating heat exchanger (14) is supplied to the floor heater (5), and then is used for heating the floor surface.

A sixth aspect of the invention is intended for the refrigeration apparatus of the second aspect of the invention, in which the utilization-side heat exchanger serves as a cooling heat exchanger (14) for cooling the heat medium of the heat medium circuit (20, 30, 51) by the refrigerant of the refrigerant circuit (11).

In the sixth aspect of the invention, the heat medium of the heat medium circuit (20, 30, 51) is cooled by the refrigerant of the refrigerant circuit (11). The cooled heat medium is supplied to the predetermined heat utilization target (3, 4, 5, 6), and then is used for cooling the heat utilization target (6).

A seventh aspect of the invention is intended for the refrigeration apparatus of the sixth aspect of the invention, in which the heat utilization target is a cooler (6) for generating cold heat.

In the seventh aspect of the invention, the heat medium cooled in the cooling heat exchanger (14) is supplied to the cooler (6), and then is used for, e.g., cooling a room or refrigerating/cooling an inside of a container.

An eighth aspect of the invention is intended for the refrigeration apparatus of any one of the second to seventh aspects of the invention, in which the heat medium circuit (20, 30, 51) circulates water which is a heat medium.

In the utilization-side heat exchanger (14) of the eighth aspect of the invention, the water of the heat medium circuit (20, 30, 51) is heated or cooled by the refrigerant of the refrigerant circuit (11). The water heated or cooled in the heat exchanger (14) is supplied to the predetermined heat utilization target (3, 4, 5, 6).

A ninth aspect of the invention is intended for the refrigeration apparatus of any one of the first to eighth aspects of the invention, in which the refrigerant which is represented by the molecular formula C3HmFn (note that “m” and “n” are integers equal to or greater than 1 and equal to or less than 5, and the relationship represented by the expression m+n=6 is satisfied), and which has the single double bond in the molecular structure is 2,3,3,3-tetrafluoro-1-propene.

In the ninth aspect of the invention, the refrigerant (single component refrigerant) containing 2,3,3,3-tetrafluoro-1-propene or the refrigerant mixture containing such refrigerant is used as the refrigerant of the refrigerant circuit (11). The refrigerant has the relatively-high theoretical COP, thereby improving the theoretical COP in the refrigerant circuit (11). Further, the refrigerant has the properties including the relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing the environment-friendly refrigeration apparatus. On the other hand, 2,3,3,3-tetrafluoro-1-propene is low-pressure refrigerant, and is susceptible to the influence of the pressure loss. However, in the present invention, the whole of the refrigerant circuit (11) is accommodated in the casing (10a), thereby shortening the length of the refrigerant pipe. Consequently, as in the first aspect of the invention, the actual operational efficiency upon the refrigeration cycle can be maximized.

A tenth aspect of the invention is intended for the refrigeration apparatus of any one of the first to ninth aspects of the invention, in which the refrigerant of the refrigerant circuit (11) is refrigerant mixture further containing difluoromethane.

In the tenth aspect of the invention, the refrigerant mixture containing the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure, and difluoromethane is used as the refrigerant of the refrigerant circuit (11). In such a state, difluoromethane is so-called “high-pressure refrigerant.” Thus, difluoromethane is added to the refrigerant represented by the above-described molecular formula, thereby reducing the influence of the pressure loss of the refrigerant on the operational efficiency of the refrigeration apparatus. Consequently, the actual operational efficiency upon the refrigeration cycle can be enhanced.

An eleventh aspect of the invention is intended for the refrigeration apparatus of any one of the first to tenth aspects of the invention, in which the refrigerant of the refrigerant circuit (11) is refrigerant mixture further containing pentafluoroethane.

In the eleventh aspect of the invention, the refrigerant mixture containing the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure, and pentafluoroethane is used as the refrigerant of the refrigerant circuit (11). The refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure is low flammable refrigerant, but there is no possibility that such refrigerant does not catch fire. Thus, in the present invention, pentafluoroethane which is non-flammable refrigerant is added to the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure.

