HEAT EXCHANGER
A heat exchanger including a first heat sink, a second heat sink and a water-cooling unit. The first heat sink has a first contact section and multiple radiating fins. At least one cooling chip is attached to the first contact section. At least one first fan is disposed on the radiating fins. The second heat sink has multiple radiating fins and a second contact section. A second fan is positioned on the radiating fins and connected thereto. The second contact section is attached to a face of the cooling chip opposite to the first heat sink. The water-cooling unit has a water tank section and a pipe section having a first end and a second end, which are connected to the water tank section. The pipe section is inlaid in the first contact section and the water tank section is disposed on the radiating fins of the second heat sink.
The present invention relates generally to a heat exchanger, and more particularly to a heat exchanger including cooling chips and a water-cooling unit combined with the cooling chips. The water-cooling unit is able to greatly enhance heat dissipation efficiency of the heat exchanger.
BACKGROUND OF THE INVENTIONIt is known that heat is transferred in three manners, that is, conduction, convection and radiation. With respect to the conduction, heat is transferred from a high-temperature place to a low-temperature place via a medium. With respect to the convection, after heated, the density of a fluid such as air or water will change to cause circulation of the fluid. With respect to radiation, heat can be transferred by way of radiation without any medium.
Convection is the most efficient heat transfer manner to a fluid. Traditionally, a heat sink is used to directly contact a heat source and a fan is connected to the heat sink. The fan serves to guide airflow to cool the heat sink by way of forced convection.
The existent heat exchanger is equipped with cooling chips for enhancing heat dissipation efficiency. Each cooling chip has a hot face and a cold face. The cold face is attached to a heat source for cooling the same.
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A primary object of the present invention is to provide a heat exchanger with enhanced heat dissipation efficiency.
To achieve the above and other objects, the heat exchanger of the present invention includes a first heat sink, a second heat sink and a water-cooling unit. The first heat sink has a first contact section and multiple radiating fins. At least one cooling chip is attached to the first contact section. At least one first fan is disposed on the radiating fins. The second heat sink has multiple radiating fins and a second contact section. A second fan is positioned on the radiating fins and connected thereto. The second contact section is attached to a face of the cooling chip opposite to the first heat sink. The water-cooling unit has a water tank section and a pipe section having a first end and a second end, which are connected to the water tank section. The pipe section is inlaid in the first contact section and the water tank section is disposed on the radiating fins of the second heat sink. The water-cooling unit serves to cool the heat exchanger to enhance the cooling effect and heat exchange efficiency of the heat exchanger.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
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The first heat sink 1 has a first contact section 11 and multiple radiating fins 12. At least one cooling chip 4 is attached to the first contact section 11. At least one first fan 5 is disposed on the radiating fins 12. The radiating fins 12 extend from one side of the first contact section 11 in a direction away from the first contact section 11.
The second heat sink 2 has multiple radiating fins 21 and a second contact section 22. A second fan 6 is positioned on upper side of the radiating fins 21 and connected thereto. The second contact section 22 is attached to the other face of the cooling chip 4 opposite to the first heat sink 1. The radiating fins 21 extend from one side of the second contact section 22 in a direction away from the second contact section 22.
The cooling chip 4 has a hot face 41 and a cold face 42. The hot face 41 is attached to the second contact section 22 of the second heat sink 2, while the cold face 42 is attached to the first contact section 11 of the first heat sink 1. The water-cooling unit 3 has a water tank section 31 and a pipe section 32. The pipe section 32 has a first end 321 and a second end 322, which are connected to the water tank section 31. The pipe section 32 is inlaid in the first contact section 11 of the first heat sink 1. The water tank section 31 is disposed on the upper side of the radiating fins 21 of the second heat sink 2.
The water tank section 31 has a chamber 311 and a pump 312 (as shown in
The first contact section 11 of the first heat sink 1 is formed with at least one groove 111 for receiving the pipe section 32 therein. The pipe section 32 contacts the cold face 42 of the cooling chip 4. The pipe section 32 further has a heat absorption portion 323 between the first and second ends 321, 322 of the pipe section 32. The heat absorption section 323 serves to absorb and carry away the heat of the first heat sink 1 to cool the same.
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The second contact section 22 of the second heat sink 2 contacts the hot face 41 of the cooling chip 4. The heat of the hot face 41 is dissipated via the second heat sink 2. The second fan 6 disposed on the second heat sink 2 serves to dissipate the heat of the second heat sink 2 and lower the temperature of the hot face 41 of the cooling chip 4.
The heat absorption portion 323 of the pipe section 32 of the water-cooling unit 3 disposed on the second heat sink 2 extends through the first contact section 11 of the first heat sink 1. The heat dissipation fluid 7 is contained in the pipe section 32. The heat dissipation fluid 7 flows from the first end 321 of the pipe section 32 into the pump 312. Then the heat dissipation fluid 7 is pumped by the pump 312 to flow toward the heat absorption portion 323 of the pipe section 32. Then the heat dissipation fluid 7 flows through the second end 322 of the pipe section 32 back into the water-cooling unit 3. The water-cooling unit 3 serves to cool the first and second heat sinks 1 and 2. In comparison with the conventional device that only employs the cooling chip 4 for dissipating the heat, the present invention has better heat dissipation effect.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Claims
1. A heat exchanger comprising:
- a first heat sink having a first contact section and multiple radiating fins, at least one cooling chip being attached to the first contact section, at least one first fan being disposed on the radiating fins;
- a second heat sink having multiple radiating fins and a second contact section, a second fan being positioned on upper side of the radiating fins and connected thereto, the second contact section being attached to the other face of the cooling chip opposite to the first heat sink; and
- a water-cooling unit having a water tank section and a pipe section, the pipe section having a first end and a second end, which are connected to the water tank section, the pipe section being inlaid in the first contact section of the first heat sink, the water tank section being disposed on the upper side of the radiating fins of the second heat sink.
2. The heat exchanger as claimed in claim 1, wherein the cooling chip has a hot face and a cold face, the hot face being attached to the second contact section of the second heat sink, while the cold face being attached to the first contact section of the first heat sink.
3. The heat exchanger as claimed in claim 1, wherein the water tank section has a chamber and a pump disposed in the chamber, a heat dissipation fluid being contained in the chamber, the pipe section communicating with the chamber, one of the first and second ends of the pipe section being connected to the pump.
4. The heat exchanger as claimed in claim 1, wherein the first contact section of the first heat sink is formed with at least one groove for receiving the pipe section therein, the pipe section contacting with the cooling chip.
5. The heat exchanger as claimed in claim 1, wherein the radiating fins of the first heat sink are disposed on one side of the first heat sink opposite to the first contact section.
6. The heat exchanger as claimed in claim 1, wherein the radiating fins of the second heat sink are disposed on one side of the second heat sink opposite to the second contact section.
7. The heat exchanger as claimed in claim 1, wherein the pipe section further has a heat absorption portion between the first and second ends.
Type: Application
Filed: Feb 5, 2010
Publication Date: Aug 11, 2011
Inventor: Ching-Hsien Tsai (Sinjhuang City)
Application Number: 12/700,894
International Classification: F28D 15/00 (20060101);