Method For Atomizing A Surface Of A Substrate

Abstract

A method for atomizing a surface of a substrate includes the steps of: coating a proper quantity of chemical solvent onto the surface of the substrate to react with substrate material of the substrate for a certain time; then rinsing off the remaining chemical solvent on the substrate with water to obtain an atomized surface on the substrate. Therefore, it can achieve a simple process, a high productivity and a low manufacture cost without any effect on properties of the substrate.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a surface treatment technology, and more particularly to a method for atomizing a surface of a substrate.

2. The Related Art

There are different types of surface treatment technologies that are used in order to enhance surfaces of plastic products. Here are two methods for producing the plastic product with atomized surfaces. One conventional method is executed by means of regulating process temperature and molds during molding the plastic product to form the atomized surfaces on the plastic product. However, it results in a complicated process and a low productivity. Another conventional method is executed by means of incorporating atomizing agents into plastic materials during manufacturing processes to finally achieve the plastic product with the atomized surfaces. However, an excess quantity of atomizing agents is apt to be embedded in the plastic product without any benefit, thus resulting in materials waste and increasing manufacture cost. Furthermore, the atomizing agents may be educed under special conditions to cause product deterioration.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method for atomizing a surface of a substrate. The method includes the steps of: coating a proper quantity of chemical solvent onto the surface of the substrate to react with substrate material of the substrate for a certain time; then rinsing off the remaining chemical solvent on the substrate with water to obtain an atomized surface on the substrate. Therefore, it can achieve a simple process, a high productivity and a low manufacture cost without any effect on properties of the substrate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

A method for atomizing a surface of a substrate according to the present invention is executed by means of a proper quantity of chemical solvents being selected as reactants to react with substrate materials on the surface of the substrate according to a chemical compatibility reaction or a chemical corrosion reaction.

The method for atomizing the surface of the substrate based on the chemical compatibility reaction is described hereinafter. Firstly, a proper quantity of chemical solvents with acid-ester groups is coated onto the surface of the substrate by means of spraying or dipping to react with substrate materials with acid-ester groups on the surface of the substrate for 5-120 seconds. Then rinse off the remaining chemical solvents on the substrate with water so as to form an atomized surface on the substrate. The substrate material of the substrate with the acid-ester groups may be any one of or a mixture of at least two selected from ethylene-ethyl acrylate, polyurethane, ethylene vinyl acetate, poly butylene terephthalate resin and polymethyl methacrylate. The chemical solvent with the acid-ester groups may be any one of or a mixture of at least two selected from methyl formate, ethyl formate, methyl acetate, ethyl acetate, methyl propionate, ethyl propionate and propyl propionate. Furthermore, a proper ratio of the substrate material to the chemical solvent must be prepared in order to achieve the atomized surface on the substrate in a short time.

The method for atomizing the surface of the substrate based on the chemical corrosion reaction is described hereinafter. Firstly, a proper quantity of strong acid solvent is coated onto the surface of the substrate by means of spraying or dipping to react with substrate materials on the surface of the substrate for 5-60 seconds. Then rinse the substrate with water so as to form an atomized surface on the substrate. The strong acid solvent may be 5%-20% consistency of hydrochloric acid or 8%-20% consistency of nitric acid etc. The substrate material of the substrate may be any one of or a mixture of at least two selected from polyvinylchloride, polycarbonate, polyphenylene oxide, ethylene-ethyl acrylate, polyurethane, ethylene vinyl acetate, poly butylene terephthalate resin and polymethyl methacrylate.

In the above-mentioned two methods, chemical reaction time is very important to form the atomized surface on the substrate regardless of the chemical compatibility reaction or the chemical corrosion reaction. The reaction time need not be too long, otherwise a basic structure of the substrate material will be undermined to finally cause a damage to the substrate.

One embodiment, namely a method for atomizing the surface of the substrate based on the chemical compatibility reaction, is introduced for describing the above-mentioned corresponding method in detail, wherein the substrate is made of ethylene-ethyl acrylate materials. Firstly, clean the surface of the substrate with ethanol solvents. Then the substrate is dipped in 500 mL 100% concentration of propyl acetate solvent for 25 seconds under a room temperature. Lastly rinse the substrate with water to finally achieve the atomized surface on the substrate.

As described above, the above-mentioned methods according to the present invention can form the atomized surface on the substrate by means of coating corresponding chemical solvents onto the surface of the substrate to react with each other for a certain time and then rinsing the substrate with water. Therefore, it can achieve a simple process, a high productivity and a low manufacture cost without any effect on properties of the substrate.

Claims

1. A method for atomizing a surface of a substrate, comprising the steps of:

coating a proper quantity of chemical solvent onto the surface of the substrate to react with substrate material of the substrate for a certain time; and

rinsing off the remaining chemical solvent on the substrate with water to obtain an atomized surface on the substrate.

2. The method as claimed in claim 1, wherein the chemical solvent and the substrate material react with each other based on a chemical compatibility reaction.

3. The method as claimed in claim 2, wherein the chemical solvent and the substrate material react with each other for 5-120 seconds.

4. The method as claimed in claim 2, wherein the substrate material has the same functional group as the chemical solvent.

5. The method as claimed in claim 4, wherein the functional group is provided with acid-ester group.

6. The method as claimed in claim 5, wherein the substrate material with the acid-ester group is any one of or a mixture of at least two selected from ethylene-ethyl acrylate, polyurethane, ethylene vinyl acetate, poly butylene terephthalate resin and polymethyl methacrylate, the chemical solvent with the acid-ester group is any one of or a mixture of at least two selected from methyl formate, ethyl formate, methyl acetate, ethyl acetate, methyl propionate, ethyl propionate and propyl propionate.

7. The method as claimed in claim 1, wherein the chemical solvent and the substrate material react with each other based on a chemical corrosion reaction.

8. The method as claimed in claim 7, wherein the chemical solvent and the substrate material react with each other for 5-60 seconds.

9. The method as claimed in claim 7, wherein the chemical solvent is provided with strong acid solvent, the substrate material is any one of or a mixture of at least two selected from polyvinylchloride, polycarbonate, polyphenylene oxide, ethylene-ethyl acrylate, polyurethane, ethylene vinyl acetate, poly butylene terephthalate resin and polymethyl methacrylate.

10. The method as claimed in claim 9, wherein the strong acid solvent is 5%-20% consistency of hydrochloric acid or 8%-20% consistency of nitric acid.