ADVANTAGES OF THE INVENTION

In the present invention, the refrigerant which is represented by the molecular formula C3HmFn (note that m=1 to 5, n=1 to 5, and m+n=6), and which has the single double bond in the molecular structure, or the refrigerant mixture containing such refrigerant is used as the refrigerant of the refrigerant circuit (11). The refrigerant has the relatively-high theoretical COP, and therefore the theoretical COP of the refrigerant circuit (11) increases. Thus, energy conservation of the refrigeration apparatus can be improved. Further, the refrigerant has the properties including the relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing the environment-friendly refrigeration apparatus.

In addition, in the present invention, the whole of the refrigerant circuit (11) is accommodated in the casing (10a). This shortens the length of the refrigerant pipe of the refrigerant circuit (11), thereby minimizing the influence of the pressure loss. Consequently, in the refrigeration apparatus of the present invention, the actual operational efficiency can be enhanced, thereby further improving the energy conservation of the refrigeration apparatus.

In the second aspect of the invention, the refrigerant circuit (11) is provided separately from the heat medium circuit (20, 30, 51), thereby further shortening the length of the pipe of the refrigerant circuit (11). Consequently, the influence of the pressure loss can be further minimized, thereby further enhancing the actual operational efficiency. In addition, the length of the pipe of the refrigerant circuit (11) is shortened, thereby reducing the size of the casing (10a) in which the refrigerant circuit (11) is accommodated.

According to the third to fifth aspects of the invention, the refrigeration apparatus with the high COP can heat the predetermined heat utilization target (the hot-water generators (3, 4) or the floor heater (5)). In addition, according to the sixth or seventh aspect of the invention, the refrigeration apparatus with the high COP can cool the predetermined heat utilization target (the cooler (6)). Further, according to the eighth aspect of the invention, the water which is the heat medium circulates in the heat medium circuit (20, 30, 51), thereby providing the heat medium circuit (20, 30, 51) at relatively low cost.

In the ninth aspect of the invention, the refrigerant containing 2,3,3,3-tetrafluoro-1-propene or the refrigerant mixture containing such refrigerant is used as the refrigerant of the refrigerant circuit (11), thereby providing the refrigeration apparatus with the high COP. Further, the refrigerant has the properties including the relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing the environment-friendly refrigeration apparatus.

In the tenth aspect of the invention, difluoromethane which is the so-called “high-pressure refrigerant” is added to the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure. This reduces the influence of the pressure loss of the refrigerant on the operational efficiency of the refrigeration apparatus, thereby improving the actual operational efficiency of the refrigeration apparatus.

In the eleventh aspect of the invention, pentafluoroethane which is the non-flammable refrigerant is added to the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure. Thus, the refrigerant of the refrigerant circuit (11) becomes flame-resistant, thereby improving safety of the refrigeration apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic configuration diagram of a refrigeration apparatus of a first embodiment.

FIG. 2 is a schematic configuration diagram of a refrigeration apparatus of a second embodiment.

FIG. 3 is a schematic configuration diagram of a refrigeration apparatus of a third embodiment.

 DESCRIPTION OF REFERENCE CHARACTERS

  • 3 Faucet (Heat Utilization Target, Hot-Water Generator)
  • 4 Bathtub (Heat Utilization Target, Hot-Water Generator)
  • 5 Floor Heater (Heat Utilization Target)
  • 6 Air Conditioning Unit (Heat Utilization Target, Cooler)
  • 10 Hot-Water Supply System (Refrigeration Apparatus)
  • 10a Casing
  • 11 Refrigerant Circuit
  • 12 Compressor
  • 13 Air-Heat Exchanger (Heat-Source-Side Heat Exchanger)
  • 14 Water-Heat Exchanger (Utilization-Side Heat Exchanger, Water-Heat Exchanger)
  • 15 Expansion Valve (Expansion Mechanism)
  • 20 Circulation Circuit (Heat Medium Circuit)
  • 30 Hot-Water Utilization Circuit (Heat Medium Circuit)
  • 51 Air-Conditioning-Side Circuit (Heat Medium Circuit)

DESCRIPTION OF EMBODIMENTS

Embodiments of the present invention will be described in detail hereinafter with reference to the drawings.

First Embodiment

A first embodiment of the present invention will be described. In the first embodiment, a refrigeration apparatus of the present invention serves as a hot-water supply system (10) in which hot-water generators such as a faucet (3) and a bathtub (4) are heat utilization targets. As illustrated in FIG. 1, the hot-water supply system (10) includes a refrigerant circuit (11); a circulation circuit (20); and a hot-water utilization circuit (30). The refrigerant circuit (11) is connected to the circulation circuit (20) through a water-heat exchanger (14). The circulation circuit (20) is connected to the hot-water utilization circuit (30) through a hot-water storage tank (25). The circulation circuit (20) and the hot-water utilization circuit (30) serve as a heat medium circuit for supplying hot-water to the heat utilization targets (3, 4) as a heat medium.

The refrigerant circuit (11) is a closed circuit in which a refrigeration cycle is performed by circulating refrigerant. The refrigerant circuit (11) includes a compressor (12); an air-heat exchanger (13); the water-heat exchanger (14); and an expansion valve (15). The air-heat exchanger (13) is connected to a suction side of the compressor (12), and the water-heat exchanger (14) is connected to a discharge side of the compressor (12). The expansion valve (15) is connected between the air-heat exchanger (13) and the water-heat exchanger (14).

The compressor (12) is an inverter compressor with variable operational capacity. The air-heat exchanger (13) is a cross-fin type fin-and-tube heat exchanger, and serves as a heat-source-side heat exchanger. An outdoor fan (16) is provided near the air-heat exchanger (13). The expansion valve (15) is an electric expansion valve with variable opening, and serves as an expansion mechanism.

The water-heat exchanger (14) is a plate-fin type heat exchanger, and serves as a utilization-side heat exchanger. The water-heat exchanger (14) includes a first flow path (14a) and a second flow path (14b). The first flow path (14a) is connected to the refrigerant circuit (11), and the second flow path (14b) is connected to the circulation circuit (20). That is, the circulation circuit (20) is connected to the refrigerant circuit (11) through the water-heat exchanger (14). In the water-heat exchanger (14), heat is exchanged between refrigerant flowing in the first flow path (14a) and water (heat medium) flowing in the second flow path (14b). That is, the water-heat exchanger (14) serves as a heating heat exchanger for heating water of the circulation circuit (20) by refrigerant of the refrigerant circuit (11).

A circulation pump (21) is provided in the circulation circuit (20). The circulation pump (21) serves as a pump mechanism for transferring and circulating water in the circulation circuit (20). In addition, the hot-water storage tank (25) is connected to the circulation circuit (20). The hot-water storage tank (25) is an elongated cylindrical hermetic container. A water supply port (26), a hot-water outlet port (27), a water discharge port (28), and a hot-water inlet port (29) are formed in the hot-water storage tank (25). The water supply port (26) and the water discharge port (28) are formed in a bottom section of the hot-water storage tank (25). The hot-water outlet port (27) is formed in a top section of the hot-water storage tank (25). The hot-water inlet port (29) is formed in a section closer to an upper portion of a side wall of the hot-water storage tank (25). One end of the circulation circuit (20) is connected to the hot-water inlet port (29) of the hot-water storage tank (25), and the other end is connected to the water discharge port (28) of the hot-water storage tank (25). That is, in the circulation circuit (20), water (hot water) heated in the water-heat exchanger (14) flows into the hot-water storage tank (25) through the hot-water inlet port (29), and water in the bottom section of the hot-water storage tank (25) is sucked into the circulation pump (21) through the water discharge port (28).

A water supply path (31) and a hot-water supply path (32) are formed in the hot-water utilization circuit (30). An upstream side of the water supply path (31) is connected to supply sources of water such as tap water. An outflow end of the water supply path (31) is connected to the water supply port (26) of the hot-water storage tank (25). An inflow end of the hot-water supply path (32) is connected to the hot-water outlet port (27) of the hot-water storage tank (25). An outflow side of the hot-water supply path (32) branches into two paths, and such branched paths are connected to a faucet-side flow path (33) and a bathtub-side flow path (34). An outflow end of the faucet-side flow path (33) is connected to the faucet (3), and an outflow end of the bathtub-side flow path (34) opens to an inside of the bathtub (4).

A first bypass path (35) and a second bypass path (36) are formed in the hot-water utilization circuit (30). Inflow ends of the first bypass path (35) and the second bypass path (36) are connected to the water supply path (31). An outflow end of the first bypass path (35) is connected to the faucet-side flow path (33) through a first mixing valve (37), and an outflow end of the second bypass path (36) is connected to the bathtub-side flow path (34) through a second mixing valve (38).

In the refrigeration apparatus (10), the whole of the refrigerant circuit (11) is accommodated in a casing (10a) of a heat source unit. In addition, in the refrigeration apparatus (10), the whole of the hot-water utilization circuit (30), the hot-water storage tank (25), the circulation pump (21), etc. is accommodated in a casing (10b) of a hot-water supply unit.

The refrigerant circuit (11) of the present embodiment is filled with single component refrigerant containing HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) as refrigerant. A chemical formula of the HFO-1234yf is represented by an expression CF3—CF═CH2.

Operation

An operation of the hot-water supply system (10) will be described. When operating the hot-water supply system (10), the compressor (12) and the circulation pump (21) are in operation. Consequently, in the refrigerant circuit (11), a vapor compression refrigeration cycle is performed by circulating refrigerant.

In the refrigerant circuit (11), refrigerant compressed in the compressor (12) flows in the first flow path (14a) of the water-heat exchanger (14). In the water-heat exchanger (14), the refrigerant is cooled and condensed by water of the circulation circuit (20). The pressure of the refrigerant condensed in the water-heat exchanger (14) is reduced by the expansion valve (15), and then such refrigerant flows into the air-heat exchanger (13). In the air-heat exchanger (13), the refrigerant is evaporated by absorbing heat from outdoor air. The refrigerant evaporated in the air-heat exchanger (13) is sucked into the compressor (12) to be compressed again. As described above, in the refrigerant circuit (11), a refrigeration cycle is performed, in which the water-heat exchanger (14) serves as a condenser (radiator), and the air-heat exchanger (13) serves as an evaporator.

On the other hand, in the circulation circuit (20), water transferred by the circulation pump (21) flows in the second flow path (14b) of the water-heat exchanger (14). In the water-heat exchanger (14), the water flowing in the second flow path (14b) is heated by refrigerant flowing in the first flow path (14a). The hot-water storage tank (25) is refilled with the water (hot water) heated in the water-heat exchanger (14). This generates hot water in the hot-water storage tank (25). The hot water in the hot-water storage tank (25) is supplied to the faucet (3) and the bathtub (4) through the hot-water utilization circuit (30).

Advantages of First Embodiment

In the present embodiment, as the refrigerant of the refrigerant circuit (11), the single component refrigerant containing the HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is used. The HFO-1234yf has properties including a relatively-high theoretical COP. Thus, such refrigerant is used as the single component refrigerant, thereby performing a refrigeration cycle with excellent operational efficiency. Consequently, an operational efficiency of the hot-water supply system (10) can be improved. Further, the HFO-1234yf has properties including relatively-lower global warming potential (GWP) as compared to that of R410A which is current mainly-used refrigerant, thereby providing an environment-friendly refrigeration apparatus.

On the other hand, the HFO-1234yf has a relatively-high boiling point, and serves as so-called “low-pressure refrigerant.” Thus, such refrigerant is used as the single component refrigerant, resulting in an increase in input etc. of the compressor (12) due to an influence of a pressure loss of refrigerant. Consequently, there is a possibility that an actual operational efficiency is rather degraded. However, in the first embodiment, the whole of the refrigerant circuit (11) is accommodated in the casing (10a). This shortens the length of the pipe of the refrigerant circuit (11). Further, in the first embodiment, the circulation circuit (20) and the hot-water utilization circuit (30) are provided separately from the refrigerant circuit (11) to supply water heated in the water-heat exchanger (14) to the heat utilization targets (the faucet (3) and the bathtub (4)). Thus, the length of the refrigerant pipe of the refrigerant circuit (11) can be requisite minimum. Consequently, in the first embodiment, the influence of the pressure loss of refrigerant in the refrigerant circuit (11) can be minimized, thereby preventing the degradation of the actual operational efficiency due to the influence of the pressure loss in the refrigerant circuit (11).

Second Embodiment

A second embodiment will be described. In the second embodiment, the refrigeration apparatus of the present invention serves as a floor heating system (40) in which a floor heater (5) is a heat utilization target. As illustrated in FIG. 2, the floor heating system (40) includes a refrigerant circuit (11) and a circulation circuit (20) which are similar to those in the first embodiment. In addition, the floor heating system (40) includes a hot-water utilization circuit (30) which is a closed circuit in which hot-water circulates, and the circulation circuit (20) and the hot-water utilization circuit (30) serve as a heat medium circuit.

In the second embodiment, the hot-water utilization circuit (30) includes the floor heater (5) and a circulation pump (41). The circulation pump (41) is provided on an upstream side of the floor heater (5). In addition, the floor heater (5) is installed below a floor of a room, and heats the floor by hot water. Further, the whole of the refrigerant circuit (11) is accommodated in a casing (10a) of a heat source unit.

In the refrigerant circuit (11) of the second embodiment, single component refrigerant containing HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is used as in the first embodiment. In addition, in the circulation circuit (20) and the hot-water utilization circuit (30), water is used as a heat medium.

Operation

When operating the floor heating system (40) of the second embodiment, a compressor (12), and two circulation pumps (21, 41) are in operation. In the refrigerant circuit (11), a refrigeration cycle similar to that of the first embodiment is performed. In the circulation circuit (20), a hot-water storage tank (25) is refilled with water heated in a water-heat exchanger (14) as necessary. The hot water drawn from the hot-water storage tank (25) into the hot-water utilization circuit (30) flows in a heat exchange section (5a) of the floor heater (5). In the heat exchange section (5a), heat of the hot water is released to a floor surface. Consequently, the floor surface is heated to heat the room.

Advantages of Second Embodiment

In the second embodiment, the single component refrigerant containing the HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is also used as the refrigerant of the refrigerant circuit (11), thereby providing the floor heating system (40) with a high COP. In addition, the whole of the refrigerant circuit (11) is accommodated in the casing (10a), and the refrigerant circuit (11) is separated from the heat medium circuits (20, 30), thereby allowing the requisite minimum length of the pipe of the refrigerant circuit (11). Thus, in the second embodiment, the influence of the pressure loss in the refrigerant pipe can be also minimized, thereby improving an actual operational efficiency of the floor heating system (40).

Third Embodiment

A third embodiment will be described. In the third embodiment, the refrigeration apparatus of the present invention serves as a so-called “heat-pump/chiller type” air conditioning system (50) in which a plurality of air conditioning units (6) are heat utilization targets.

As illustrated in FIG. 3, a refrigerant circuit (11) of the third embodiment includes a four-way switching valve (17). The four-way switching valve (17) has first to fourth ports. The first port is connected to a discharge side of a compressor (12); the second port is connected to a suction side of the compressor (12); the third port is connected to one end of an air-heat exchanger (13); and the fourth port is connected to one end of a water-heat exchanger (14). The four-way switching valve (17) is switchable between a state in which the first port communicates with the fourth port with the second port communicating with the third port (state indicated by a solid line in FIG. 3), and a state in which the first port communicates with the third port with the second port communicating with the fourth port (state indicated by a dashed line in FIG. 3).

The air conditioning system (50) includes an air-conditioning-side circuit (51). The air-conditioning-side circuit (51) is connected to a second flow path (14b) of the water-heat exchanger (14), and serves as a heat medium circuit. In the air-conditioning-side circuit (51), the plurality of air conditioning units (6) are connected in parallel. The air conditioning units (6) are installed in a ceiling etc. of a room of a building etc. The air conditioning unit (6) serves as a fan coil unit including an indoor heat exchanger and an indoor fan. Further, the whole of the refrigerant circuit (11) is accommodated in a casing (10a) of a heat source unit.

In the refrigerant circuit (11) of the third embodiment, single component refrigerant containing HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is used as in the foregoing embodiments. In addition, in the air-conditioning-side circuit (51), water is used as a heat medium.

Operation

In the air conditioning system (50), each of the air conditioning units (6) switches between a cooling operation and a heating operation.

In the cooling operation, the four-way switching valve (17) of the refrigerant circuit (11) is in the state indicated by the dashed line in FIG. 3. Consequently, in the refrigerant circuit (11), a refrigeration cycle is performed, in which the air-heat exchanger (13) serves as a condenser (radiator), and the water-heat exchanger (14) serves as an evaporator. That is, in the air-conditioning-side circuit (51), water flowing in the second flow path (14b) of the water-heat exchanger (14) is cooled by refrigerant flowing in a first flow path (14a). The water cooled in the water-heat exchanger (14) is sent to each of the air conditioning units (6). In the air conditioning unit (6), room air is cooled by the water. As described above, in the cooling operation, the water-heat exchanger (14) serves as a cooling heat exchanger for cooling water of the air-conditioning-side circuit (51). In addition, the air conditioning unit (6) serves as a cooler for cooling room air.

In the heating operation, the four-way switching valve (17) of the refrigerant circuit (11) is in the state indicated by the solid line in FIG. 3. Consequently, in the refrigerant circuit (11), a refrigeration cycle is performed, in which the water-heat exchanger (14) serves as the condenser (radiator), and the air-heat exchanger (13) serves as the evaporator. That is, in the air-conditioning-side circuit (51), water flowing in the second flow path (14b) of the water-heat exchanger (14) is heated by refrigerant flowing in the first flow path (14a). The water heated in the air-heat exchanger (13) is sent to each of the air conditioning units (6). In the air conditioning unit (6), room air is heated by the water. As described above, in the heating operation, the water-heat exchanger (14) serves as a heating heat exchanger for heating water of the air-conditioning-side circuit (51). In addition, the air conditioning unit (6) serves as a heater for heating room air.

Advantages of Third Embodiment

In the third embodiment, the single component refrigerant containing the HFO-1234yf (2,3,3,3-tetrafluoro-1-propene) is also used as the refrigerant of the refrigerant circuit (11), thereby providing the air conditioning system (50) with a high COP. In addition, the whole of the refrigerant circuit (11) is accommodated in the casing (10a), and the refrigerant circuit (11) is separated from the heat medium circuits (20, 30, 51), thereby minimizing an influence of a pressure loss in the refrigerant circuit (11). Consequently, an actual operational efficiency of the floor heating system (40) can be improved.

Other Embodiments

The foregoing embodiments may have the following configurations.

In the foregoing embodiments, as the refrigerant of the refrigerant circuit (11), single component refrigerant may be used, which is refrigerant represented by the above-described molecular formula and having a single double bond in a molecular structure other than the HFO-1234yf. Specifically, refrigerant includes, e.g., 1,2,3,3,3-pentafluoro-1-propene (referred to as “HFO-1225ye,” and a chemical formula thereof is represented by an expression CF3—CF═CHF); 1,3,3,3-tetrafluoro-1-propene (referred to as “HFO-1234ze,” and a chemical formula thereof is represented by an expression CF3—CH═CHF); 1,2,3,3-tetrafluoro-1-propene (referred to as “HFO-1234ye,” and a chemical formula thereof is represented by an expression CHF2—CF═CHF); 3,3,3-trifluoro-1-propene (referred to as “HFO-1243zf,” and a chemical formula thereof is represented by an expression CF3—CH═CH2); 1,2,2-trifluoro-1-propene (a chemical formula thereof is represented by an expression CH3—CF═CF2); and 2-fluoro-1-propene (a chemical formula thereof is represented by an expression CH3—CF═CH2).

In the foregoing embodiments, refrigerants other than HFC-32 may be used as refrigerant to be mixed with the refrigerant represented by the above-described molecular formula and having the single double bond in the molecular structure. Specifically, the mixed refrigerant is made by using at least one of HFC-32 (difluoromethane); HFC-125 (pentafluoroethane); HFC-134 (1,1,2,2-tetrafluoroethane); HFC-134a (1,1,1,2-tetrafluoroethane); HFC-143a (1,1,1-trifluoroethane); HFC-152a (1,1-difluoroethane); HFC-161 (fluoroethane); HFC-227ea (1,1,1,2,3,3,3-heptafluoropropane); HFC-236ea (1,1,1,2,3,3-hexafluoropropane); HFC-236fa (1,1,1,3,3,3-hexafluoropropane); HFC-365mfc (1,1,1,3,3-pentafluorobutane); methane; ethane; propane; propene; butane; isobutane; pentane; 2-methylbutane; cyclopentane; dimethyl ether; bis-trifluoromethyl-sulfide; carbon dioxide; and helium.

When using refrigerant mixture of, e.g., the HFO-1234yf and the HFC-32, a mixing ratio may be as follows. That is, for the refrigerant mixture of the HFO-1234yf and the HFC-32, the proportion of the HFO-1234yf may be equal to or greater than 70% by mass and equal to or less than 94% by mass, and the proportion of the HFC-32 may be equal to or greater than 6% by mass and equal to or less than 30% by mass. The proportion of the HFO-1234yf may be preferably equal to or greater than 77% by mass and equal to or less than 87% by mass, and the proportion of the HFC-32 may be preferably equal to or greater than 13% by mass and equal to or less than 23% by mass. More preferably, the proportion of the HFO-1234yf may be equal to or greater than 77% by mass and equal to or less than 79% by mass, and the proportion of the HFC-32 may be equal to or greater than 21% by mass and equal to or less than 23% by mass. More preferably, the proportion of the HFO-1234yf may be 78.2% by mass, and the proportion of the HFC-32 may be 21.8% by mass.

Refrigerant mixture of the HFO-1234yf and the HFC-125 may be used. In such a case, the proportion of the HFC-125 may be equal to or greater than 10% by mass, and more preferably equal to or greater than 10% by mass and equal to or less than 20% by mass.

Refrigerant mixture of the HFO-1234yf, the HFC-32, and the HFC-125 may be used. In such a case, the refrigerant mixture containing the HFO-1234yf of 52% by mass, the HFC-32 of 23% by mass, and the HFC-125 of 25% by mass.

The refrigeration apparatus of the present invention may be applied to other systems other than the hot-water supply system (10), the floor heating system (40), and the air conditioning system (50). Specifically, the present invention may be applied to, e.g., a window-type air conditioner in which the whole of a refrigerant circuit (11) is accommodated in a casing; and a roof-trap-type or central air conditioner in which cold/warm air is transferred through a duct. In addition, the present invention may be applied to a freezing/refrigeration apparatus (in particular, a refrigeration apparatus for cooling a refrigerator or an inside of a container for marine transportation etc.) in which the whole of a refrigerant circuit (11) is accommodated in a casing. Further, the present invention may be applied to a snow melting system for melting snow by a heat medium, a chiller unit only for cooling, a turbo refrigerator, etc. Air may be used as a heat medium instead of water. In particular, for low-temperature applications such as low-temperature chillers, water mixed with brine or antifreeze solution to lower a freezing point may be used as a heat medium. In addition, the heat source of the refrigerant circuit is air in the embodiments, but such a heat source may be a water heat source or an underground heat source.

The foregoing embodiments have been set forth merely for purposes of preferred examples in nature, and are not intended to limit the scope, applications, and use of the invention.

INDUSTRIAL APPLICABILITY

As described above, the present invention is useful for the refrigeration apparatus which includes the refrigerant circuit in which the refrigeration cycle is performed, and which supplies warm/cold heat to predetermined heat utilization target(s).

Claims

1. A refrigeration apparatus, comprising:

a refrigerant circuit in which a compressor, a heat-source-side heat exchanger, an expansion mechanism, and a utilization-side heat exchanger are connected together, and a refrigeration cycle is performed by circulating refrigerant; and
a casing in which the whole of the refrigerant circuit is accommodated,
wherein refrigerant of the refrigerant circuit is refrigerant which is represented by a molecular formula C3HmFn where “m” and “n” are integers equal to or greater than 1 and equal to or less than 5, and a relationship represented by an expression m+n=6 is satisfied, and which has a single double bond in a molecular structure, or refrigerant mixture containing the refrigerant.

2. The refrigeration apparatus of claim 1, further comprising:

a heat medium circuit which is connected to the refrigerant circuit through the utilization-side heat exchanger, and which supplies a heat medium exchanging heat with refrigerant in the utilization-side heat exchanger, to a predetermined heat utilization target.

3. The refrigeration apparatus of claim 2, wherein

the utilization-side heat exchanger serves as a heating heat exchanger for heating the heat medium of the heat medium circuit by the refrigerant of the refrigerant circuit.

4. The refrigeration apparatus of claim 3, wherein

the heat utilization target is a hot-water generator for generating hot water.

5. The refrigeration apparatus of claim 3, wherein

the heat utilization target is a floor heater for heating a floor surface.

6. The refrigeration apparatus of claim 2, wherein

the utilization-side heat exchanger serves as a cooling heat exchanger for cooling the heat medium of the heat medium circuit by the refrigerant of the refrigerant circuit.

7. The refrigeration apparatus of claim 6, wherein

the heat utilization target is a cooler for generating cold heat.

8. The refrigeration apparatus of any one of claims 2 to 7, wherein

the heat medium circuit circulates water which is a heat medium.

9. The refrigeration apparatus of any one of claims 1 to 7, wherein

the refrigerant which is represented by the molecular formula C3HmFn where “m” and “n” are integers equal to or greater than 1 and equal to or less than 5, and the relationship represented by the expression m+n=6 is satisfied, and which has the single double bond in the molecular structure is 2,3,3,3-tetrafluoro-1-propene.

10. The refrigeration apparatus of claim 9, wherein

the refrigerant of the refrigerant circuit is refrigerant mixture further containing difluoromethane.

11. The refrigeration apparatus of claim 10, wherein

the refrigerant of the refrigerant circuit is refrigerant mixture further containing pentafluoroethane.
Patent History
Publication number: 20100326129
Type: Application
Filed: Feb 24, 2009
Publication Date: Dec 30, 2010
Inventors: Michio Moriwaki (Osaka), Hideki Hara (Osaka), Syuji Furui (Osaka)
Application Number: 12/866,566
Classifications
Current U.S. Class: Compressor-condenser-evaporator Circuit (62/498); Heat Exchange Between Diverse Function Elements (62/513)
International Classification: F25B 1/00 (20060101); F25B 41/00 (20060101);